Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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AGFA006R16A3E3V by Intel is a rectangular-shaped SoC FPGA with 1546 terminals. It operates b/w 0°C to 100°C and is surface mountable. This IC is commonly used in various applications requiring other function uPs, uCs, and peripheral integration.
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The product is designed to handle various functions related to microprocessors, microcontrollers, and peripheral integrated circuits. This means that it can provide a high level of versatility and functionality for customers, allowing them to meet their specific needs efficiently. This contributes to the overall value of the product by providing a comprehensive solution for a wide range of applications.
The product is made with plastic/epoxy material, which offers excellent durability and protection. This ensures that the product can withstand harsh environments and provides long-lasting performance for customers. The sturdy package body material enhances the longevity and reliability of the product, increasing its overall value.
The product is designed for surface mount installation, offering a convenient and efficient installation process for customers. This eliminates the need for complex and time-consuming installation methods, saving valuable time and effort. The surface mount capability enhances the usability and ease of integration of the product, adding value for customers.
The rectangular package shape of the product allows for easy placement and mounting in various devices and systems. This design feature enables efficient use of space, making it ideal for compact applications. The rectangular shape contributes to the overall value of the product by enhancing its compatibility and flexibility for different customer requirements.
With a high number of terminals, the product offers extensive connectivity options for customers. This allows for versatile and comprehensive integration within various systems and architectures. The abundant number of terminals increases the versatility and adaptability of the product, providing value by accommodating a wide range of customer needs.
The product can operate at a maximum temperature of 100°C, ensuring reliable performance even in demanding conditions. This high maximum operating temperature capability makes the product suitable for applications that require sustained and consistent performance under elevated temperatures. The ability to withstand high operating temperatures enhances the reliability and durability of the product, contributing to its overall value.
The product has a minimum operating temperature of 0°C, allowing it to function in colder environments. This flexibility in temperature range ensures that customers can rely on the product's performance in various operating conditions. The ability to operate in low temperatures expands the usability and reliability of the product, adding value for customers.
The product features terminals positioned at the bottom, facilitating easy and efficient connections. This terminal positioning allows for straightforward integration with other components and systems, simplifying the installation process for customers. The bottom terminal position enhances the usability and convenience of the product, contributing to its overall value.
The product is classified as a System-on-Chip (SoC) Field-Programmable Gate Array (FPGA), combining multiple functions into a single integrated circuit. This integration offers improved efficiency, reduced complexity, and enhanced performance for customers. The SoC FPGA type provides a comprehensive solution in a compact form factor, maximizing the value and functionality of the product.
The product features ball terminal forms, which provide reliable electrical connections and facilitate efficient soldering processes. This terminal form ensures secure and stable connections, minimizing the risk of disconnections or malfunctions. The ball terminal form enhances the overall reliability and quality of the product, delivering value to customers.
Other Function uPs,uCs & Peripheral ICs AGFA006R16A3E3V attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Intel
JESD-30 Code:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Shape:
Surface Mount:
Terminal Form:
Terminal Position:
Peripheral IC Type:
AGFA006R16A3E3V Peripheral ICs trade compliance attributes, and parameters.
HTS
8542.31.00.01
SB
8542.31.00.00
PCN Design/Specification - Datasheet Update 20/Mar/2023
PCN Other - Guidelines Update 12/APR/2023
Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.
SN65HVD230DR
Texas Instruments
SN65HVD230DR by Texas Instruments is a BICMOS technology interface circuit with 1Mbps data rate, suitable for industrial applications. It operates at 3.3V, has 8 terminals in a small outline package, and can withstand temperatures from -40 to 85°C.
CRGCQ0805F10R
TE Connectivity
TE Connectivity's CRGCQ0805F10R is a 10 ohm fixed resistor with 1% tolerance and 400 ppm/°C temperature coefficient. It is a surface mount thick film resistor in an 0805 package, suitable for applications requiring precise resistance values in compact electronic circuits.
DS18B20U
Maxim Integrated
DS18B20U by Maxim Integrated is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, offering ±0.5°C accuracy. Suitable for applications requiring digital output and surface mounting feature.
BSS138
Panjit International
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 3 ohm; Minimum DS Breakdown Voltage: 50 V; Terminal Form: GULL WING;
M24308/2-1F
Adi Electronics
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; MIL Conformity: YES; Filter Feature: NO; Mating Info.: MULTIPLE MATING PARTS AVAILABLE;
BAV99
Vishay Telefunken
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Infineon Technologies
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LL4148
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BSS138-TP
Micro Commercial Components
BSS138-TP by Micro Commercial Components is a N-channel small signal FET with a min DS breakdown voltage of 50V and max drain current of 0.22A. It is commonly used in applications requiring enhancement mode operation, such as power management and switching circuits.
