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XCZU19EG-2FFVC1760E

Xilinx

XCZU19EG-2FFVC1760E by Xilinx

XCZU19EG-2FFVC1760E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.825-0.876 V. Ideal for applications requiring high-performance processing in compact designs.

Median Price

$8,875.910

Lifecycle Status

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Digiode

USA . 346 parts In-Stock

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Nova Conductors

Japan . 28 parts In-Stock

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VNN

France . 684 parts In-Stock

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Vyrian

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Inland Empire Components Inc.

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AZTECH Wire

Italy . 203 parts In-Stock

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Corohmni

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MARBEL Systems

Belgium . 450 parts In-Stock

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Texas Native Microelectronics

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Kenton Components

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Modulus Dynamics

Lithuania . 1,184 parts In-Stock

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iBuyXS LLC

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One Stop Electronics

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Ampacity Inc.

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Semicontronic

India . 1 parts In-Stock

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Corphita

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Continental Prestige Electronics

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Argo Parts USA

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Qasali Group International

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Overview

Upgrade your technology with the XCZU19EG-2FFVC1760E from Xilinx, a leading manufacturer in the industry. This versatile microprocessor circuit offers endless possibilities for your projects, whether you're in the automotive, industrial, or consumer electronics sector. With its high-quality components and advanced technology, this product guarantees superior performance and reliability. Experience the benefits of increased efficiency and functionality with the XCZU19EG-2FFVC1760E, setting you apart from the competition. Trust Xilinx to deliver exceptional solutions that elevate your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, ensuring the product can withstand various environmental conditions.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 0.876 V

Provides reliable power to the product, ensuring optimal performance without risk of damage from excessive voltage.

Package Shape: RECTANGULAR

Optimal shape for efficient use of space on the circuit board, allowing for compact and organized design.

No. of Terminals: 1760

High number of terminals allow for complex connectivity and functionality, making the product versatile and suitable for diverse applications.

Package Style (Meter): GRID ARRAY

Grid array package style facilitates easy layout and alignment on the circuit board, simplifying the assembly process.

Minimum Operating Temperature: 0 °C

Can operate in low temperature environments without any performance issues, making it suitable for a wide range of applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing the efficiency and reliability of the product.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU19EG-2FFVC1760E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B1760

JESD-609 Code:

e1

Length:

42.5 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Seated Height:

3.71 mm

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

42.5 mm

Peripheral IC Type:

Trade Compliance

XCZU19EG-2FFVC1760E Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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