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MIMX8QX2AVLFZAC

NXP Semiconductors

MIMX8QX2AVLFZAC by NXP Semiconductors

The NXP Semiconductors MIMX8QX2AVLFZAC is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 125 °C and has a supply voltage range of 1.05-1.15 V, making it ideal for automotive applications requiring high performance in a compact GRID ARRAY package.

Median Price

$68.133

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 40 parts In-Stock

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$52.980

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$52.450

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Flip Electronics (Authorized)

USA . 960 parts In-Stock

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DigiKey

USA . 60 parts In-Stock

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Verical

USA . 60 parts In-Stock

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$83.286

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Digiode

USA . 1,305 parts In-Stock

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$50.331

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Nova Conductors

Japan . 900 parts In-Stock

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$91.043

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Vyrian

USA . 2,874 parts In-Stock

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Anansix

USA . 1,048 parts In-Stock

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USA . 1,004 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 645 parts In-Stock

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$19.988

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AZTECH Wire

Italy . 1,213 parts In-Stock

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$22.240

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Aztec Data Supply Inc.

USA . 286 parts In-Stock

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$32.749

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Ampacity Inc.

Singapore . 311 parts In-Stock

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$45.030

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Corphita

USA . 4,382 parts In-Stock

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$47.682

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Continental Prestige Electronics

USA . 3,887 parts In-Stock

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$91.043

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$89.222

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Netroflash

USA . 1,000 parts In-Stock

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$91.043

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$89.222

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Microchip USA

USA . 2,255 parts In-Stock

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$191.983

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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UNI Independent Distributors

Spain . 5,798 parts In-Stock

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Argo Parts USA

USA . 2,074 parts In-Stock

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Overview

Discover the innovative MIMX8QX2AVLFZAC by NXP Semiconductors, a cutting-edge System on Chip designed for automotive applications. With its advanced technology and high-quality manufacturing, this product offers unparalleled performance and reliability. Whether you're looking to enhance your automotive systems or streamline your operations, this versatile IC is the perfect solution. Trust NXP Semiconductors to deliver top-notch products that meet your needs and exceed your expectations. Elevate your projects with the MIMX8QX2AVLFZAC and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and lightweight, making the product suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product onto circuit boards.

Maximum Supply Voltage: 1.15 V

The high maximum supply voltage allows for flexibility in power supply options for the product.

Package Shape: SQUARE

The square shape of the package makes it easy to place and solder onto circuit boards efficiently.

No. of Terminals: 609

The high number of terminals provide ample connectivity options for various external components.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures that the product can withstand harsh environmental conditions.

Peripheral IC Type: SYSTEM ON CHIP

Having a system on chip design allows for integration of multiple functions into a single chip, reducing overall complexity and cost.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product efficient and reliable.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MIMX8QX2AVLFZAC attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B609

Length:

21 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

609

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA609,35X35,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.52 mm

Maximum Supply Voltage:

1.15 V

Minimum Supply Voltage:

1.05 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

21 mm

Peripheral IC Type:

Trade Compliance

MIMX8QX2AVLFZAC Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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