SZNUP2105LT1G
Onsemi
SZNUP2105LT1G by Onsemi is a Transient Suppression Device with 2 elements in a common anode configuration. It has a max non-repetitive peak reverse power dissipation of 350W and breakdown voltage of 29.1V. Ideal for applications requiring bidirectional polarity protection, such as automotive electronics and industrial equipment due to its AEC-Q101 compliance and high clamping voltage of 44V.
National Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .5 A;
PIC18F4550-I/PT
Microchip Technology
PIC18F4550-I/PT by Microchip: 8-bit microcontroller with 44 terminals, 48 MHz clock frequency, and USB connectivity. Ideal for industrial applications requiring low power mode and 10-bit ADC channels.
1N4148
International Components
RECTIFIER DIODE; Surface Mount: NO; No. of Elements: 1; Terminal Finish: Tin/Lead (Sn/Pb); JESD-609 Code: e0; Maximum Reverse Recovery Time: .004 us;
ULN-2803A
Sprague Electric
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR;
Taiwan Semiconductor
2N7002
Rectron
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Operating Mode: ENHANCEMENT MODE; Maximum Operating Temperature: 150 Cel; Terminal Form: GULL WING;
SS14
Taitron Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Meritek Electronics
RC0402FR-071KL
Yageo
The Yageo RC0402FR-071KL is a fixed resistor with a resistance of 1000 ohm and a tolerance of 1%. It is suitable for surface mount applications and has a max operating temperature of 155 °C.
SMBJ18CA
Bourns
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MCIMX6S5EVM10AB
Freescale Semiconductor
SoC; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE; Qualification: Not Qualified;
ESP32-S3-WROOM-1-N16R8
Espressif Systems (Shanghai)
ESP32-S3-WROOM-1-N16R8 by Espressif Systems is a SoC with 41 terminals, operating at 3.3V nominal voltage and up to 65°C. Its compact MICROELECTRONIC ASSEMBLY package makes it suitable for IoT devices requiring low power consumption and high performance in a small form factor. With a max supply voltage of 3.6V, it is ideal for applications where space constraints are critical.
SLB9670XQ20FW763XUMA1
SLB9670XQ20FW763XUMA1 by Infineon Technologies is a cryptographic authenticator IC with CMOS technology. It operates b/w -40 to 85°C, with supply voltage range of 1.65V to 1.95V. This chip carrier has 32 terminals and is suitable for industrial applications requiring secure authentication.
MCIMX6Q7CVT08AD
NXP Semiconductors
MCIMX6Q7CVT08AD by NXP Semiconductors is a 624-terminal SoC with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage ranging from 1.275V to 1.5V. Ideal for industrial applications requiring fine-pitch grid array package style.
DA16200MOD-AAC4WA32
Renesas Electronics
SYSTEM ON CHIP; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260;
KSZ8463RLI
Micrel
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: QFP; Package Shape: SQUARE;
ASI4UE-G1-SR
Zentrum Mikroelektronik Dresden Ag
Other uPs/uCs/Peripheral ICs;
CY8C21434-24LKXIT
Cypress Semiconductor
CY8C21434-24LKXIT by Cypress is a 32-terminal, CMOS technology Programmable SoC with 5V nominal voltage. It operates b/w -40 to 85 °C and has a max seated height of 0.6mm. Ideal for industrial applications requiring low power consumption and high performance in a compact square package style.
ATECC608B-RBHCZ-B
Microchip ATECC608B-RBHCZ-B is a cryptographic authenticator IC with 1-Wire bus compatibility. It operates b/w -40 to 85 °C, suitable for industrial applications. With a supply voltage range of 2-5.5 V, it comes in a very thin profile chip carrier package.
ESP32-WROOM-32UE-N16
ESP32-WROOM-32UE-N16 by Espressif Systems is a 38-terminal SoC with 3.3V nominal voltage, CMOS technology, and -40 to 85°C operating temperature range. Ideal for IoT applications requiring low power consumption and compact design in microelectronic assemblies.
MCIMX6X4CVM08AB
SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 529; Package Code: LFBGA; Package Shape: SQUARE;
1436
Ndk America
NRF52811-CAAA-R
Nordic Semiconductor Asa
NRF52811-CAAA-R by Nordic Semiconductor Asa is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 1.7V to 3.6V. This IC is ideal for applications requiring a compact GRID ARRAY package with very thin profile and fine pitch terminals.
MCIMX535DVV1C
SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 529; Package Code: FBGA; Package Shape: SQUARE;
XC7Z035-L2FBG676I
Xilinx
The Xilinx XC7Z035-L2FBG676I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With 676 terminals in a grid array package style, it's ideal for applications requiring high-performance processing in compact spaces.
