Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Texas Instruments DRA788BSGABFRQ1 is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 32 MHz Clock Frequency. Ideal for automotive applications, it operates b/w -40 to 125 °C with AEC-Q100 screening level.
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$64.425
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Native Components
Provides good protection and insulation for the components inside, ensuring durability and reliability.
Allows for easy and efficient installation on circuit boards, saving time and effort.
Provides flexibility in power supply options, accommodating a range of voltage inputs.
Ensures high reliability and quality standards required for automotive applications.
Efficient use of space on a circuit board, allowing for compact and streamlined designs.
Offers a high level of connectivity options for interfacing with other devices or components.
Enables high-density mounting, making it suitable for complex and compact electronic systems.
Allows for operation in low power conditions, optimizing energy efficiency.
Ensures reliable performance even in high-temperature environments or under heavy loads.
Capable of functioning in extremely cold conditions, making it suitable for various applications.
Provides a durable and reliable surface finish for the terminals, enhancing conductivity and longevity.
Facilitates easy and efficient board layout and assembly, improving overall design simplicity.
Allows for a low-profile installation, suitable for applications where space is limited.
Compact size for easy integration into various electronic systems or devices.
Supports high-speed data transfer and processing capabilities, enabling efficient operation.
Provides fast processing speeds for quick and responsive performance.
Ensures proper reflow soldering process for reliable and secure connections during assembly.
Suitable for high-temperature soldering processes, ensuring proper bonding of components.
Compact size for space-saving designs and easy integration in various applications.
Designed to meet the rigorous requirements and standards for automotive applications.
Features advanced integration and processing capabilities, suitable for a wide range of functions.
Utilizes low power consumption and offers high noise immunity, ensuring efficient and reliable performance.
Provides a reliable and secure connection for smooth operation and longevity.
Optimal voltage level for stable and efficient operation across various conditions.
Supports multiple communication protocols, enabling seamless integration with various devices.
Fine pitch for high-density mounting, allowing for compact and efficient designs.
Designed to withstand moderate levels of moisture exposure, ensuring reliability in various environments.
Other Function uPs,uCs & Peripheral ICs DRA788BSGABFRQ1 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments
Bus Compatibility:
Maximum Clock Frequency:
External Data Bus Width:
JESD-30 Code:
JESD-609 Code:
Length:
Moisture Sensitivity Level (MSL):
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Screening Level:
Maximum Seated Height:
Maximum Supply Voltage:
Minimum Supply Voltage:
Nominal Supply Voltage:
Surface Mount:
Technology:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
Peripheral IC Type:
DRA788BSGABFRQ1 Peripheral ICs trade compliance attributes, and parameters.
ECCN
3A991.A.1
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
BSS138-7-F
SPC TECHNOLOGY/ MULTICOMP
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain Current (ID): .2 A; Minimum DS Breakdown Voltage: 50 V; Operating Mode: ENHANCEMENT MODE;
1N4148WT
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Leshan Radio
RECTIFIER DIODE; Surface Mount: YES; Maximum Non Repetitive Peak Forward Current: 2 A; Maximum Reverse Recovery Time: .004 us; No. of Phases: 1; Maximum Operating Temperature: 175 Cel;
2N7002
General Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; JEDEC-95 Code: TO-236AB; Qualification: Not Qualified; Package Style (Meter): SMALL OUTLINE;
North American Philips Discrete Products Div
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Operating Mode: ENHANCEMENT MODE; Maximum Drain Current (ID): .115 A;
BAV99
Vishay Intertechnology
Vishay Intertechnology's BAV99 diode features a max forward voltage of 1.3V and a max output current of 0.15A, making it ideal for rectification applications. With a small outline package style and dual terminal position, this series-connected diode is designed for surface mount usage in various electronic circuits with an operating temperature range from -55°C to 150°C.
LM358MX
Fairchild Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
0460-202-16141
TE Connectivity
TE Connectivity's 0460-202-16141 contact features a crimp terminal type, machined contact design, and rated AC voltage of 1500V. With a wire gauge range of 20-16 AWG, it is ideal for applications requiring a male round pin-socket contact style in assembly products.
