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MCIMX7D7DVM10SD

NXP Semiconductors

MCIMX7D7DVM10SD by NXP Semiconductors

MCIMX7D7DVM10SD by NXP Semiconductors is a SYSTEM ON CHIP with 541 terminals, operating at 0-95°C. It features a low profile GRID ARRAY package style, 0.75mm terminal pitch, and 1.2-1.25V supply voltage range. Ideal for applications requiring high-performance computing in compact spaces.

Median Price

$30.800

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,428 parts In-Stock

1+ parts

$9.920

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-

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1,428

$9.920

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Chip1Stop

Japan . 146 parts In-Stock

1+ parts

$41.800

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146

$41.800

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Mouser Electronics

USA . 362 parts In-Stock

1+ parts

$44.540

100+ parts

$32.090

1k+ parts

$31.020

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362

$44.540

$32.090

$31.020

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Flip Electronics (Authorized)

USA . 2,025 parts In-Stock

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2,025

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DigiKey

USA . 25 parts In-Stock

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$26.670

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25

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$26.670

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Verical

USA . 25 parts In-Stock

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$30.800

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25

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$30.800

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 236 parts In-Stock

1+ parts

$9.424

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236

$9.424

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Nova Conductors

Japan . 100 parts In-Stock

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$28.433

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100

$28.433

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Vyrian

USA . 8,180 parts In-Stock

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8,180

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Flip Electronics

USA . 2,025 parts In-Stock

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2,025

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Anansix

USA . 1,470 parts In-Stock

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Chip Stock

USA . 753 parts In-Stock

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753

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Cyclops Electronics Ltd

UK . 168 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 645 parts In-Stock

1+ parts

$8.430

100+ parts

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645

$8.430

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Corphita

USA . 465 parts In-Stock

1+ parts

$8.928

100+ parts

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465

$8.928

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Semicontronic

India . 542 parts In-Stock

1+ parts

$18.350

100+ parts

$17.891

1k+ parts

$17.800

10k+ parts

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542

$18.350

$17.891

$17.800

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Continental Prestige Electronics

USA . 1,635 parts In-Stock

1+ parts

$28.433

100+ parts

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$27.864

1,635

$28.433

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$27.864

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$28.433

100+ parts

$27.864

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1,000

$28.433

$27.864

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Corohmni

South Africa . 152 parts In-Stock

1+ parts

$29.003

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152

$29.003

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Aztec Data Supply Inc.

USA . 3,199 parts In-Stock

1+ parts

$29.820

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3,199

$29.820

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Microchip USA

USA . 2,391 parts In-Stock

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$62.428

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$62.428

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XScomponents

USA . 53,256 parts In-Stock

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Lixinc

USA . 11,067 parts In-Stock

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Authorized Procurement Solutions

USA . 9,000 parts In-Stock

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9,000

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A-Z Elektronik GmbH

Germany . 5,126 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Argo Parts USA

USA . 2,566 parts In-Stock

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Perfect Parts

USA . 1,699 parts In-Stock

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1,699

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Robosynatics

Brazil . 588 parts In-Stock

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588

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Lucentia Tech

USA . 588 parts In-Stock

1+ parts

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100+ parts

$28.423

1k+ parts

$27.843

10k+ parts

$27.843

588

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$28.423

$27.843

$27.843

UNI Independent Distributors

Spain . 139 parts In-Stock

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139

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Overview

Unlock endless possibilities with the MCIMX7D7DVM10SD by NXP Semiconductors. Embrace innovation and reliability with a manufacturer known for cutting-edge technology. This versatile product falls under the category of Other Function uPs,uCs & Peripheral ICs, offering a wide range of applications. Experience unparalleled value and benefits with this high-quality chip, designed to meet your every need. Stay ahead of the game with NXP Semiconductors and revolutionize your projects today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the IC, ensuring a long lifespan.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving time and space.

Maximum Supply Voltage: 1.25 V

Operating at a maximum supply voltage of 1.25 V allows for efficient power consumption and optimal performance.

Package Shape: SQUARE

The square shape of the package provides uniformity and ease of handling during assembly.

No. of Terminals: 541

Having a high number of terminals allows for connectivity to various external components, increasing versatility.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array style with low profile and fine pitch design enhances signal integrity and reduces electrical interference.

Minimum Supply Voltage: 1.2 V

Operating at a minimum supply voltage of 1.2 V ensures stable operation even under low power conditions.

Maximum Operating Temperature: 95 °C

The high maximum operating temperature of 95°C allows for reliable performance in various environmental conditions.

Minimum Operating Temperature: 0 °C

Operating at a minimum temperature of 0°C ensures functionality in cold environments without risk of damage.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and routing, improving overall system design.

Maximum Seated Height: 1.42 mm

The low maximum seated height of 1.42 mm facilitates compact and slim device designs.

Width: 19 mm

Having a width of 19 mm allows for a compact footprint, ideal for space-constrained applications.

Maximum Time At Peak Reflow Temperature (s): 40

The 40-second maximum time at peak reflow temperature ensures proper soldering and reliability during assembly.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the IC can undergo reflow soldering without risk of thermal damage.

Length: 19 mm

The 19 mm length offers a balanced form factor for easy integration into a wide range of electronic devices.

Peripheral IC Type: SYSTEM ON CHIP

Being a System on Chip (SoC) offers integration of multiple functions onto a single chip, reducing overall board complexity and cost.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing overall performance.

Terminal Form: BALL

The ball terminal form allows for reliable and consistent connections, ensuring signal integrity and electrical conductivity.

Nominal Supply Voltage: 1.225 V

Operating at a nominal supply voltage of 1.225 V ensures stable performance within specified voltage limits.

Terminal Pitch: 0.75 mm

The small terminal pitch of 0.75 mm enables high-density mounting and space-saving on PCBs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the IC is moderately sensitive to moisture, requiring standard precautions during storage and handling.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX7D7DVM10SD attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B541

Length:

19 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

541

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA541,25X25,29

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.42 mm

Maximum Supply Voltage:

1.25 V

Minimum Supply Voltage:

1.2 V

Nominal Supply Voltage:

1.225 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.75 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

19 mm

Peripheral IC Type:

Trade Compliance

MCIMX7D7DVM10SD Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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