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ADSP-SC589KBCZ-5B

Analog Devices

ADSP-SC589KBCZ-5B by Analog Devices

ADSP-SC589KBCZ-5B by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for SPI and UART bus compatibility. It operates b/w 0 to 70 °C, has a low profile GRID ARRAY package style, and features a CMOS technology. Ideal for applications requiring high-speed processing in commercial-grade environments.

Median Price

$75.870

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Analog Devices Inc

USA . 4,308 parts In-Stock

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$75.870

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$49.420

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4,308

$75.870

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$49.420

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Verical

USA . 4,300 parts In-Stock

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4,300

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Digiode

USA . 733 parts In-Stock

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$68.153

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733

$68.153

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Vyrian

USA . 10,575 parts In-Stock

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VNN

France . 4,371 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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Parana Technologies

USA . 635 parts In-Stock

1+ parts

$20.389

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$18.962

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635

$20.389

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$18.962

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IDEA Electronic Components Group

UK . 1,621 parts In-Stock

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$21.924

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$20.828

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1,621

$21.924

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$20.828

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DigiPath Technology Company

USA . 3,052 parts In-Stock

1+ parts

$34.201

100+ parts

$32.833

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$32.833

3,052

$34.201

$32.833

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$32.833

Semicontronic

India . 2,865 parts In-Stock

1+ parts

$47.120

100+ parts

$45.942

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$45.706

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2,865

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$45.942

$45.706

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Ampacity Inc.

Singapore . 1,314 parts In-Stock

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$60.980

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Vigor

Singapore . 43 parts In-Stock

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$64.560

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43

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Corphita

USA . 611 parts In-Stock

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$64.566

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611

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Corohmni

South Africa . 410 parts In-Stock

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$71.721

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410

$71.721

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Microchip USA

USA . 7,279 parts In-Stock

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$178.388

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7,279

$178.388

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Glotronic Ltd.

UK . 132 parts In-Stock

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132

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Netroflash

USA . 100 parts In-Stock

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100

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Overview

Discover the cutting-edge performance and reliability of the ADSP-SC589KBCZ-5B by Analog Devices, a top-tier manufacturer known for delivering high-quality products. This MICROPROCESSOR CIRCUIT is versatile and ideal for various applications. With a maximum clock frequency of 500 MHz and compatibility with SPI and UART buses, this product offers unmatched value and benefits to customers looking for efficient and advanced solutions. Upgrade your technology with this innovative device and experience seamless operations and enhanced functionality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage.

Surface Mount: YES

Surface mounting allows for quick and easy installation onto circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.15 V

The high maximum supply voltage ensures compatibility with various power sources, making the product versatile in different applications.

Package Shape: SQUARE

The square shape allows for efficient use of space on the circuit board, maximizing the overall functionality of the product.

No. of Terminals: 349

The high number of terminals provides ample connectivity options for integrating the product into complex electronic systems.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers a compact design with a high terminal density, ideal for applications where space is limited.

Minimum Supply Voltage: 1.05 V

The low minimum supply voltage ensures efficient power consumption, making the product energy-efficient and cost-effective to operate.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, the product can withstand elevated levels of heat without compromising performance, ensuring reliability in harsh environments.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows the product to function effectively in colder conditions, expanding its usability in various settings.

Terminal Position: BOTTOM

The terminal position at the bottom facilitates easy connection to other components on the circuit board, enhancing the overall assembly process.

Maximum Seated Height: 1.5 mm

The low maximum seated height profile enables compact device designs, reducing the overall size and weight of the product.

Width: 19 mm

With a moderate width, the product can fit comfortably within standard spacing constraints on circuit boards, allowing for seamless integration with other components.

Maximum Clock Frequency: 500 MHz

The high maximum clock frequency provides fast processing speeds, enabling quick data transmission and efficient operation of the product.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures the product can withstand the soldering process during manufacturing, leading to reliable and robust connections.

Length: 19 mm

The moderate length of the product allows for flexible placement on the circuit board, accommodating various layout configurations for optimal performance.

Temperature Grade: COMMERCIAL

Designed for commercial applications, the product meets industry standards for performance and reliability, making it a suitable choice for a wide range of projects.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

As a microprocessor circuit, the product offers advanced computing capabilities, enabling complex tasks and functionalities to be executed efficiently.

Technology: CMOS

Using CMOS technology ensures low power consumption and high noise immunity, enhancing the product's efficiency and reliability in various operating conditions.

Terminal Form: BALL

The ball terminal form provides reliable and secure connections, reducing the risk of signal loss or interference during operation.

Nominal Supply Voltage: 1.1 V

With a stable nominal supply voltage, the product maintains consistent performance levels, ensuring reliable operation over extended periods.

Bus Compatibility: SPI; UART

Supporting SPI and UART bus protocols enables seamless communication with a wide range of devices, enhancing the product's connectivity and versatility.

Terminal Pitch: 0.8 mm

The small terminal pitch allows for high-density mounting on the circuit board, maximizing space utilization and enabling efficient signal routing.

Moisture Sensitivity Level (MSL): 3

With a moderate moisture sensitivity level, the product can withstand exposure to environmental conditions, ensuring long-term reliability and performance.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs ADSP-SC589KBCZ-5B attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Analog Devices

Specs

Bus Compatibility:

SPI; UART

Maximum Clock Frequency:

500 MHz

JESD-30 Code:

S-PBGA-B349

Length:

19 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

349

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA529,23X23,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.5 mm

Maximum Supply Voltage:

1.15 V

Minimum Supply Voltage:

1.05 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

19 mm

Peripheral IC Type:

Trade Compliance

ADSP-SC589KBCZ-5B Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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