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10AS066H4F34E3SG

Intel

10AS066H4F34E3SG by Intel

The Intel 10AS066H4F34E3SG is a Peripheral IC with SoC technology, featuring a max supply voltage of 0.93V and min supply voltage of 0.87V. With 1152 terminals in a grid array package style, it is suitable for applications requiring high performance and low power consumption in various electronic devices.

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Chip Stock

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Nova Conductors

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One Stop Electronics

USA . 1,379 parts In-Stock

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$10.000

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Ampacity Inc.

Singapore . 678 parts In-Stock

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Modulus Dynamics

Lithuania . 1,853 parts In-Stock

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MARBEL Systems

Belgium . 1,391 parts In-Stock

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Texas Native Microelectronics

USA . 4,733 parts In-Stock

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$51.838

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Kenton Components

USA . 5,463 parts In-Stock

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Corohmni

South Africa . 280 parts In-Stock

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Component Stockers USA

USA . 475 parts In-Stock

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Advanced Electronics

New Zealand . 4,622 parts In-Stock

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Vigor

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Microchip USA

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Continental Prestige Electronics

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Argo Parts USA

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Supply Digital

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Qasali Group International

UK . 750 parts In-Stock

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Overview

Experience the seamless integration and unparalleled performance of the Intel 10AS066H4F34E3SG. Crafted with precision by industry leader Intel, this cutting-edge product falls under the category of Other Function uPs, uCs & Peripheral ICs, offering a wide range of applications for various industries. With a focus on quality and reliability, Intel ensures that this product exceeds expectations in terms of value, benefits, and advantages for our customers. Elevate your technology experience with Intel's innovative solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides a sturdy and durable housing for the IC, protecting it from external elements and ensuring long-term reliability.

Surface Mount: YES

Being surface mountable allows for easier and more efficient assembly onto circuit boards, saving time and labor costs in manufacturing.

Maximum Supply Voltage: 0.93 V

With a maximum supply voltage of 0.93V, this IC is suitable for low power applications, helping to reduce energy consumption and extend battery life.

Package Shape: SQUARE

The square package shape allows for compact and space-saving integration onto PCBs, making it ideal for designs with limited space constraints.

No. of Terminals: 1152

The high number of terminals provides a wide range of connectivity options, allowing for versatile and complex circuit designs to be implemented.

Package Style (Meter): GRID ARRAY

The grid array package style offers excellent thermal performance and electrical characteristics, contributing to the overall efficiency and reliability of the IC.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0°C, this IC can function effectively in a wide range of environments, from room temperature to colder conditions.

Peripheral IC Type: SoC

As a System-on-Chip (SoC) peripheral IC, this product integrates multiple functions into a single chip, reducing the need for external components and simplifying system design.

Technology: TSMC

Utilizing TSMC technology ensures high performance and reliability, as TSMC is known for its advanced semiconductor manufacturing processes.

Nominal Supply Voltage: 0.9 V

The nominal supply voltage of 0.9V provides a stable operating voltage for the IC, ensuring consistent and reliable performance in various applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs 10AS066H4F34E3SG attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Intel

Specs

JESD-30 Code:

S-PBGA-B1152

Length:

35 mm

No. of Terminals:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA1152,34X34,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

3.35 mm

Maximum Supply Voltage:

.93 V

Minimum Supply Voltage:

.87 V

Nominal Supply Voltage:

.9 V

Surface Mount:

YES

Technology:

TSMC

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

35 mm

Peripheral IC Type:

SoC

Trade Compliance

10AS066H4F34E3SG Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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