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AGFA006R16A3E3V

Intel

AGFA006R16A3E3V by Intel

AGFA006R16A3E3V by Intel is a rectangular-shaped SoC FPGA with 1546 terminals. It operates b/w 0°C to 100°C and is surface mountable. This IC is commonly used in various applications requiring other function uPs, uCs, and peripheral integration.

Median Price

$11,896.510

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 1,000 parts In-Stock

1+ parts

$11,896.510

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1,000

$11,896.510

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VNN

France . 22,224 parts In-Stock

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22,224

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Vyrian

USA . 4,290 parts In-Stock

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4,290

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Digiode

USA . 173 parts In-Stock

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173

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 694 parts In-Stock

1+ parts

$8.199

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694

$8.199

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Ampacity Inc.

Singapore . 1,521 parts In-Stock

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$33.000

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1,521

$33.000

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MARBEL Systems

Belgium . 12,707 parts In-Stock

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$57.981

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$55.662

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12,707

$57.981

$55.662

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Texas Native Microelectronics

USA . 1,381 parts In-Stock

1+ parts

$66.645

100+ parts

$63.979

1k+ parts

$61.980

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1,381

$66.645

$63.979

$61.980

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Kenton Components

USA . 337 parts In-Stock

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$79.974

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$70.377

337

$79.974

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$70.377

Microchip USA

USA . 420 parts In-Stock

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$11,897.010

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420

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Corphita

USA . 157 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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100+ parts

$11,658.580

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$11,301.684

10k+ parts

$11,063.754

100

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$11,658.580

$11,301.684

$11,063.754

Qasali Group International

UK . 10 parts In-Stock

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100+ parts

$172.744

1k+ parts

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$158.349

10

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$172.744

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$158.349

Overview

Experience cutting-edge technology with the AGFA006R16A3E3V by Intel! This high-quality product is manufactured by Intel, a renowned leader in the industry, ensuring unmatched performance and reliability. Designed for various applications in the Other Function uPs, uCs & Peripheral ICs category, this device offers exceptional value to customers. With its innovative features and advanced functionality, it provides numerous benefits and advantages. Whether you're looking for superior processing power, increased efficiency, or seamless integration, the AGFA006R16A3E3V delivers it all. Upgrade your systems today and unleash the full potential of your devices with Intel's AGFA006R16A3E3V!

Feature Benefit Bullets

Function uPs,uCs & Peripheral ICs:

The product is designed to handle various functions related to microprocessors, microcontrollers, and peripheral integrated circuits. This means that it can provide a high level of versatility and functionality for customers, allowing them to meet their specific needs efficiently. This contributes to the overall value of the product by providing a comprehensive solution for a wide range of applications.

Package Body Material: PLASTIC/EPOXY:

The product is made with plastic/epoxy material, which offers excellent durability and protection. This ensures that the product can withstand harsh environments and provides long-lasting performance for customers. The sturdy package body material enhances the longevity and reliability of the product, increasing its overall value.

Surface Mount: YES:

The product is designed for surface mount installation, offering a convenient and efficient installation process for customers. This eliminates the need for complex and time-consuming installation methods, saving valuable time and effort. The surface mount capability enhances the usability and ease of integration of the product, adding value for customers.

Package Shape: RECTANGULAR:

The rectangular package shape of the product allows for easy placement and mounting in various devices and systems. This design feature enables efficient use of space, making it ideal for compact applications. The rectangular shape contributes to the overall value of the product by enhancing its compatibility and flexibility for different customer requirements.

No. of Terminals: 1546:

With a high number of terminals, the product offers extensive connectivity options for customers. This allows for versatile and comprehensive integration within various systems and architectures. The abundant number of terminals increases the versatility and adaptability of the product, providing value by accommodating a wide range of customer needs.

Maximum Operating Temperature: 100 °C:

The product can operate at a maximum temperature of 100°C, ensuring reliable performance even in demanding conditions. This high maximum operating temperature capability makes the product suitable for applications that require sustained and consistent performance under elevated temperatures. The ability to withstand high operating temperatures enhances the reliability and durability of the product, contributing to its overall value.

Minimum Operating Temperature: 0 °C:

The product has a minimum operating temperature of 0°C, allowing it to function in colder environments. This flexibility in temperature range ensures that customers can rely on the product's performance in various operating conditions. The ability to operate in low temperatures expands the usability and reliability of the product, adding value for customers.

Terminal Position: BOTTOM:

The product features terminals positioned at the bottom, facilitating easy and efficient connections. This terminal positioning allows for straightforward integration with other components and systems, simplifying the installation process for customers. The bottom terminal position enhances the usability and convenience of the product, contributing to its overall value.

Peripheral IC Type: SoC FPGA:

The product is classified as a System-on-Chip (SoC) Field-Programmable Gate Array (FPGA), combining multiple functions into a single integrated circuit. This integration offers improved efficiency, reduced complexity, and enhanced performance for customers. The SoC FPGA type provides a comprehensive solution in a compact form factor, maximizing the value and functionality of the product.

Terminal Form: BALL:

The product features ball terminal forms, which provide reliable electrical connections and facilitate efficient soldering processes. This terminal form ensures secure and stable connections, minimizing the risk of disconnections or malfunctions. The ball terminal form enhances the overall reliability and quality of the product, delivering value to customers.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AGFA006R16A3E3V attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Intel

Specs

JESD-30 Code:

R-PBGA-B1546

No. of Terminals:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Surface Mount:

YES

Terminal Form:

Terminal Position:

BOTTOM

Peripheral IC Type:

Trade Compliance

AGFA006R16A3E3V Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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