Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
Add filters
All
Selected
LS1043ASN7KNLB
NXP Semiconductors
SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: HFBGA; Package Shape: SQUARE;
S-PBGA-B621
e1
21 mm
3
621
105 Cel
0 Cel
PLASTIC/EPOXY
HFBGA
BGA621,25X25,32
SQUARE
GRID ARRAY, HEAT SINK/SLUG, FINE PITCH
250
2.07 mm
.93 V
.87 V
.9 V
YES
CMOS
INDUSTRIAL
TIN SILVER COPPER
BALL
.8 mm
BOTTOM
30
SYSTEM ON CHIP
LS1043ASN8MNLB
SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: HFBGA; Package Shape: SQUARE;
S-PBGA-B780
23 mm
780
BGA780,28X28,32
MIMXRT1064CVL5B
NXP Semiconductors' MIMXRT1064CVL5B is a SoC with CMOS technology, featuring 196 terminals in a low-profile grid array package. Operating from -40 to 105 °C, it supports a supply voltage range of 1.15-1.26 V for industrial applications requiring high performance and reliability.
S-PBGA-B196
10 mm
196
-40 Cel
LFBGA
BGA196,14X14,25
GRID ARRAY, LOW PROFILE, FINE PITCH
260
1.43 mm
1.26 V
1.15 V
.65 mm
40
SoC
LS1043ABE9MQB
SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: HFBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B780;
LS1043ACE9MQB
WP32C2W6NFEI-400B2
Microchip Technology
WP32C2W6NFEI-400B2 by Microchip Technology is a CMOS microprocessor circuit with 896 terminals in a grid array package. It features tin silver copper terminal finish and ball terminal form, suitable for various applications requiring high-performance processing capabilities in a compact square package. Ideal for use in advanced electronic devices where space-saving design and efficient processing are essential.
S-PBGA-B896
896
BGA
BGA896(UNSPEC)
GRID ARRAY
MICROPROCESSOR CIRCUIT
MIMXRT1175CVM8A
The NXP MIMXRT1175CVM8A is a SoC peripheral IC with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 1.1-1.15 V. Its grid array package has 289 terminals and measures 14x14 mm, making it suitable for various embedded applications.
S-PBGA-B289
14 mm
289
BGA289,17X17,32
1.52 mm
1.1 V
MIMXRT1171CVM8A
The NXP Semiconductors MIMXRT1171CVM8A is a SoC with CMOS technology, featuring 289 terminals in a low-profile grid array package. Operating b/w -40 to 105°C, it has a supply voltage range of 1.1-1.15V and peak reflow temperature of 260°C. Ideal for applications requiring high-performance microcontrollers in compact form factors.
MIMXRT1172CVM8A
NXP Semiconductors' MIMXRT1172CVM8A is a low-profile, fine-pitch SoC with 289 terminals. Operating b/w -40 to 105°C, it supports a supply voltage range of 1.1-1.15V. Ideal for applications requiring high-performance uPs/uCs in compact form factors.
MIMXRT1173CVM8A
NXP Semiconductors' MIMXRT1173CVM8A is a low-profile, fine-pitch SoC with 289 terminals in a grid array package. It operates b/w -40 to 105°C, with supply voltage ranging from 1.1V to 1.15V. Ideal for applications requiring high-performance uPs and uCs in compact designs.
MCIMX6Y2CVM05ABR
MCIMX6Y2CVM05ABR by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 289 terminals. Operating at -40 to 105°C, it supports a voltage range of 1.275-1.5V and features tin silver copper terminal finish. Ideal for industrial applications requiring high-performance computing in compact spaces.
1.32 mm
1.5 V
1.275 V
MCIMX536AVP8C2
MCIMX536AVP8C2 by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 125 °C, with supply voltage range of 1.05V to 1.15V. Ideal for automotive applications due to AEC-Q100 screening level and fine pitch grid array package style.
S-PBGA-B529
e2
19 mm
529
125 Cel
FBGA
BGA529,23X23,32
GRID ARRAY, FINE PITCH
AEC-Q100
1.85 mm
1.05 V
AUTOMOTIVE
TIN SILVER
MCIMX534AVP8C2
MCIMX534AVP8C2 by NXP Semiconductors is a 529-terminal SoC with CMOS technology. It operates b/w -40 to 125 °C, suitable for automotive applications. With a supply voltage range of 1.05V to 1.15V, it features a fine pitch grid array package style for surface mount assembly.
