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10AS048E3F29E2LG

Intel

10AS048E3F29E2LG by Intel

10AS048E3F29E2LG by Intel is a Peripheral IC with 780 terminals, operating temperature range of 0-100 °C. It features TSMC technology, 0.87-0.93 V supply voltage, and square package style. Ideal for System on Chip applications due to its small form factor and surface mount capability.

Median Price

$3,030.150

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Mouser Electronics

USA . 390 parts In-Stock

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Digiode

USA . 759 parts In-Stock

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Vyrian

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VNN

France . 3,478 parts In-Stock

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Chip Stock

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Nova Conductors

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MARBEL Systems

Belgium . 4,038 parts In-Stock

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$35.046

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Kenton Components

USA . 450 parts In-Stock

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$48.340

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$42.539

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Modulus Dynamics

Lithuania . 1,519 parts In-Stock

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$69.748

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$69.748

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Texas Native Microelectronics

USA . 5,853 parts In-Stock

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$156.436

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$137.664

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Qasali Group International

UK . 616 parts In-Stock

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$422.377

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$392.811

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One Stop Electronics

USA . 193 parts In-Stock

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$965.990

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Ampacity Inc.

Singapore . 154 parts In-Stock

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Corphita

USA . 818 parts In-Stock

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Corohmni

South Africa . 69 parts In-Stock

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Vigor

Singapore . 266 parts In-Stock

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Microchip USA

USA . 1,881 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 27,721 parts In-Stock

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Supply Digital

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Continental Prestige Electronics

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Argo Parts USA

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Aranea Global

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Overview

Experience superior performance and reliability with the 10AS048E3F29E2LG by Intel. This cutting-edge product is manufactured by Intel, a trusted industry leader known for their top-quality components. Designed for a wide range of applications in the category of Other Function uPs, uCs, & Peripheral ICs, this product offers unmatched value and benefits to customers. From its advanced technology to its high-quality materials, the 10AS048E3F29E2LG delivers exceptional performance and efficiency, making it the perfect choice for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and reliability for the product, making it suitable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy integration and assembly onto PCBs, reducing production time and costs.

Maximum Supply Voltage: 0.93 V

The high maximum supply voltage allows for stable operation and flexibility in power input requirements.

Package Shape: SQUARE

The square package shape offers efficient use of PCB space and simplifies layout design.

No. of Terminals: 780

The high number of terminals provides ample connectivity options for various system configurations and peripherals.

Package Style (Meter): GRID ARRAY

The grid array package style enables high-density mounting and good thermal dissipation, enhancing overall performance.

Minimum Supply Voltage: 0.87 V

The low minimum supply voltage ensures energy efficiency and supports operation in low-power applications.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature range allows for reliable performance in demanding environmental conditions.

Minimum Operating Temperature: 0 °C

The wide operating temperature range ensures reliable operation in both extreme cold and hot conditions.

Terminal Position: BOTTOM

The bottom terminal position simplifies connection and integration onto PCBs, ensuring easy installation and maintenance.

Maximum Seated Height: 3.35 mm

The low maximum seated height allows for compact system designs and efficient use of vertical space within electronic devices.

Width: 29 mm

The compact width of the product enables space-saving integration into various electronic devices and systems.

Length: 29 mm

The matching length with width ensures a square package shape, facilitating uniform layout design and optimal space utilization.

Peripheral IC Type: SoC

The System-on-Chip (SoC) peripheral IC type integrates multiple functions into a single chip, reducing component count and enhancing system efficiency.

Technology: TSMC

The use of TSMC technology ensures high-quality manufacturing processes and reliable performance for the product.

Terminal Form: BALL

The ball terminal form provides secure and reliable connections, enhancing overall product durability and longevity.

Nominal Supply Voltage: 0.9 V

The nominal supply voltage offers a balanced operating range for stable performance and power efficiency.

Terminal Pitch: 1 mm

The 1mm terminal pitch provides a suitable spacing for connections, ensuring easy integration and robust electrical connections.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs 10AS048E3F29E2LG attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Intel

Specs

Additional Features:

ALSO OPERATES AT 0.95V NOMINAL SUPPLY

JESD-30 Code:

S-PBGA-B780

Length:

29 mm

No. of Terminals:

780

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA780,28X28,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

3.35 mm

Maximum Supply Voltage:

.93 V

Minimum Supply Voltage:

.87 V

Nominal Supply Voltage:

.9 V

Surface Mount:

YES

Technology:

TSMC

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

29 mm

Peripheral IC Type:

SoC

Trade Compliance

10AS048E3F29E2LG Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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