Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Texas Instruments DRA788BSGABFRQ1 is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 32 MHz Clock Frequency. Ideal for automotive applications, it operates b/w -40 to 125 °C with AEC-Q100 screening level.
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$77.698
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Provides good protection and insulation for the components inside, ensuring durability and reliability.
Allows for easy and efficient installation on circuit boards, saving time and effort.
Provides flexibility in power supply options, accommodating a range of voltage inputs.
Ensures high reliability and quality standards required for automotive applications.
Efficient use of space on a circuit board, allowing for compact and streamlined designs.
Offers a high level of connectivity options for interfacing with other devices or components.
Enables high-density mounting, making it suitable for complex and compact electronic systems.
Allows for operation in low power conditions, optimizing energy efficiency.
Ensures reliable performance even in high-temperature environments or under heavy loads.
Capable of functioning in extremely cold conditions, making it suitable for various applications.
Provides a durable and reliable surface finish for the terminals, enhancing conductivity and longevity.
Facilitates easy and efficient board layout and assembly, improving overall design simplicity.
Allows for a low-profile installation, suitable for applications where space is limited.
Compact size for easy integration into various electronic systems or devices.
Supports high-speed data transfer and processing capabilities, enabling efficient operation.
Provides fast processing speeds for quick and responsive performance.
Ensures proper reflow soldering process for reliable and secure connections during assembly.
Suitable for high-temperature soldering processes, ensuring proper bonding of components.
Compact size for space-saving designs and easy integration in various applications.
Designed to meet the rigorous requirements and standards for automotive applications.
Features advanced integration and processing capabilities, suitable for a wide range of functions.
Utilizes low power consumption and offers high noise immunity, ensuring efficient and reliable performance.
Provides a reliable and secure connection for smooth operation and longevity.
Optimal voltage level for stable and efficient operation across various conditions.
Supports multiple communication protocols, enabling seamless integration with various devices.
Fine pitch for high-density mounting, allowing for compact and efficient designs.
Designed to withstand moderate levels of moisture exposure, ensuring reliability in various environments.
Other Function uPs,uCs & Peripheral ICs DRA788BSGABFRQ1 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments
Bus Compatibility:
Maximum Clock Frequency:
External Data Bus Width:
JESD-30 Code:
JESD-609 Code:
Length:
Moisture Sensitivity Level (MSL):
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Screening Level:
Maximum Seated Height:
Maximum Supply Voltage:
Minimum Supply Voltage:
Nominal Supply Voltage:
Surface Mount:
Technology:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
Peripheral IC Type:
DRA788BSGABFRQ1 Peripheral ICs trade compliance attributes, and parameters.
ECCN
3A991.A.1
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
NDT2955
National Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 3 W; JESD-609 Code: e0; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
4554
Jw Miller Magnetics
Other Semiconductors;
LL4148
Taitron Components
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
STM32F405RGT6TR
STMicroelectronics
STM32F405RGT6TR by STMicroelectronics is a 32-bit microcontroller with 64 terminals, operating at a max frequency of 26 MHz. It features DAC and ADC channels, along with DMA support. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.
SMBJ18CA
Changzhou Starsea Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WT
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Operating Mode: ENHANCEMENT MODE; Qualification: Not Qualified;
B340A-13-F
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Compensated Devices
RECTIFIER DIODE; Terminal Position: UPPER; Terminal Form: NO LEAD; No. of Terminals: 1; Surface Mount: YES; Package Shape: SQUARE;
RC0402FR-071KL
Yageo
The Yageo RC0402FR-071KL is a fixed resistor with a resistance of 1000 ohm and a tolerance of 1%. It is suitable for surface mount applications and has a max operating temperature of 155 °C.
ISO1050DUBR
Texas Instruments
ISO1050DUBR by Texas Instruments is a network interface IC with 8 terminals, operating from -55 to 105°C. It features a small outline package, nickel palladium gold finish, and gull wing terminal form. Ideal for telecom applications requiring a 5V supply voltage and peak reflow temperature of 260°C.
1N4148WS
Promax-johnton
USBLC6-2SC6
USBLC6-2SC6 by STMicroelectronics is a unidirectional transient voltage suppressor diode with a breakdown voltage of 6V. It has a max clamping voltage of 17V and operates in temperatures ranging from -40 to 125°C. This device, with dual terminals and matte tin finish, is ideal for protecting sensitive electronics from voltage spikes in various applications.
2N2222A
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BAV99
NXP Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Onsemi
STM32H743ZIT6
STM32H743ZIT6 by STMicroelectronics is a 32-bit microcontroller with integrated cache and a max supply voltage of 3.6V. It is commonly used in industrial applications, offering features such as 21 timers, CAN and USB connectivity, and low power mode.
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; No. of Terminals: 3;
2N7002
Weitron Technology
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Terminal Finish: TIN LEAD; Maximum Operating Temperature: 150 Cel;
LM555CMX
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
STSPIN32F0B
MICROPROCESSOR CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
SLB9665TT20FW563XUMA3
Infineon Technologies
Infineon's SLB9665TT20FW563XUMA3 is a cryptographic authenticator IC with 28 terminals, operating at -20 to 85 °C. It has a supply voltage range of 3-3.6 V and compact dimensions of 4.4mm x 9.7mm, suitable for secure applications requiring high data protection in small form factors.
XC7Z030-3FBG484E
Xilinx
The Xilinx XC7Z030-3FBG484E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. With 484 terminals in a square grid array package, it's ideal for various applications requiring high-performance microprocessors and peripheral ICs.
SCANSTA111MTX/NOPB
SCANSTA111MTX/NOPB by Texas Instruments is a 48-terminal microprocessor circuit with CMOS technology. It operates at 3.3V, suitable for industrial applications with an operating temperature range of -40 to 85°C. This rectangular package IC is surface-mountable and has a max supply voltage of 3.6V, making it ideal for various embedded system designs.