MCIMX6U6AVM08ADR
SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;
S-PBGA-B624
624
BGA624,25X25,32
1.6 mm
XCVM1402-1LSEVSVD1760
Xilinx
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: HBGA; Package Shape: SQUARE; Surface Mount: YES;
S-PBGA-B1760
40 mm
1760
100 Cel
HBGA
BGA1760,42X42,36
GRID ARRAY, HEAT SINK/SLUG
4 mm
.724 V
.676 V
.7 V
.92 mm
XCVM1402-1MLIVSVD1760
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: HBGA; Package Shape: SQUARE; Terminal Position: BOTTOM;
110 Cel
.825 V
.775 V
.8 V
XCVM1402-1MSIVSVD1760
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: HBGA; Package Shape: SQUARE; Terminal Pitch: .92 mm;
XCVM1402-2LLEVFVC1596
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
S-PBGA-B1596
37.5 mm
1596
BGA1596,40X40,36
3.75 mm
XCVM1402-2MLEVFVC1596
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: BGA; Package Shape: SQUARE; Package Equivalence Code: BGA1596,40X40,36;
XCVM1402-2MLEVSVD1760
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: HBGA; Package Shape: SQUARE; Maximum Seated Height: 4 mm;
XCVM1402-2MSEVSVD1760
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: HBGA; Package Shape: SQUARE; Nominal Supply Voltage: .8 V;
XCVM1402-2MSIVFVC1596
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B1596;
XCVM1502-1LLIVFVC1760
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE; Maximum Operating Temperature: 110 Cel;
XCVM1502-1LSIVFVC1760
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: .724 V;
XCVM1502-2LSEVFVC1760
XCVM1502-2MLEVFVC1760
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE; Minimum Supply Voltage: .775 V;
XCVM1802-1LSIVFVC1760
3.89 mm
XCVM1802-1MSEVSVA2197
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2197; Package Code: HBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG;
S-PBGA-B2197
45 mm
2197
BGA2197,47X47,36
XCVM1802-1MSEVSVD1760
XCVM1802-1MSEVSVD1760 by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.775-0.825 V. This GRID ARRAY IC is ideal for applications requiring high performance in a compact 40x40 mm package.
XCVM1802-1MSIVFVC1760
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;
XCVM1802-1MSIVSVA2197
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2197; Package Code: HBGA; Package Shape: SQUARE; Minimum Supply Voltage: .775 V;
XCVM1802-2MLEVSVA2197
XCVM1802-2MLEVSVA2197 by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-110 °C, with supply voltage range of 0.775-0.825 V. This GRID ARRAY IC is ideal for applications requiring high performance and reliability in compact spaces.
XCVM1802-2MLIVSVA2197
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2197; Package Code: HBGA; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel;
XCVM1802-2MSEVFVC1760
XCVM1802-2MSEVSVA2197
XCVM1802-2MSEVSVA2197 by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-110 °C, with supply voltage range of 0.775-0.825 V. This GRID ARRAY IC is ideal for applications requiring high performance and compact design.
XCVM1802-2MSEVSVD1760
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: HBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
XCVM1802-2MSIVSVD1760
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: HBGA; Package Shape: SQUARE; Minimum Supply Voltage: .775 V;
XCVM1402-1LSIVFVC1596
XCVM1402-1MSIVFVC1596
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage: .8 V;
XCVM1402-2LSEVSVD1760
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: HBGA; Package Shape: SQUARE; Nominal Supply Voltage: .7 V;
XCVM1502-2LLEVFVC1760
XCVM1802-1LLIVFVC1760
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage: .7 V;
XCVM1802-1LSEVSVA2197
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2197; Package Code: HBGA; Package Shape: SQUARE; Technology: CMOS;
XCVM1802-1MLIVSVA2197
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2197; Package Code: HBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B2197;
XCVM1802-2LSEVSVD1760
XCVM1802-2MLEVFVC1760
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage: .8 V;
XCVM1802-2MLEVSVD1760
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: HBGA; Package Shape: SQUARE; Maximum Supply Voltage: .825 V;
XCVM1802-2MLIVFVC1760
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE; Terminal Position: BOTTOM;
© 2023 All rights reserved
