Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Intel 10AS016E4F27E3LG is a SoC peripheral IC with TSMC technology. It operates b/w 0-100°C, with supply voltage ranging from 0.87-0.93V. With 672 terminals in a grid array package, it's ideal for applications requiring high performance and compact design.
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Plastic/epoxy material provides durability and protection for the components inside, making the product reliable for long-term use.
Surface mount technology allows for easy and efficient installation on PCBs, saving time and effort during assembly.
The high maximum supply voltage allows for flexibility in powering the product, accommodating a wide range of voltage inputs.
Square package shape is space-efficient and allows for a neat and organized layout on the PCB.
The large number of terminals enables the product to support complex functions and connectivity options, making it versatile for different applications.
Grid array package style provides high I/O density and efficient heat dissipation, contributing to optimal performance and reliability.
The low minimum operating temperature ensures the product can function in a wide range of environments, from chilly to hot conditions.
The compact maximum seated height allows for a slim and space-saving design, ideal for applications with limited space.
System on Chip (SoC) technology integrates multiple functions into a single chip, reducing complexity and enhancing performance for seamless operation.
Being manufactured by TSMC, a leading semiconductor foundry, ensures high quality and reliability of the product, meeting industry standards.
Other Function uPs,uCs & Peripheral ICs 10AS016E4F27E3LG attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Intel
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10AS016E4F27E3LG Peripheral ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - Arria/Cyclone 10 Software Chg 3/Jun/2021 Mult Dev Des/Errata Chgs 16/Aug/2022
PCN Packaging - Mult Dev Label CHG 24/Jan/2020 Mult Dev Label Chgs 24/Feb/2020
Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.
LM7805CT
Fairchild Semiconductor
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %;
BAV99
Philips Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Maximum Output Current: .1 A; Peak Reflow Temperature (C): 260; Terminal Finish: MATTE TIN; Maximum Reverse Recovery Time: .006 us;
1N4148WS
Jiangsu Changjiang Electronics Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Eic Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Capar Components
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Forward Voltage (VF): 1 V; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Output Current: .15 A;
Digitron Semiconductors
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N2222A
Vpt Components
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Power Dissipation (Abs): 1 W; Maximum Collector Current (IC): .8 A; Maximum Power Dissipation Ambient: .5 W;
2N7002
Sipex
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): 240; Terminal Finish: TIN LEAD;
SZNUP2105LT1G
Onsemi
SZNUP2105LT1G by Onsemi is a Transient Suppression Device with 2 elements in a common anode configuration. It has a max non-repetitive peak reverse power dissipation of 350W and breakdown voltage of 29.1V. Ideal for applications requiring bidirectional polarity protection, such as automotive electronics and industrial equipment due to its AEC-Q101 compliance and high clamping voltage of 44V.
Hitano Enterprise
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Allegro MicroSystems
RECTIFIER DIODE; Terminal Position: END; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138-TP
Micro Commercial Components
BSS138-TP by Micro Commercial Components is a N-channel small signal FET with a min DS breakdown voltage of 50V and max drain current of 0.22A. It is commonly used in applications requiring enhancement mode operation, such as power management and switching circuits.
Shandong Yiguang Electronic Joint Stock
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Moisture Sensitivity Level (MSL): 1; Maximum Operating Temperature: 150 Cel;
Comset Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
ST3485EBDR
STMicroelectronics
ST3485EBDR by STMicroelectronics is a Line Driver & Receiver with 3.3V power supply, EIA-422/EIA-485 interface standard, and 30ns max transmit delay. It is ideal for industrial applications requiring differential output and operates in temperatures ranging from -40 to 85°C.
ERJ3GEY0R00V
Panasonic
ERJ3GEY0R00V by Panasonic is a SMT fixed resistor with 0 ohm resistance, suitable for jumper applications. It features a metal glaze/thick film technology, rated for temperatures b/w -55 to 155 °C. With a compact rectangular construction and matte tin over nickel terminal finish, it is ideal for surface mount installations in various electronic devices.
DS18B20Z+
Analog Devices
DS18B20Z+ by Analog Devices is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, with ±0.5°C accuracy. Suitable for applications requiring digital output and surface mounting feature.
Vishay Telefunken
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): .715 V; Maximum Operating Temperature: 150 Cel; Maximum Reverse Recovery Time: .006 us; Maximum Output Current: .2 A;
XCZU7EV-1FFVC1156E
Xilinx
XCZU7EV-1FFVC1156E by Xilinx is a CMOS microprocessor circuit with 1156 terminals in a grid array package. Operating b/w 0 to 100°C, it has a supply voltage range of 0.825V to 0.876V. Ideal for applications requiring high-performance processing capabilities in various electronic systems.
MCP25050T-E/SL
Microchip Technology
MCP25050T-E/SL by Microchip: 8-bit peripheral IC with 5V supply, -40 to 125°C operating temp. Ideal for automotive applications, TS16949 certified, small outline package with dual terminals.
LS1021AXE7KQB
NXP Semiconductors
LS1021AXE7KQB by NXP Semiconductors is a microprocessor circuit with a package style of grid array and heat sink/slug. It has a max supply voltage of 1.03V and a min supply voltage of 0.97V. This IC is commonly used in applications requiring high-performance processing capabilities.
PN7120A0EV/C10801Y
NXP Semiconductors' PN7120A0EV/C10801Y is a 49-terminal IC with 1.8V supply voltage, operating b/w -30°C to 85°C. Its grid array package style and fine pitch make it suitable for surface mount applications in various electronic devices. The IC's tin silver copper terminal finish ensures reliable performance at peak reflow temperature of 260°C for up to 30 seconds.
