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MCIMX534AVP8C2

NXP Semiconductors

MCIMX534AVP8C2 by NXP Semiconductors

MCIMX534AVP8C2 by NXP Semiconductors is a 529-terminal SoC with CMOS technology. It operates b/w -40 to 125 °C, suitable for automotive applications. With a supply voltage range of 1.05V to 1.15V, it features a fine pitch grid array package style for surface mount assembly.

Median Price

$48.900

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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Verical

USA . 9,660 parts In-Stock

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Digiode

USA . 3,122 parts In-Stock

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Vyrian

USA . 2,898 parts In-Stock

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Anansix

USA . 2,039 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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100

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AZTECH Wire

Italy . 50 parts In-Stock

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$11.330

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Ampacity Inc.

Singapore . 1,192 parts In-Stock

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$24.000

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One Stop Electronics

USA . 247 parts In-Stock

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$29.000

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Corohmni

South Africa . 358 parts In-Stock

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$60.409

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Modulus Dynamics

Lithuania . 2,696 parts In-Stock

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$75.767

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$75.767

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Microchip USA

USA . 2,832 parts In-Stock

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UNI Independent Distributors

Spain . 8,213 parts In-Stock

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Corphita

USA . 4,251 parts In-Stock

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Argo Parts USA

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Continental Prestige Electronics

USA . 3,146 parts In-Stock

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Authorized Procurement Solutions

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Aranea Global

USA . 1,000 parts In-Stock

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Overview

Elevate your automotive electronics with the MCIMX534AVP8C2 from NXP Semiconductors. This cutting-edge SoC offers unmatched performance and reliability, ensuring seamless integration into various applications. With a wide temperature range and advanced technology, this product provides exceptional value and efficiency for customers looking to enhance their systems. Trust in NXP Semiconductors' reputation for quality and innovation, and experience the benefits of superior functionality and ease of use with the MCIMX534AVP8C2.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes the product lightweight and durable, suitable for automotive applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on PCBs, saving space and enhancing design flexibility.

Maximum Supply Voltage: 1.15 V

The high maximum supply voltage ensures compatibility with a wide range of power sources, increasing versatility in application scenarios.

Screening Level: AEC-Q100

This indicates that the product has undergone rigorous testing for automotive applications, ensuring reliability and quality under harsh operating conditions.

Package Shape: SQUARE

The square package shape allows for efficient use of space on PCBs, enabling dense integration of components for compact designs.

No. of Terminals: 529

The high number of terminals allows for connectivity to a variety of external components, enhancing the product's functionality and versatility.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array, fine pitch package style enables high-density mounting and reliable connections, making it suitable for complex electronic systems.

Minimum Supply Voltage: 1.05 V

The low minimum supply voltage ensures efficient operation in low-power scenarios, increasing energy efficiency and extending battery life.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature range allows the product to withstand extreme heat conditions, making it suitable for automotive environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range ensures reliable performance in cold environments, making the product suitable for a wide range of applications.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy PCB mounting and soldering, simplifying the assembly process.

Maximum Seated Height: 1.85 mm

The low maximum seated height enables flat and compact PCB designs, reducing overall system size and enhancing portability.

Width: 19 mm

The compact width of 19 mm allows for space-efficient placement on PCBs, enabling sleek and modern device designs.

Length: 19 mm

The equal length and width dimensions of 19 mm contribute to a symmetrical and uniform layout on PCBs, enhancing overall aesthetics and design consistency.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures that the product meets industry standards for reliable operation in vehicular applications, making it a suitable choice for automotive electronics.

Peripheral IC Type: SoC

The System-on-Chip peripheral IC type integrates multiple functions into a single chip, reducing component count, board space, and power consumption for efficient and cost-effective designs.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making the product suitable for battery-operated and noise-sensitive applications.

Terminal Form: BALL

The ball terminal form provides reliable solder connections and facilitates high-speed data transmission, ensuring robust performance in demanding applications.

Nominal Supply Voltage: 1.1 V

The nominal supply voltage of 1.1 V ensures stable and efficient operation, providing a balance between power consumption and performance in various applications.

Terminal Pitch: 0.8 mm

The fine terminal pitch of 0.8 mm enables high-density mounting and precise interconnection, enhancing signal integrity and overall system reliability.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX534AVP8C2 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B529

Length:

19 mm

No. of Terminals:

529

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA529,23X23,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.85 mm

Maximum Supply Voltage:

1.15 V

Minimum Supply Voltage:

1.05 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

19 mm

Peripheral IC Type:

SoC

Trade Compliance

MCIMX534AVP8C2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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