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MCIMX6Y1DVK05AB

NXP Semiconductors

MCIMX6Y1DVK05AB by NXP Semiconductors

SoC; Terminal Form: BALL; No. of Terminals: 272; Package Code: LFBGA; Package Shape: SQUARE; Technology: CMOS;

Median Price

$9.287

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 260 parts In-Stock

1+ parts

$16.580

100+ parts

$9.290

1k+ parts

$9.040

10k+ parts

-

260

$16.580

$9.290

$9.040

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DigiKey

USA . 673 parts In-Stock

1+ parts

-

100+ parts

$8.620

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673

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$8.620

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Flip Electronics (Authorized)

USA . 673 parts In-Stock

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673

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Verical

USA . 630 parts In-Stock

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$9.954

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630

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$9.954

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Rochester

USA . 270 parts In-Stock

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-

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$8.080

1k+ parts

$7.230

10k+ parts

$6.800

270

-

$8.080

$7.230

$6.800

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,421 parts In-Stock

1+ parts

$8.522

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3,421

$8.522

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Vyrian

USA . 3,245 parts In-Stock

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3,245

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Anansix

USA . 1,578 parts In-Stock

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1,578

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Flip Electronics

USA . 673 parts In-Stock

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673

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 808 parts In-Stock

1+ parts

$8.073

100+ parts

-

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808

$8.073

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Corohmni

South Africa . 2,484 parts In-Stock

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$10.408

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2,484

$10.408

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QUARKTWIN TECHNOLOGY LTD

USA . 13,819 parts In-Stock

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13,819

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UNI Independent Distributors

Spain . 4,175 parts In-Stock

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4,175

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Microchip USA

USA . 1,996 parts In-Stock

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1,996

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Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX6Y1DVK05AB attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B272

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

272

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA272,17X17,20

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.23 mm

Maximum Supply Voltage:

1.5 V

Minimum Supply Voltage:

1.275 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

9 mm

Peripheral IC Type:

SoC

Trade Compliance

MCIMX6Y1DVK05AB Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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