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XCZU11EG-2FFVC1760E

Xilinx

XCZU11EG-2FFVC1760E by Xilinx

XCZU11EG-2FFVC1760E by Xilinx is a CMOS microprocessor circuit with 1760 terminals in a grid array package. Operating b/w 0-100°C, it has a supply voltage range of 0.825-0.876 V. Ideal for applications requiring high-performance computing and advanced processing capabilities.

Median Price

$7,123.360

Lifecycle Status

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Nova Conductors

Japan . 96 parts In-Stock

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Semicontronic

India . 1,289 parts In-Stock

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AZTECH Wire

Italy . 554 parts In-Stock

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One Stop Electronics

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Ampacity Inc.

Singapore . 1,206 parts In-Stock

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Corohmni

South Africa . 2,535 parts In-Stock

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MARBEL Systems

Belgium . 1,301 parts In-Stock

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Texas Native Microelectronics

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Kenton Components

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Modulus Dynamics

Lithuania . 1,230 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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Qasali Group International

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Supply Digital

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Overview

Revolutionize your electronics projects with the XCZU11EG-2FFVC1760E by Xilinx, a leading manufacturer known for its cutting-edge technology and reliability. This versatile microprocessor circuit offers endless possibilities in a wide range of applications, from IoT devices to industrial automation. With a compact design and high-quality materials, this product delivers exceptional performance and value to customers seeking innovation and efficiency. Upgrade your projects today with the XCZU11EG-2FFVC1760E and experience the superior advantages it brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy makes the product lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

The surface mount capability of this product allows for easy and efficient assembly on circuit boards, saving time and reducing production costs.

Maximum Supply Voltage: 0.876 V

The maximum supply voltage of 0.876 V ensure safe operation and prevents damage to the product, ensuring longevity and reliability.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on a circuit board, optimizing the layout and design of electronic devices.

No. of Terminals: 1760

The large number of terminals provides flexibility and versatility in connecting the product to other components, enabling complex functionalities and customization.

Package Style (Meter): GRID ARRAY

The grid array package style offers high density and efficient layout of components, making it suitable for high-performance and compact electronic devices.

Minimum Operating Temperature: 0 °C

The product can operate at low temperatures down to 0°C, making it suitable for a variety of environments and applications.

Maximum Seated Height: 3.71 mm

The low seated height of 3.71 mm allows for slim and compact designs, ideal for space-constrained applications and devices.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high noise immunity, enhancing efficiency and reliability of operations.

Terminal Form: BALL

The ball terminal form ensures secure and reliable connections, reducing the risk of disconnections and signal interruptions for improved performance.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU11EG-2FFVC1760E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B1760

JESD-609 Code:

e1

Length:

42.5 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Seated Height:

3.71 mm

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

42.5 mm

Peripheral IC Type:

Trade Compliance

XCZU11EG-2FFVC1760E Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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