Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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10AS057K2F40E1HG by Intel is a Square GRID ARRAY package with 1517 terminals, operating b/w 0-100°C. It features SoC technology from TSMC, with a terminal pitch of 1mm. Ideal for applications requiring high-performance computing in compact spaces.
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Plastic/Epoxy material makes the package lightweight and durable, ideal for portable devices.
Surface mount technology makes for easy integration onto circuit boards, saving space and reducing production costs.
Square package shape allows for efficient use of space on PCBs, maximizing component density.
Large number of terminals provide plenty of connectivity options for various peripherals and interfaces.
High maximum operating temperature ensures reliability in various environmental conditions.
Low minimum operating temperature allows for usage in a wide range of environments.
Bottom terminal position makes soldering and assembly easier, improving manufacturability.
Low seated height allows for slim and compact device designs.
Standard width makes the component compatible with standard PCB sizes and layouts.
Standard length allows for easy integration into various device enclosures.
System-on-Chip (SoC) integration combines multiple functions into a single IC, reducing overall system complexity and cost.
Using TSMC technology ensures high performance and reliability, as TSMC is a leading semiconductor foundry.
Ball terminal form provides secure and reliable connections, especially for fine-pitch applications.
1mm terminal pitch allows for high-density mounting on PCBs, maximizing connectivity in a small footprint.
Other Function uPs,uCs & Peripheral ICs 10AS057K2F40E1HG attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Intel
JESD-30 Code:
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10AS057K2F40E1HG Peripheral ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - Mult Dev Des/Errata Chgs 16/Aug/2022 Mult PN LABEL 01/08/2023
PCN Assembly/Origin - UMTC S3 25-Jul-2022
PCN Packaging - Mult Dev Label CHG 24/Jan/2020 Mult Dev Label Chgs 24/Feb/2020
Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.
1N4148
North American Philips Discrete Products Div
RECTIFIER DIODE; Surface Mount: NO; Maximum Forward Voltage (VF): 1 V; JESD-609 Code: e0; Maximum Repetitive Peak Reverse Voltage: 100 V; Terminal Finish: Tin/Lead (Sn/Pb);
U.FL-R-SMT-1(10)
Hirose Electric
U.FL-R-SMT-1(10) by Hirose Electric is a RF connector with 50 ohm impedance, 0.05 dB insertion loss, and 8 GHz operating frequency. Ideal for board mounting in commercial applications, it features gold termination finish, liquid crystal polymer insulator, and 200VAC dielectric voltage resistance.
CRCW06031K00FKEAHP
Vishay Intertechnology
Vishay Intertechnology's CRCW06031K00FKEAHP is a fixed resistor with 1000 ohm resistance, 1% tolerance, and 0.33 W power dissipation. Ideal for surface mount applications in automotive electronics due to AEC-Q200 standard compliance and operating voltage of 75 V.
OPA2277UA
Texas Instruments
OPA2277UA by Texas Instruments is a dual operational amplifier with low-offset voltage of 100 uV and micropower consumption of 1.65 mA. Ideal for industrial applications, it offers high common mode rejection ratio of 140 dB and unity gain bandwidth of 1000 kHz in a small outline package.
LM358D-T
NXP Semiconductors
LM358D-T by NXP Semiconductors is a dual operational amplifier with 70dB CMRR, 1000kHz unity gain bandwidth, and 9000uV max input offset voltage. Widely used in commercial applications due to its small outline package and low bias current of 0.5uA.
General Diode
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Reverse Recovery Time: .004 us; Terminal Finish: Tin/Lead (Sn/Pb); No. of Elements: 1;
SMBJ18CA
Goodwork Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WS
Vishay Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Fairchild Semiconductor
BSS138
Calogic
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Drain Current (Abs) (ID): .2 A;
Tak Cheong Electronics Holdings
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M39029/58360
Souriau-sunbank Connection Technologies
Souriau-sunbank's M39029/58360 is a MIL-Spec backshell with CRIMP contact type and male gender. It conforms to MIL-DTL-38999 standards, mates with M39029/56348 contacts, and requires M81969/14-01 insertion tools. Ideal for military applications requiring reliable crimp terminals.
