Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Intel 10AS027H2F34E2LG is a Peripheral IC with 1152 terminals, operating temperature range of 0-100 °C. It features a supply voltage range of 0.87-0.93 V and utilizes TSMC technology. This SoC is designed for applications requiring high terminal count and advanced functionality in a compact GRID ARRAY package.
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The plastic/epoxy body material ensures durability and protection for the internal components of the product.
Allows for easy and convenient mounting onto circuit boards, saving space and making assembly simpler.
Provides a high supply voltage capacity for powering the device and supporting its functions.
The square package shape allows for efficient use of space on the circuit board, optimizing layout and design.
With a high number of terminals, this product offers extensive connectivity options for integrating with other components in a system.
The grid array package style provides a systematic and organized arrangement of terminals, facilitating easy connection and maintenance.
Even at low supply voltages, this product can operate efficiently and reliably, ensuring consistent performance.
The high maximum operating temperature range allows the product to withstand heat and function effectively in various environments.
Capable of operating at low temperatures without compromising performance, making it suitable for diverse applications.
The bottom terminal position enables easy access for connections and soldering during installation.
With a relatively low seated height, this product can be accommodated within compact device designs without excessive bulk.
The 35mm width provides a balance between size and functionality, fitting well within standard PCB layouts.
The 35mm length offers a compact form factor, ideal for space-constrained applications where size matters.
The System on Chip (SoC) peripheral IC type integrates multiple functions into a single chip, enhancing efficiency and reducing complexity in the system.
Utilizing TSMC technology signifies high-quality fabrication processes, ensuring reliable performance and adherence to industry standards.
The ball terminal form allows for secure connections and efficient heat dissipation, contributing to the overall reliability of the product.
The nominal supply voltage of 0.9V ensures compatibility with standard power sources, making it easier to integrate into existing systems.
With a terminal pitch of 1mm, this product offers precise and consistent spacing for connecting to external components, promoting reliable signal transmission.
Other Function uPs,uCs & Peripheral ICs 10AS027H2F34E2LG attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Intel
Additional Features:
JESD-30 Code:
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10AS027H2F34E2LG Peripheral ICs trade compliance attributes, and parameters.
ECCN
3A991
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - Arria/Cyclone 10 Software Chg 3/Jun/2021 Mult Dev Des/Errata Chgs 16/Aug/2022
PCN Packaging - Mult Dev Label CHG 24/Jan/2020 Mult Dev Label Chgs 24/Feb/2020
Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.
LM317T
Onsemi
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; JESD-30 Code: R-PSFM-T3; Adjustability: ADJUSTABLE; Package Equivalence Code: SIP3,.1TB;
BAV99
Lite-on Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
DS18B20U
Maxim Integrated
DS18B20U by Maxim Integrated is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, offering ±0.5°C accuracy. Suitable for applications requiring digital output and surface mounting feature.
2N2222A
Fairchild Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
1N4148
Taitron Components
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
AT90CAN128-16AU
Atmel
MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: TQFP; Package Shape: SQUARE;
Comchip Technology
ERJ3GEY0R00V
Panasonic
ERJ3GEY0R00V by Panasonic is a SMT fixed resistor with 0 ohm resistance, suitable for jumper applications. It features a metal glaze/thick film technology, rated for temperatures b/w -55 to 155 °C. With a compact rectangular construction and matte tin over nickel terminal finish, it is ideal for surface mount installations in various electronic devices.
SMBJ18CA
Bytesonic Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SS14
General Instrument
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WT
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358MX
ROHM
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: LSOP; Package Shape: RECTANGULAR;
ULN2803ADW
Texas Instruments
ULN2803ADW by Texas Instruments is a peripheral driver with 8 functions, open-collector output characteristics, and built-in transient protections. It operates b/w -40 to 85 °C and has a max supply voltage of 3 V. Ideal for applications requiring buffer or inverter-based peripheral drivers with sink current flow direction.
Good-ark Electronics
RECTIFIER DIODE; Surface Mount: NO; No. of Elements: 1; Maximum Non Repetitive Peak Forward Current: .5 A; Maximum Forward Voltage (VF): 1 V; No. of Phases: 1;
Tak Cheong Electronics Holdings
EU2B-YS2J03F
Idec
ROTARY SWITCH;
Microsemi
LL4148
Changzhou Starsea Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Invensys Sensor Systems
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Reverse Recovery Time: .004 us; Config: SINGLE; Maximum Repetitive Peak Reverse Voltage: 100 V;
LAN8720A-CP-TR
Standard Microsystems
ETHERNET TRANSCEIVER; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
EFR32MG12P432F1024IM48-CR
Silicon Labs
EFR32MG12P432F1024IM48-CR by Silicon Labs is a System on Chip with 48 terminals, operating at temperatures from -40 to 125°C. It has a supply voltage range of 1.8V to 3.8V and utilizes CMOS technology. This chip is ideal for applications requiring low-profile, surface-mount components in various electronic systems.
SCANSTA111MTX/NOPB
SCANSTA111MTX/NOPB by Texas Instruments is a 48-terminal microprocessor circuit with CMOS technology. It operates at 3.3V, suitable for industrial applications with an operating temperature range of -40 to 85°C. This rectangular package IC is surface-mountable and has a max supply voltage of 3.6V, making it ideal for various embedded system designs.
EFR32MG12P432F1024GM48-CR
EFR32MG12P432F1024GM48-CR by Silicon Labs is a System on Chip with 48 terminals, operating b/w -40 to 85°C. It has a supply voltage range of 1.8V to 3.8V and utilizes CMOS technology. This chip carrier with a very thin profile is suitable for various applications requiring low power consumption and compact design.
