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LS1043ASE7MNLB

NXP Semiconductors

LS1043ASE7MNLB by NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: HFBGA; Package Shape: SQUARE;

Median Price

$74.162

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 100 parts In-Stock

1+ parts

$93.140

100+ parts

$71.030

1k+ parts

$69.217

10k+ parts

-

100

$93.140

$71.030

$69.217

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Rochester

USA . 817 parts In-Stock

1+ parts

-

100+ parts

$59.330

1k+ parts

$53.080

10k+ parts

$49.960

817

-

$59.330

$53.080

$49.960

Verical

USA . 540 parts In-Stock

1+ parts

-

100+ parts

$74.162

1k+ parts

$66.350

10k+ parts

$62.450

540

-

$74.162

$66.350

$62.450

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,178 parts In-Stock

1+ parts

$62.614

100+ parts

-

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3,178

$62.614

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Vyrian

USA . 4,050 parts In-Stock

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4,050

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Anansix

USA . 1,266 parts In-Stock

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1,266

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Flip Electronics

USA . 800 parts In-Stock

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800

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 2,046 parts In-Stock

1+ parts

$22.671

100+ parts

-

1k+ parts

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2,046

$22.671

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Corphita

USA . 1,607 parts In-Stock

1+ parts

$59.319

100+ parts

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1,607

$59.319

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Vigor

Singapore . 120 parts In-Stock

1+ parts

$94.570

100+ parts

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120

$94.570

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Microchip USA

USA . 2,225 parts In-Stock

1+ parts

$210.887

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2,225

$210.887

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QUARKTWIN TECHNOLOGY LTD

USA . 16,373 parts In-Stock

1+ parts

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16,373

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UNI Independent Distributors

Spain . 5,448 parts In-Stock

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5,448

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Alle Elektronik GmbH

Germany . 5,076 parts In-Stock

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5,076

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Technical Specifications

Other Function uPs,uCs & Peripheral ICs LS1043ASE7MNLB attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B621

JESD-609 Code:

e1

Length:

21 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

621

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA621,25X25,32

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

Peak Reflow Temperature (C):

250

Maximum Seated Height:

2.07 mm

Maximum Supply Voltage:

.93 V

Minimum Supply Voltage:

.87 V

Nominal Supply Voltage:

.9 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

21 mm

Peripheral IC Type:

Trade Compliance

LS1043ASE7MNLB Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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