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10AS016E4F27I3LG

Intel

10AS016E4F27I3LG by Intel

SoC; Terminal Form: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 2,110 parts In-Stock

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Digiode

USA . 1,280 parts In-Stock

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Chip Stock

USA . 807 parts In-Stock

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Native Components

USA . 250 parts In-Stock

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$0.300

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$0.288

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$0.300

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$0.288

Northwest PG Solutions

USA . 962 parts In-Stock

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$0.330

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$0.291

962

$0.330

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Ampacity Inc.

Singapore . 258 parts In-Stock

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$22.000

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258

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One Stop Electronics

USA . 695 parts In-Stock

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$32.000

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$32.000

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Semicontronic

India . 1,325 parts In-Stock

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$35.000

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$34.125

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$33.950

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Modulus Dynamics

Lithuania . 84 parts In-Stock

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$49.066

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$49.066

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$49.066

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Texas Native Microelectronics

USA . 1,486 parts In-Stock

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$166.822

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$146.803

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Kenton Components

USA . 700 parts In-Stock

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$200.186

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$192.179

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$186.173

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$176.164

700

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$176.164

Qasali Group International

UK . 4,610 parts In-Stock

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$450.419

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$418.890

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Microchip USA

USA . 1,665 parts In-Stock

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$817.768

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MARBEL Systems

Belgium . 2,095 parts In-Stock

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Corphita

USA . 691 parts In-Stock

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Corohmni

South Africa . 410 parts In-Stock

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Supply Digital

USA . 88 parts In-Stock

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88

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Technical Specifications

Other Function uPs,uCs & Peripheral ICs 10AS016E4F27I3LG attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Intel

Specs

JESD-30 Code:

S-PBGA-B672

Length:

27 mm

No. of Terminals:

672

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA672,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

3.35 mm

Maximum Supply Voltage:

.93 V

Minimum Supply Voltage:

.87 V

Nominal Supply Voltage:

.9 V

Surface Mount:

YES

Technology:

TSMC

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

SoC

Trade Compliance

10AS016E4F27I3LG Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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