BAV99WT1G
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Lite-on Semiconductor
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Qualification: Not Qualified; Additional Features: LOW THRESHOLD; Minimum DS Breakdown Voltage: 60 V;
IRLML6401TRPBF
Infineon Technologies
IRLML6401TRPBF by Infineon is a P-CHANNEL FET for SWITCHING applications. It features a 12V DS Breakdown Voltage, 34A IDM, and 0.05ohm RDS(on). With a small outline package style, it operates in an ambient temperature range of -55 to 150 °C.
CRCW04020000Z0EDHP
Vishay Intertechnology's CRCW04020000Z0EDHP is a 0402 SMT resistor with 0 ohm resistance, rated for temperatures from -55°C to 155°C. Ideal for jumper applications in automotive electronics due to AEC-Q200 compliance and compact size of 1mm x 0.5mm x 0.3mm.
1N4148WS
Tak Cheong Electronics Holdings
EU2B-YS3303C
Idec
ROTARY SWITCH;
1N4148
Iskra Semic Capacitors Industry
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Operating Temperature: 200 Cel; JESD-609 Code: e0; Maximum Non Repetitive Peak Forward Current: 2 A;
LM555CMX
Onsemi
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
87832-1420
Molex
87832-1420 by Molex is a 14-contact board connector with 0.079" pitch, suitable for commercial applications. It features matte tin over nickel finish, glass-filled polyamide insulator, and polarization key for easy assembly. Withstanding voltage of 1400VAC and operating temperature range from -55 to 105°C make it reliable for various electronic devices.
OPA2277UA
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
BSS138-TP
Micro Commercial Components
BSS138-TP by Micro Commercial Components is a N-channel small signal FET with a min DS breakdown voltage of 50V and max drain current of 0.22A. It is commonly used in applications requiring enhancement mode operation, such as power management and switching circuits.
Cheng-yi Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
5100
Auctor
Other uPs/uCs/Peripheral ICs; No. of Terminals: 144; JESD-609 Code: e4; Terminal Finish: SILVER;
ATSHA204A-SSHDA-T
Microchip Technology
ATSHA204A-SSHDA-T by Microchip Technology is a cryptographic authenticator IC with 8 terminals, operating voltage range of 2V to 5.5V, and temperature range from -40°C to 85°C. It comes in a small outline package style suitable for surface mount applications. This CMOS technology device has a moisture sensitivity level of MSL3 and is ideal for secure authentication purposes.
EFR32MG21A020F1024IM32-B
Silicon Labs
EFR32MG21A020F1024IM32-B by Silicon Labs is a 32-terminal, CMOS System on Chip with a supply voltage range of 1.71V to 3.8V. Ideal for automotive applications, it operates b/w -40°C to 125°C and features a compact square package style with matte tin finish for surface mount assembly.
TCI6630K2LCMSA2
Texas Instruments
TCI6630K2LCMSA2 by Texas Instruments is a CMOS microprocessor circuit with 900 terminals in a grid array package. It operates b/w 0.902V to 0.997V and can withstand peak reflow temperature of 245°C for up to 30s. Ideal for high-performance computing applications requiring advanced processing capabilities.
MIMXRT106FCVL5B
NXP Semiconductors
NXP's MIMXRT106FCVL5B is a SoC with CMOS technology, featuring 196 terminals in a low-profile grid array package. Operating b/w -40 to 105 °C, it has a supply voltage range of 1.15-1.26 V and can withstand peak reflow at 260 °C for up to 40 seconds. Ideal for applications requiring high-performance microcontrollers in compact form factors.
CY8C6137BZI-F34
CY8C6137BZI-F34 by Infineon is a 124-terminal, programmable SoC with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 1.7V to 3.6V. With a grid array package style, it's ideal for applications requiring fine pitch and thin profile designs.
CY8CMBR3116-LQXIT
CY8CMBR3116-LQXIT by Infineon is a 24-terminal IC with max supply voltage of 1.89V and operating temp up to 85°C. Ideal for industrial applications, this CMOS technology-based microprocessor circuit features a square package style and no-lead terminal form.
MIMXRT1041XJM5B
SYSTEM ON CHIP;
ATWINC1500-MR210PB
ATWINC1500-MR210PB by Microchip operates at 3-4.2V, with temp range -40 to 85°C. It's a CMOS microprocessor circuit for industrial applications, featuring 28 terminals in a rectangular package style. Ideal for IoT devices requiring low power consumption and reliable wireless connectivity.