Freescale Semiconductor
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 525; Package Code: HBGA; Package Shape: SQUARE; Nominal Supply Voltage: 1 V;
CY8C4248LQI-BL483
Cypress Semiconductor
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE;
ST33HTPH2X32AHD8
ST33HTPH2X32AHD8 by STMicroelectronics is a 32-terminal cryptographic authenticator IC with CMOS technology. It operates b/w -40 to 105 °C, in a square chip carrier package style. Ideal for secure applications requiring a nominal voltage of 1.8 V and very thin profile design.
ESP32-S3-WROOM-1-N8R8
Espressif Systems (Shanghai)
ESP32-S3-WROOM-1-N8R8 by Espressif Systems (Shanghai) is a 41-terminal SoC with CMOS technology. It operates b/w -40 to 65 °C and supports supply voltage of 3-3.6 V. Ideal for IoT applications due to its compact MICROELECTRONIC ASSEMBLY package style and surface mount capability.
ST33HTPH2E32AHD0
ST33HTPH2E32AHD0 by STMicroelectronics is a 32-terminal cryptographic authenticator IC with CMOS technology. It operates b/w -40 to 105°C, suitable for secure applications. The chip carrier package has a very thin profile and no-lead terminal form, making it ideal for compact designs.
2545
Optical Electronics
Other uPs/uCs/Peripheral ICs;
FCM8531QY
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE;
MIMXRT117FCVM8A
The NXP Semiconductors MIMXRT117FCVM8A is a low-profile, fine-pitch SoC with CMOS technology. It operates b/w -40°C to 105°C and has a supply voltage range of 1.1V to 1.15V. With 289 terminals in a grid array package, it's ideal for applications requiring high-performance microcontrollers in compact designs.
XC7Z007S-2CLG225I
XC7Z007S-2CLG225I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 225 terminals in a low profile grid array package, it's ideal for various uPs and uCs applications.
SLB9670XQ20FW785XUMA1
Infineon Technologies
SLB9670XQ20FW785XUMA1 by Infineon: 32-terminal IC with CMOS tech, 1.65-1.95V supply, -40 to 85°C temp range. Ideal for industrial cryptographic authentication applications due to its compact square chip carrier package and low profile design.
MIMXRT1052CVJ5B
The NXP Semiconductors MIMXRT1052CVJ5B is a System on Chip with CMOS technology, featuring 196 terminals in a low profile grid array package. It operates b/w -40 to 105°C, with supply voltage ranging from 1.15V to 1.26V. Ideal for industrial applications requiring high performance and reliability.
MV78460-B0-BJR4C160
Marvell Technology
Marvell Technology's MV78460-B0-BJR4C160 is a CMOS SoC with 732 terminals in a square grid array package. It operates at temperatures ranging from 0 to 105 °C and has a max seated height of 2.01 mm. This IC is commonly used in Other Function uPs, uCs, and peripheral applications.
CY8C4025AZI-S413
PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;
CSR8670C-IBBH-R
Qualcomm
Qualcomm's CSR8670C-IBBH-R is a CMOS microprocessor circuit with 112 terminals in a grid array package. It is surface-mountable and features ball terminal form. This IC is ideal for applications requiring high-performance processing in compact electronic devices.
MCIMX6L8DVN10AA
SoC; Terminal Form: BALL; No. of Terminals: 432; Package Code: TFBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B432;
OMAPL138EZWTA3
Texas Instruments
OMAPL138EZWTA3 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 50 MHz Max Clock Frequency. It operates in an INDUSTRIAL temperature grade range of -40 to 105 °C, making it suitable for applications requiring high-speed processing in harsh environments. With I2C, SPI, UART, and USB bus compatibility, this device is ideal for various embedded systems and industrial automation solutions.
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10AS066N3F40E2LG
Intel
SoC; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B1517;
10AS048H4F34E3SG
SoC; Terminal Form: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Technology: TSMC;
10AS066H2F34I1HG
SoC; Terminal Form: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel;
10AS016C4U19I3LG
SoC; Terminal Form: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE; Length: 19 mm;
10AS032H3F35E2SG
SoC; Terminal Form: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Minimum Supply Voltage: .87 V;
10AS057K4F40E3SG
SoC; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
10AS016E4F29I3LG
SoC; Terminal Form: BALL; No. of Terminals: 780; Package Code: BGA; Package Shape: SQUARE; Terminal Pitch: 1 mm;
10AS016E4F27E3SG
SoC; Terminal Form: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE; Minimum Operating Temperature: 0 Cel;
10AS016E3F27E2SG
SoC; Terminal Form: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;
10AS027E2F27E2LG
10AS027E3F29E2LG
SoC; Terminal Form: BALL; No. of Terminals: 780; Package Code: BGA; Package Shape: SQUARE; Maximum Operating Temperature: 100 Cel;
10AS016C3U19E2LG
SoC; Terminal Form: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE; Surface Mount: YES;
10AS016E4F29E3SG
SoC; Terminal Form: BALL; No. of Terminals: 780; Package Code: BGA; Package Shape: SQUARE; Length: 29 mm;
10AS048E3F29E2LG
SoC; Terminal Form: BALL; No. of Terminals: 780; Package Code: BGA; Package Shape: SQUARE; Technology: TSMC;
10AS027H2F34E2LG
10AS032E4F29E3SG
SoC; Terminal Form: BALL; No. of Terminals: 780; Package Code: BGA; Package Shape: SQUARE; Package Equivalence Code: BGA780,28X28,40;
10AS057K2F40E1HG
10AS066H4F34E3SG
SoC; Terminal Form: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Terminal Position: BOTTOM;
10AS016E4F27I3SG
SoC; Terminal Form: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE; Maximum Seated Height: 3.35 mm;
10AS016E4F27I3LG
SoC; Terminal Form: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
Supply Digital Components
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