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MCIMX6S6AVM08ACR

NXP Semiconductors

MCIMX6S6AVM08ACR by NXP Semiconductors

MCIMX6S6AVM08ACR by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 125 °C, with a supply voltage range of 1.275V to 1.5V. Ideal for automotive applications due to its low profile and fine pitch package style.

Median Price

$32.680

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

EBV Elektronik

Germany . 29,000 parts In-Stock

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29,000

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Future Electronics

Canada . 500 parts In-Stock

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$32.680

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500

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$32.680

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Flip Electronics (Authorized)

USA . 500 parts In-Stock

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500

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Distributors (In-Stock)

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Nova Conductors

Japan . 21 parts In-Stock

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$37.906

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$37.906

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TME

Poland . 29,000 parts In-Stock

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$46.610

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Flip Electronics

USA . 25,875 parts In-Stock

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25,875

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Digiode

USA . 4,751 parts In-Stock

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Vyrian

USA . 4,137 parts In-Stock

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Infinite Electronics LLP

India . 4,000 parts In-Stock

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Anansix

USA . 2,844 parts In-Stock

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NAC Semi

USA . 1,000 parts In-Stock

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$46.340

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Chip Stock

USA . 975 parts In-Stock

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975

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IBS Electronics

USA . 500 parts In-Stock

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$47.909

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500

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$47.909

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 584 parts In-Stock

1+ parts

$11.370

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Ampacity Inc.

Singapore . 89 parts In-Stock

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$30.000

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$30.000

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Continental Prestige Electronics

USA . 4,391 parts In-Stock

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$37.906

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$37.148

4,391

$37.906

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$37.148

Netroflash

USA . 500 parts In-Stock

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$37.906

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$37.148

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500

$37.906

$37.148

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Corohmni

South Africa . 2,587 parts In-Stock

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$50.748

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2,587

$50.748

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Microchip USA

USA . 3,009 parts In-Stock

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$79.745

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Lixinc

USA . 18,389 parts In-Stock

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GreenTree Electronics

Israel . 7,000 parts In-Stock

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UNI Independent Distributors

Spain . 5,417 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Argo Parts USA

USA . 2,655 parts In-Stock

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Corphita

USA . 1,282 parts In-Stock

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Overview

Discover the cutting-edge MCIMX6S6AVM08ACR by NXP Semiconductors, setting new standards in the category of Other Function uPs,uCs & Peripheral ICs. With a focus on innovation and quality, NXP Semiconductors delivers a product that exceeds expectations. Ideal for automotive applications, this system on chip offers unparalleled performance and reliability. Experience the value and benefits that come with choosing NXP Semiconductors for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, suitable for various applications.

Surface Mount: YES

Allows for easy and secure installation on a circuit board.

Maximum Supply Voltage: 1.5 V

Can operate within a safe voltage range, reducing the risk of damage.

Package Shape: SQUARE

Compact shape that helps save space in the overall design.

No. of Terminals: 624

Plenty of terminals for connecting to various components, enabling versatile functionality.

Minimum Supply Voltage: 1.275 V

Allows for operation at a lower voltage, which can be beneficial for power efficiency.

Maximum Operating Temperature: 125 °C

Can function reliably in high-temperature environments, suitable for automotive applications.

Minimum Operating Temperature: -40 °C

Capable of operating in cold conditions, ensuring functionality in extreme temperature ranges.

Terminal Finish: TIN SILVER COPPER

Provides a reliable and conductive finish for secure connections.

Temperature Grade: AUTOMOTIVE

Designed to meet the requirements for automotive applications, ensuring durability and reliability in harsh conditions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX6S6AVM08ACR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

Additional Features:

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE;EACH GPIO MODULE SUPPORTS 32 BITS OF I/O

JESD-30 Code:

S-PBGA-B624

JESD-609 Code:

e1

Length:

21 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

624

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

1.5 V

Minimum Supply Voltage:

1.275 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

21 mm

Peripheral IC Type:

Trade Compliance

MCIMX6S6AVM08ACR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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