LS1021AXE7KQB
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 525; Package Code: HBGA; Package Shape: SQUARE; Nominal Supply Voltage: 1 V;
PN5321A3HN/C106,55
NXP Semiconductors' PN5321A3HN/C106,55 is a 40-terminal chip carrier with 3/5V power supplies. It operates b/w -30 to 85°C, has a peak reflow temp of 260°C, and consumes up to 150mA. Ideal for applications requiring NFC functionality like contactless payment systems and access control devices.
ATECC608B-SSHDA-B
Microchip ATECC608B-SSHDA-B is a cryptographic authenticator IC with I2C bus compatibility. It operates b/w -40 to 85°C, has 8 terminals, and supports supply voltage from 2V to 5.5V. Ideal for secure applications in industrial settings due to its compact size and CMOS technology.
MIMXRT1061CVJ5A
The NXP Semiconductors MIMXRT1061CVJ5A is a low-profile, fine-pitch grid array SoC with 196 terminals. It operates in industrial temperatures from -40 to 105°C and has a supply voltage range of 1.15V to 1.26V. Ideal for applications requiring high-performance computing in compact spaces.
MCP2221T-I/ST
MCP2221T-I/ST by Microchip: 3.3/5V supply, -40 to 85°C temp range, 14 terminals for industrial applications. CMOS technology with dual terminal position and matte tin finish. Ideal for microprocessor circuits in small outline package style.
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AGFA006R16A2E3V
Intel
SoC FPGA; Terminal Form: BALL; No. of Terminals: 1546; Package Shape: RECTANGULAR; Maximum Operating Temperature: 100 Cel; Terminal Position: BOTTOM;
AGFA027R24C2E3E
SoC FPGA; Terminal Form: BALL; No. of Terminals: 2340; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY; Maximum Operating Temperature: 100 Cel;
AGFA006R16A2E2V
SoC FPGA; Terminal Form: BALL; No. of Terminals: 1546; Package Shape: RECTANGULAR; Maximum Operating Temperature: 100 Cel; Minimum Operating Temperature: 0 Cel;
AGFA006R16A2I3E
SoC FPGA; Terminal Form: BALL; No. of Terminals: 1546; Package Shape: RECTANGULAR; Terminal Position: BOTTOM; Package Body Material: PLASTIC/EPOXY;
AGFA006R16A2I2V
SoC FPGA; Terminal Form: BALL; No. of Terminals: 1546; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B1546; Package Body Material: PLASTIC/EPOXY;
AGFA006R16A3I3E
AGFA006R16A2E1V
SoC FPGA; Terminal Form: BALL; No. of Terminals: 1546; Package Shape: RECTANGULAR; Surface Mount: YES; JESD-30 Code: R-PBGA-B1546;
AGFA006R16A2E3E
SoC FPGA; Terminal Form: BALL; No. of Terminals: 1546; Package Shape: RECTANGULAR; Surface Mount: YES; Minimum Operating Temperature: 0 Cel;
AGFA006R16A3E3E
AGFA006R16A3E4F
SoC FPGA; Terminal Form: BALL; No. of Terminals: 1546; Package Shape: RECTANGULAR; Nominal Supply Voltage: .8 V; Surface Mount: YES;
AGFA006R16A3I3V
AGFA006R16A2I3V
SoC FPGA; Terminal Form: BALL; No. of Terminals: 1546; Package Shape: RECTANGULAR; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY;
AGFA006R24C2E4F
SoC FPGA; Terminal Form: BALL; No. of Terminals: 2340; Package Shape: RECTANGULAR; Maximum Supply Voltage: .824 V; JESD-30 Code: R-PBGA-B2340;
AGFA006R24C2I1V
SoC FPGA; Terminal Form: BALL; No. of Terminals: 2340; Package Shape: RECTANGULAR; Terminal Position: BOTTOM; JESD-30 Code: R-PBGA-B2340;
AGFA006R24C3E3E
SoC FPGA; Terminal Form: BALL; No. of Terminals: 2340; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B2340; Package Body Material: PLASTIC/EPOXY;
AGFA006R24C2E2V
SoC FPGA; Terminal Form: BALL; No. of Terminals: 2340; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY; JESD-30 Code: R-PBGA-B2340;
AGFA006R24C3I3E
SoC FPGA; Terminal Form: BALL; No. of Terminals: 2340; Package Shape: RECTANGULAR; Terminal Position: BOTTOM; Maximum Operating Temperature: 100 Cel;
AGFA006R24C2I2V
SoC FPGA; Terminal Form: BALL; No. of Terminals: 2340; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY; Minimum Operating Temperature: -40 Cel;
AGFA006R24C2E1V
SoC FPGA; Terminal Form: BALL; No. of Terminals: 2340; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY; Terminal Position: BOTTOM;
AGFA006R24C2E3E
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