LL4148
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Baneasa S A
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; No. of Terminals: 3; Maximum Drain Current (ID): .2 A; Operating Mode: ENHANCEMENT MODE;
Transys Electronics
M85049/85-08W02
TE Connectivity
CONNECTOR ACCESSORY; Minimum Operating Temperature: -65 Cel; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 175 Cel; Material: ALUMINUM ALLOY;
2N2222A
Central Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Transistor Application: SWITCHING; Transistor Element Material: SILICON;
Philips Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Terminal Finish: MATTE TIN; Maximum Operating Temperature: 200 Cel; Maximum Output Current: .15 A; JESD-609 Code: e3;
MBR0520LT1
Motorola
EFR32MG24B010F1536IM40-B
Silicon Labs
EFR32MG24B010F1536IM40-B by Silicon Labs is a 40-terminal SoC with CMOS technology. It operates b/w -40 to 125 °C, with supply voltage range of 1.71V to 3.8V. Ideal for applications requiring compact design and high performance in IoT devices.
EFR32MG12P432F1024GM48-C
SYSTEM ON CHIP;
DA14531MOD-00F01002
Renesas Electronics
SoC; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 250;
TMS320DM368ZCED
TMS320DM368ZCED by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. Operating at temperatures from -40 to 85 °C, it supports I2C, SPI, UART, and USB buses. Ideal for industrial applications requiring a low-profile grid array package with a 0.65 mm terminal pitch.
MCIMX283CVM4B
Freescale Semiconductor
SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;
ESP32-WROOM-32UE-N8
Espressif Systems (Shanghai)
ESP32-WROOM-32UE-N8 by Espressif Systems is a SoC with 38 terminals, operating at 3.3V nominal voltage and 85°C max temp. Ideal for IoT applications due to its CMOS technology, compact size (19.2mm x 18mm), and surface mount capability.
OMAPL138EZWTD4E
OMAPL138EZWTD4E by Texas Instruments is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 50 MHz Max Clock Frequency. It operates in an INDUSTRIAL temperature grade range of -40 to 90 °C, suitable for applications requiring high-speed processing and connectivity via I2C, SPI, UART, and USB interfaces.
MIMXRT1042XFP5B
NRF9160-SIBA-R7
Nordic Semiconductor Asa
Nordic Semiconductor's NRF9160-SIBA-R7 is a CMOS MICROCONTROLLER with 127 terminals, operating b/w -40 to 85 °C. It has a supply voltage range of 3-5.5 V and is ideal for industrial applications requiring low power consumption and compact design.
MIMXRT1064CVL5A
The NXP MIMXRT1064CVL5A is a SoC with CMOS technology, featuring 196 terminals in a low profile grid array package. It operates b/w -40 to 105 °C, with supply voltage ranging from 1.15V to 1.26V. Ideal for industrial applications requiring high performance and compact design.
CC1310F64RHBT
CC1310F64RHBT by Texas Instruments is a MICROPROCESSOR CIRCUIT with 28672 RAM Bytes, operating at -40 to 85 °C. It features a CORTEX-M3 CPU Family, 32 terminals in a SQUARE package style, and supports supply voltages from 1.8V to 3.8V. Ideal for industrial applications requiring low power consumption and high performance in compact designs.
MIMXRT1051CVL5B
The NXP Semiconductors MIMXRT1051CVL5B is a System on Chip with CMOS technology. It operates b/w -40 to 105°C, has 196 terminals in a low profile grid array package, and supports a supply voltage range of 1.15-1.26V. Ideal for industrial applications requiring high performance and compact design.
