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DRA784BSGABFRQ1

Texas Instruments

DRA784BSGABFRQ1 by Texas Instruments

DRA784BSGABFRQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 32 MHz Max Clock Frequency. Ideal for automotive applications, it operates b/w -40 to 125 °C with AEC-Q100 Screening Level.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,878 parts In-Stock

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Digiode

USA . 2,428 parts In-Stock

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2,428

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Distributors (Availability)

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AZTECH Wire

Italy . 874 parts In-Stock

1+ parts

$5.348

100+ parts

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874

$5.348

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One Stop Electronics

USA . 1,250 parts In-Stock

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$13.000

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$13.000

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Native Components

USA . 970 parts In-Stock

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$25.980

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970

$25.980

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Northwest PG Solutions

USA . 543 parts In-Stock

1+ parts

$28.579

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$25.721

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543

$28.579

$25.721

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Parana Technologies

USA . 132 parts In-Stock

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$71.021

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132

$71.021

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Corohmni

South Africa . 861 parts In-Stock

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$71.614

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861

$71.614

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IDEA Electronic Components Group

UK . 1,822 parts In-Stock

1+ parts

$79.799

100+ parts

$75.809

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$71.819

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1,822

$79.799

$75.809

$71.819

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ChromeModa Solutions

Germany . 1,503 parts In-Stock

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$79.799

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$65.435

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1,503

$79.799

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Corphita

USA . 3,345 parts In-Stock

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3,345

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DigiPath Technology Company

USA . 1,875 parts In-Stock

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$71.947

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Overview

Experience the next level of performance and reliability with the DRA784BSGABFRQ1 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and innovation in their products. This versatile microprocessor circuit is ideal for automotive applications, offering seamless integration and advanced functionality. With a wide range of features and benefits, this product provides exceptional value to customers looking for cutting-edge technology. Upgrade your projects today with the DRA784BSGABFRQ1 and experience the difference Texas Instruments can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and lightweight, making the product suitable for a variety of applications.

Surface Mount: YES

Surface mount technology makes the product easy to install on a circuit board, saving space and reducing assembly time.

Maximum Supply Voltage: 1.11 V

The high maximum supply voltage allows for flexibility in power input, making the product versatile in different voltage environments.

Screening Level: AEC-Q100

AEC-Q100 screening ensures that the product meets automotive industry standards for quality and reliability.

Package Shape: SQUARE

The square shape of the package allows for efficient use of space on a circuit board.

No. of Terminals: 367

The high number of terminals enables the product to connect to multiple external components, expanding its functionality.

Package Style: GRID ARRAY, FINE PITCH

The grid array and fine pitch design provides a high level of connectivity while maintaining a compact form factor.

Minimum Supply Voltage: 1.02 V

The low minimum supply voltage helps in reducing power consumption and extending battery life in portable applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance even in demanding thermal conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function effectively in cold environments without losing performance.

Terminal Finish: TIN SILVER COPPER

The combination of tin, silver, and copper terminal finish provides excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: BOTTOM

The terminals being positioned at the bottom facilitate easy and secure soldering to the circuit board.

Maximum Seated Height: 2.82 mm

The low maximum seated height helps in reducing the overall profile of the product, making it suitable for slim devices.

Width: 15 mm

The compact width of 15 mm allows for efficient PCB layout and integration into various electronic systems.

External Data Bus Width: 32

The 32-bit external data bus width enables high-speed data transfer and processing capabilities for enhanced performance.

Maximum Clock Frequency: 32 MHz

The high maximum clock frequency of 32 MHz allows for efficient operation and fast response times in real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

The product can withstand peak reflow temperatures for up to 30 seconds, ensuring proper soldering and assembly during manufacturing.

Peak Reflow Temperature °C: 250

The high peak reflow temperature of 250°C ensures stable and reliable solder joints for long-lasting performance.

Length: 15 mm

The compact length of 15 mm contributes to space-saving and compact designs in electronic systems.

Temperature Grade: AUTOMOTIVE

The automotive-grade temperature rating ensures that the product can withstand harsh operating conditions in vehicle applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The inclusion of a microprocessor circuit as a peripheral IC type enhances the product's processing capabilities and functionality for advanced applications.

Technology: CMOS

The CMOS technology used in the product offers low power consumption, high speed, and integration capabilities for efficient performance.

Terminal Form: BALL

The ball terminal form allows for reliable connections and facilitates easy handling during installation and maintenance.

Nominal Supply Voltage: 1.06 V

The nominal supply voltage of 1.06 V provides a stable power input for consistent and reliable operation of the product.

Bus Compatibility: I2C(2), SPI(4), UART(3)

The product's compatibility with I2C, SPI, and UART bus protocols allows for seamless communication and integration with a wide range of devices.

Terminal Pitch: 0.65 mm

The fine terminal pitch of 0.65 mm enables high-density packaging and improved connectivity for increased functionality.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates that the product has moderate sensitivity to moisture, ensuring reliability in various environmental conditions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs DRA784BSGABFRQ1 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bus Compatibility:

I2C(2), SPI(4), UART(3),

Maximum Clock Frequency:

32 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B367

JESD-609 Code:

e1

Length:

15 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

367

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA167,22X22,26

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Screening Level:

AEC-Q100

Maximum Seated Height:

2.82 mm

Maximum Supply Voltage:

1.11 V

Minimum Supply Voltage:

1.02 V

Nominal Supply Voltage:

1.06 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Peripheral IC Type:

Trade Compliance

DRA784BSGABFRQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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