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WP32C2W6NFEI-400B2

Microchip Technology

WP32C2W6NFEI-400B2 by Microchip Technology

WP32C2W6NFEI-400B2 by Microchip Technology is a CMOS microprocessor circuit with 896 terminals in a grid array package. It features tin silver copper terminal finish and ball terminal form, suitable for various applications requiring high-performance processing capabilities in a compact square package. Ideal for use in advanced electronic devices where space-saving design and efficient processing are essential.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

WP32C2W6NFEI-400B2 by Microchip Technology
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Distributors (In-Stock)

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Vyrian

USA . 8,035 parts In-Stock

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8,035

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Nova Conductors

Japan . 15 parts In-Stock

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15

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Distributors (Availability)

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AZTECH Wire

Italy . 343 parts In-Stock

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$14.608

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343

$14.608

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Aztec Data Supply Inc.

USA . 85 parts In-Stock

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$56.448

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85

$56.448

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Corohmni

South Africa . 5,133 parts In-Stock

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$268.092

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$268.092

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Ampacity Inc.

Singapore . 27 parts In-Stock

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$301.150

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27

$301.150

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Semicontronic

India . 27 parts In-Stock

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$301.150

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$293.621

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$292.116

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27

$301.150

$293.621

$292.116

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Fulton Briggs Corp.

USA . 5,611 parts In-Stock

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5,611

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Continental Prestige Electronics

USA . 3,817 parts In-Stock

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Argo Parts USA

USA . 3,032 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Aranea Global

USA . 50 parts In-Stock

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50

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Perfect Parts

USA . 9 parts In-Stock

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Overview

Elevate your electronic projects to the next level with the WP32C2W6NFEI-400B2 by Microchip Technology. This cutting-edge microprocessor circuit boasts top-quality design and craftsmanship, making it a reliable choice for a wide range of applications. Whether you're working on robotics, IoT devices, or industrial automation, this product offers unmatched value and performance. Say goodbye to technical headaches and hello to seamless operation - choose Microchip Technology for all your semiconductor needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers durability and reliability, making it a great choice for long-term use.

Surface Mount: YES

Allows for easy installation and space-saving on a circuit board, ideal for compact designs.

Package Shape: SQUARE

Square shape makes it easy to align and integrate into various electronic devices.

No. of Terminals: 896

High number of terminals provides ample connectivity options for complex electronic systems.

Package Style: GRID ARRAY

Grid array style offers efficient signal routing and thermal management for improved performance.

Terminal Finish: TIN SILVER COPPER

This finish ensures good conductivity and corrosion resistance, extending the product's lifespan.

Terminal Position: BOTTOM

Bottom terminal position simplifies soldering and connection processes, enhancing ease of use.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Incorporating a microprocessor circuit enables advanced functionalities and processing capabilities.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall efficiency.

Terminal Form: BALL

Ball terminal form provides reliable connections and mechanical strength, ensuring long-lasting performance.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs WP32C2W6NFEI-400B2 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Microchip Technology

Specs

JESD-30 Code:

S-PBGA-B896

JESD-609 Code:

e1

No. of Terminals:

896

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA896(UNSPEC)

Package Shape:

Package Style (Meter):

GRID ARRAY

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Position:

BOTTOM

Peripheral IC Type:

Trade Compliance

WP32C2W6NFEI-400B2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

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