CY8C4146LQI-S422
PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Finish: PURE TIN; Moisture Sensitivity Level (MSL): 3;
XC7Z007S-1CLG400C
Xilinx
The Xilinx XC7Z007S-1CLG400C is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05V. Featuring a grid array package style, it's ideal for applications requiring low profile and fine pitch designs in the Other Function uPs,uCs & Peripheral ICs category.
CY8C4025AZI-S413
CY8C4025AZI-S413 by Infineon is a PSoC peripheral IC with CMOS technology. It operates b/w -40 to 85°C, with supply voltage ranging from 1.71V to 1.89V. This quad-terminal IC in a low-profile flatpack package is ideal for industrial applications requiring fine-pitch components.
ATECC608B-MAHCZ-T
Microchip ATECC608B-MAHCZ-T is a cryptographic authenticator IC with 8 terminals, 1-Wire bus compatibility, and CMOS technology. It operates b/w -40 to 85 °C, suitable for industrial applications requiring secure authentication. Package style: Small Outline, Heat Sink/Slug, Very Thin Profile.
XC7Z014S-1CLG400I
XC7Z014S-1CLG400I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 400 terminals in a low profile, fine pitch grid array package, it's ideal for various applications requiring high-performance processing capabilities.
MPFS250T-FCSG536I
MPFS250T-FCSG536I by Microchip: 536 terminals, 1.03V max supply voltage, -40 to 100°C operating temp range. Ideal for applications requiring a low profile, fine pitch grid array package style with programmable SoC technology.
ESP32-S3-WROOM-1-N8R8
Espressif Systems (Shanghai)
ESP32-S3-WROOM-1-N8R8 by Espressif Systems (Shanghai) is a 41-terminal SoC with CMOS technology. It operates b/w -40 to 65 °C and supports supply voltage of 3-3.6 V. Ideal for IoT applications due to its compact MICROELECTRONIC ASSEMBLY package style and surface mount capability.
CY8C21434-24LKXI
Cypress Semiconductor
CY8C21434-24LKXI by Cypress is a 32-terminal IC with max supply voltage of 5.25V and temp range -40 to 85°C. Ideal for industrial applications, it's a CMOS technology-based programmable SoC with no-lead terminals and quad position, suitable for surface mount in compact spaces.
5CSEBA5U19I7N
Intel
SoC;
CY8C21434-24LQXIT
CY8C21434-24LQXIT by Infineon is a 32-terminal, CMOS technology chip with a max supply voltage of 5.25V and operating temp range of -40 to 85°C. Ideal for industrial applications, this programmable SoC has a square shape, no lead terminal form, and very thin profile package style.
ST33HTPH2E28AHD0
STMicroelectronics
ST33HTPH2E28AHD0 by STMicroelectronics is a 28-terminal IC with CMOS technology, operating b/w -40 to 105°C. It's a cryptographic authenticator with 1.8V supply voltage, suitable for secure applications requiring compact design and surface mount compatibility.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
DRA756BPGABCQ1
MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 760; Package Code: FBGA; Package Shape: SQUARE;
DRA751BLGABCRQ1
DRA746APGABCQ1
MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 760; Package Code: BGA; Package Shape: UNSPECIFIED;
DRA755BLGABCRQ1
DRA752BPGABCRQ1
DRA750BJGABCRQ1
DRA756BPGABCRQ1
MICROPROCESSOR CIRCUIT; Peak Reflow Temperature (C): 250; Screening Level: AEC-Q100; Terminal Finish: TIN SILVER COPPER; Technology: CMOS; Moisture Sensitivity Level (MSL): 3;
DRA744BJGABCRQ1
DRA752BPGABCQ1
DRA746BPGABCQ1
DRA755BLGABCQ1
DRA754BJGABCQ1
DRA750BJGABCQ1
DRA756
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 760; Package Code: BGA; Package Shape: SQUARE; Terminal Position: BOTTOM;
DRA745BLGABCRQ1
DRA751BLGABCQ
DRA744BJGABCQ1
DRA745BLGABCQ1
DRA746BPGABCRQ1
DRA754BJGABCRQ1
Supply Digital Components
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