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MIMX8DX2AVLFZAC

NXP Semiconductors

MIMX8DX2AVLFZAC by NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 609; Package Code: FBGA; Package Shape: SQUARE;

Median Price

$69.899

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

EBV Elektronik

Germany . 18,840 parts In-Stock

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Verical

USA . 9,960 parts In-Stock

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$69.899

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$69.899

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

TME

Poland . 18,840 parts In-Stock

1+ parts

-

100+ parts

$81.820

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18,840

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$81.820

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Vyrian

USA . 2,465 parts In-Stock

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Anansix

USA . 457 parts In-Stock

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457

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Digiode

USA . 311 parts In-Stock

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311

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Distributors (Availability)

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AZTECH Wire

Italy . 198 parts In-Stock

1+ parts

$8.160

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198

$8.160

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One Stop Electronics

USA . 730 parts In-Stock

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$20.000

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730

$20.000

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Corohmni

South Africa . 12 parts In-Stock

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$84.674

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12

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Microchip USA

USA . 1,362 parts In-Stock

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$179.609

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1,362

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UNI Independent Distributors

Spain . 6,127 parts In-Stock

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Corphita

USA . 2,926 parts In-Stock

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Technical Specifications

Other Function uPs,uCs & Peripheral ICs MIMX8DX2AVLFZAC attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B609

JESD-609 Code:

e2

Length:

21 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

609

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA609,35X35,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.52 mm

Maximum Supply Voltage:

1.15 V

Minimum Supply Voltage:

1.05 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

21 mm

Peripheral IC Type:

Trade Compliance

MIMX8DX2AVLFZAC Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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