MCIMX257CJM4A
Freescale Semiconductor
SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE;
MCIMX6Q7CVT08AD
NXP Semiconductors
MCIMX6Q7CVT08AD by NXP Semiconductors is a 624-terminal SoC with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage ranging from 1.275V to 1.5V. Ideal for industrial applications requiring fine-pitch grid array package style.
AX8052F143-3-TX40
AX8052F143-3-TX40 by Onsemi is a 40-terminal IC with max supply voltage of 3.6V, suitable for industrial applications. It operates b/w -40 to 85°C, featuring CMOS technology and no-lead terminal form. Ideal for System on Chip designs, it has a compact rectangular package style with very thin profile and heat sink.
MCP25050-E/P
Microchip Technology
MCP25050-E/P by Microchip Tech: 8-bit microprocessor IC with 5V supply, -40 to 125°C temp range. Automotive grade for CMOS tech applications. Rectangular package, 14 terminals, matte tin finish ideal for automotive electronics.
ATWINC1500-MR210PB1952-T
Microchip's ATWINC1500-MR210PB1952-T is a CMOS network controller with 28 terminals, operating at 2.7-3.6V, ideal for industrial applications. With a compact rectangular package style and surface mount design, it offers a wide temperature range from -40 to 85°C for versatile use in various electronic systems.
AM6251ATGGHAALW
AM6251ATGGHAALW by Texas Instruments is a SoC with 425 terminals in a grid array package. It operates b/w -40 to 105°C, with supply voltage ranging from 0.715V to 0.79V. Ideal for applications requiring very thin profile and fine pitch components.
MIMXRT1173CVM8A
NXP Semiconductors' MIMXRT1173CVM8A is a low-profile, fine-pitch SoC with 289 terminals in a grid array package. It operates b/w -40 to 105°C, with supply voltage ranging from 1.1V to 1.15V. Ideal for applications requiring high-performance uPs and uCs in compact designs.
MTFC8GLVEA-4MIT
Micron Technology
MTFC8GLVEA-4MIT by Micron Technology is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 1.65V to 1.95V. This IC has 153 terminals in a GRID ARRAY package suitable for industrial applications.
MCIMX6Y2DVM09AB
MCIMX6Y2DVM09AB by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-95 °C, with supply voltage range of 1.25-1.3 V. Ideal for applications requiring low profile, fine pitch GRID ARRAY package style.
XCZU7EG-L1FBVB900I
Xilinx
The Xilinx XCZU7EG-L1FBVB900I is a CMOS microprocessor circuit with 900 terminals in a grid array package. It operates b/w -40 to 100 °C and has a supply voltage range of 0.698V to 0.742V. Ideal for industrial applications requiring high-performance processing capabilities.
ASI4UE-G1-SR
Zentrum Mikroelektronik Dresden Ag
Other uPs/uCs/Peripheral ICs;
MCIMX283CVM4BR2
SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;
MCIMX6S7CVM08AC
MCIMX6S7CVM08AC by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C, with a supply voltage range of 1.275V to 1.5V. This low-profile, fine-pitch IC with 624 terminals is ideal for industrial applications requiring high performance in a compact form factor.
LS1046AXE8Q1A
LS1046AXE8Q1A by NXP Semiconductors is a 780-terminal SoC with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 0.97V to 1.03V. Ideal for applications requiring high performance in a compact form factor.
453-00076R
Laird Technologies
SoC;
MCIMX6Q6AVT10AC
SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;
AR1100-I/SO
Microchip Technology's AR1100-I/SO is a CMOS microprocessor circuit with 20 terminals in a small outline package. It operates b/w -40 to 85 °C, with supply voltage ranging from 3.135V to 3.465V. Ideal for industrial applications requiring high-temperature tolerance and compact design.
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10AS066N3F40E2LG
Intel
SoC; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B1517;
10AS048H4F34E3SG
SoC; Terminal Form: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Technology: TSMC;
10AS066H2F34I1HG
SoC; Terminal Form: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel;
10AS016C4U19I3LG
SoC; Terminal Form: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE; Length: 19 mm;
10AS032H3F35E2SG
SoC; Terminal Form: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Minimum Supply Voltage: .87 V;
10AS057K4F40E3SG
SoC; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
10AS016E4F29I3LG
SoC; Terminal Form: BALL; No. of Terminals: 780; Package Code: BGA; Package Shape: SQUARE; Terminal Pitch: 1 mm;
10AS016E4F27E3SG
SoC; Terminal Form: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE; Minimum Operating Temperature: 0 Cel;
10AS016E3F27E2SG
SoC; Terminal Form: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;
10AS027E2F27E2LG
10AS027E3F29E2LG
SoC; Terminal Form: BALL; No. of Terminals: 780; Package Code: BGA; Package Shape: SQUARE; Maximum Operating Temperature: 100 Cel;
10AS016C3U19E2LG
SoC; Terminal Form: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE; Surface Mount: YES;
10AS016E4F29E3SG
SoC; Terminal Form: BALL; No. of Terminals: 780; Package Code: BGA; Package Shape: SQUARE; Length: 29 mm;
10AS048E3F29E2LG
SoC; Terminal Form: BALL; No. of Terminals: 780; Package Code: BGA; Package Shape: SQUARE; Technology: TSMC;
10AS016E4F27E3LG
SoC; Terminal Form: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE; Width: 27 mm;
10AS032E4F29E3SG
SoC; Terminal Form: BALL; No. of Terminals: 780; Package Code: BGA; Package Shape: SQUARE; Package Equivalence Code: BGA780,28X28,40;
10AS057K2F40E1HG
10AS066H4F34E3SG
SoC; Terminal Form: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Terminal Position: BOTTOM;
10AS027H2F34E2SG
10AS027H2F34I1HG
SoC; Terminal Form: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B1152;
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