MCIMX536AVV8C
MCIMX536AVV8C by NXP Semiconductors is a SYSTEM ON CHIP with 529 terminals, operating at -40 to 125 °C. It has a supply voltage range of 1.05-1.8/3.3 V and is AEC-Q100 compliant for automotive applications. The package style is GRID ARRAY, FINE PITCH in PLASTIC/EPOXY material, suitable for surface mount assembly.
MCIMX6Y2DVM05AA
MCIMX6Y2DVM05AA by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 289 terminals. Operating b/w 0-95°C, it supports a supply voltage range of 1.275-1.5V. Ideal for applications requiring high-performance computing in compact spaces.
ESP32-C3-MINI-1U-H4
Espressif Systems (Shanghai)
ESP32-C3-MINI-1U-H4 by Espressif Systems (Shanghai) is a 53-terminal SoC with max supply voltage of 3.6V and operating temp range from -40 to 105°C. Ideal for IoT applications due to its compact rectangular package style, CMOS technology, and low nominal voltage of 3.3V.
SCANSTA112SMX
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 100; Package Code: LFBGA; Package Shape: SQUARE;
XC7Z030-1FBG484C
XC7Z030-1FBG484C by Xilinx is a System on Chip with CMOS technology. It operates b/w 0°C to 85°C, with supply voltage ranging from 0.95V to 1.05V. This package has 484 terminals in a square grid array shape, making it suitable for various applications in the field of Other Function uPs,uCs & Peripheral ICs.
AM6252ATCGGAALW
AM6252ATCGGAALW by Texas Instruments is a 425-terminal SoC with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 0.715V to 0.79V. This IC is used in applications requiring high-speed processing and low power consumption.
EFR32BG24B210F1024IM48-B
Silicon Labs
EFR32BG24B210F1024IM48-B by Silicon Labs is a SoC with CMOS technology. It operates b/w -40 to 125 °C, with supply voltage range of 1.71V to 3.8V. With 48 terminals in a square package, it's ideal for IoT and wireless applications.
MIMX8MM6DVTLZAA
MIMX8MM6DVTLZAA by NXP Semiconductors is a low-profile, fine-pitch SoC with 486 terminals. It operates at a voltage range of 0.95V to 1.05V and can withstand temperatures up to 95°C. This versatile chip is commonly used in various applications requiring high-performance microcontrollers and peripheral ICs.
MSP430F6779AIPEUR
MSP430F6779AIPEUR by Texas Instruments is a 16-bit microprocessor with 128 terminals, 524288 ROM words, and 32 RAM words. It features 6 ADC channels, DMA support, and peripherals like BOR and RTC. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.
XC7Z035-L2FBG676I
The Xilinx XC7Z035-L2FBG676I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With 676 terminals in a grid array package style, it's ideal for applications requiring high-performance processing in compact spaces.
P82B715P
The Texas Instruments P82B715P is an 8-terminal IC with a supply voltage range of 4.5V to 12V, operating b/w -40°C to 85°C. It features a max clock frequency of 0.4MHz and supports I2C bus compatibility, making it ideal for industrial microprocessor circuit applications.
MIMXRT1173CVM8A
NXP Semiconductors' MIMXRT1173CVM8A is a low-profile, fine-pitch SoC with 289 terminals in a grid array package. It operates b/w -40 to 105°C, with supply voltage ranging from 1.1V to 1.15V. Ideal for applications requiring high-performance uPs and uCs in compact designs.
XC7Z010-2CLG400E
The Xilinx XC7Z010-2CLG400E is a System on Chip with 400 terminals in a low profile, fine pitch grid array package. It operates b/w 0-100°C with supply voltage range of 0.95-1.05V. Ideal for applications requiring high-performance processing in compact form factors.
AM6422BSDGHAALV
AM6422BSDGHAALV by Texas Instruments is a SYSTEM ON CHIP with a max supply voltage of 0.79 V and a min operating temperature of -40 °C. It is used in applications requiring high speed and low power consumption.
MCIMX6Q6AVT10AD
Freescale Semiconductor
SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;
SLM9670AQ20FW1311XTMA1
SLM9670AQ20FW1311XTMA1 by Infineon is a 32-terminal IC with max supply voltage of 1.95V and min operating temp of -40°C. Ideal for cryptographic authentication applications due to its CMOS technology, quad terminal position, and compact square package style.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
DRA756BPGABCQ1
MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 760; Package Code: FBGA; Package Shape: SQUARE;
DRA751BLGABCRQ1
DRA746APGABCQ1
MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 760; Package Code: BGA; Package Shape: UNSPECIFIED;
DRA755BLGABCRQ1
DRA752BPGABCRQ1
DRA750BJGABCRQ1
DRA756BPGABCRQ1
MICROPROCESSOR CIRCUIT; Peak Reflow Temperature (C): 250; Screening Level: AEC-Q100; Terminal Finish: TIN SILVER COPPER; Technology: CMOS; Moisture Sensitivity Level (MSL): 3;
DRA744BJGABCRQ1
DRA752BPGABCQ1
DRA746BPGABCQ1
DRA755BLGABCQ1
DRA754BJGABCQ1
DRA750BJGABCQ1
DRA756
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 760; Package Code: BGA; Package Shape: SQUARE; Terminal Position: BOTTOM;
DRA745BLGABCRQ1
DRA751BLGABCQ
DRA744BJGABCQ1
DRA745BLGABCQ1
DRA746BPGABCRQ1
DRA754BJGABCRQ1
Supply Digital Components
$106.00
$54.25
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12,000 In-Stock
Total price ≈ $80,197.29
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