ST4SI2M0007AKIFW
STMicroelectronics
ST4SI2M0007AKIFW by STMicroelectronics is a 8-terminal IC with max operating temp of 105°C. It's a small outline, heat sink package used as cryptographic authenticator in various applications. With CMOS technology and no-lead terminals, it's ideal for secure data authentication needs.
MCIMX286CVM4B
MCIMX286CVM4B by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 1.35-1.55 V. Ideal for industrial applications requiring low profile and fine pitch grid array package style.
ATSAMA5D27-SOM1
Microchip Technology
ATSAMA5D27-SOM1 by Microchip: Operates at 3-3.6V, -40 to 85°C temp range, with 176 terminals. Ideal for industrial applications, supports CAN(2), I2C, SPI interfaces. Compact MICROELECTRONIC ASSEMBLY package style at 38x40mm size.
LS1021ASN7KQB
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 525; Package Code: HBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
CC1310F128RSMT
CC1310F128RSMT by Texas Instruments is a Cortex-M3 CPU with 28672 RAM bytes. It operates b/w -40 to 85°C, with a supply voltage range of 1.8-3.8V. Ideal for industrial applications requiring a microprocessor circuit in a compact chip carrier package.
FXLC95000CLR1
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 24; Package Code: TFLGA; Package Shape: RECTANGULAR;
CY8C6247BZI-D34
Infineon Technologies
CY8C6247BZI-D34 by Infineon Technologies is a 124-terminal, programmable SoC with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 1.7V to 3.6V. This IC is ideal for applications requiring a compact form factor and high performance in various electronic devices.
XC7Z015-L1CLG485I
Xilinx
XC7Z015-L1CLG485I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. This package style features a grid array, low profile design ideal for various applications in the electronics industry.
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10AS066N3F40E2LG
Intel
SoC; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B1517;
10AS048H4F34E3SG
SoC; Terminal Form: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Technology: TSMC;
10AS066H2F34I1HG
SoC; Terminal Form: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel;
10AS016C4U19I3LG
SoC; Terminal Form: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE; Length: 19 mm;
10AS032H3F35E2SG
SoC; Terminal Form: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Minimum Supply Voltage: .87 V;
10AS057K4F40E3SG
SoC; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
10AS016E4F29I3LG
SoC; Terminal Form: BALL; No. of Terminals: 780; Package Code: BGA; Package Shape: SQUARE; Terminal Pitch: 1 mm;
10AS016E4F27E3SG
SoC; Terminal Form: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE; Minimum Operating Temperature: 0 Cel;
10AS016E3F27E2SG
SoC; Terminal Form: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;
10AS027E2F27E2LG
10AS027E3F29E2LG
SoC; Terminal Form: BALL; No. of Terminals: 780; Package Code: BGA; Package Shape: SQUARE; Maximum Operating Temperature: 100 Cel;
10AS016C3U19E2LG
SoC; Terminal Form: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE; Surface Mount: YES;
10AS016E4F29E3SG
SoC; Terminal Form: BALL; No. of Terminals: 780; Package Code: BGA; Package Shape: SQUARE; Length: 29 mm;
10AS048E3F29E2LG
SoC; Terminal Form: BALL; No. of Terminals: 780; Package Code: BGA; Package Shape: SQUARE; Technology: TSMC;
10AS016E4F27E3LG
SoC; Terminal Form: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE; Width: 27 mm;
10AS027H2F34E2LG
10AS032E4F29E3SG
SoC; Terminal Form: BALL; No. of Terminals: 780; Package Code: BGA; Package Shape: SQUARE; Package Equivalence Code: BGA780,28X28,40;
10AS066H4F34E3SG
SoC; Terminal Form: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Terminal Position: BOTTOM;
10AS057K2F40I2SG
SoC; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE; Maximum Seated Height: 3.5 mm;
10AS057K2F40E2SG
SoC; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE; Width: 40 mm;
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