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ADSP-SC584BBCZ-3A

Analog Devices

ADSP-SC584BBCZ-3A by Analog Devices

ADSP-SC584BBCZ-3A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for industrial applications. It operates b/w -40 to 85 °C and has SPI and UART bus compatibility. This CMOS technology device features a low profile grid array package with 349 terminals in a square shape.

Median Price

$41.600

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 2 parts In-Stock

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$8.142

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Analog Devices Inc

USA . 800 parts In-Stock

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$40.710

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$36.350

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$40.710

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$36.350

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Chip1Stop

Japan . 2 parts In-Stock

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$41.600

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$41.600

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Verical

USA . 2 parts In-Stock

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$49.738

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Rochester

USA . 427 parts In-Stock

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$45.440

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$40.660

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$38.260

427

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$40.660

$38.260

Distributors (In-Stock)

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Digiode

USA . 648 parts In-Stock

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$7.735

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Vyrian

USA . 2,298 parts In-Stock

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Northwest PG Solutions

USA . 2,324 parts In-Stock

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$3.399

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$3.399

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Semicontronic

India . 10 parts In-Stock

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$6.920

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$6.747

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$6.712

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$6.712

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Corphita

USA . 363 parts In-Stock

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$7.328

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AZTECH Wire

Italy . 285 parts In-Stock

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$13.840

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Vigor

Singapore . 2,101 parts In-Stock

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$33.560

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Corohmni

South Africa . 4,886 parts In-Stock

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$66.267

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Parana Technologies

USA . 4,022 parts In-Stock

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$74.935

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$69.689

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$74.935

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$69.689

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IDEA Electronic Components Group

UK . 467 parts In-Stock

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$80.575

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$76.546

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Microchip USA

USA . 5,867 parts In-Stock

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$117.323

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DigiPath Technology Company

USA . 4,022 parts In-Stock

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$125.697

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$120.669

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$120.669

4,022

$125.697

$120.669

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$120.669

Native Components

USA . 41 parts In-Stock

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$2.997

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Overview

Revolutionize your electronic designs with the ADSP-SC584BBCZ-3A from Analog Devices. This high-quality microprocessor circuit offers unmatched performance and reliability, backed by the reputable manufacturer. Whether you're working on industrial applications or consumer electronics, this versatile IC provides the power and efficiency you need. Say goodbye to limitations and hello to endless possibilities with the ADSP-SC584BBCZ-3A. Elevate your projects with cutting-edge technology and seamless integration.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to physical damage, making the product ideal for long-term use in various applications.

Surface Mount: YES

Being surface mountable, the product offers easy and convenient installation on printed circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 1.15 V

The high maximum supply voltage capability allows for reliable operation under varying voltage conditions, ensuring stable performance in different power supply environments.

Package Shape: SQUARE

The square package shape offers better alignment and space utilization on a PCB, making it easier for designers to place and route the component efficiently.

No. of Terminals: 349

With a high number of terminals, the product provides ample connection options for interfacing with other components or peripherals, enhancing its versatility and functionality.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array style with low profile and fine pitch design ensures efficient heat dissipation, reduced signal interference, and compatibility with modern PCB manufacturing processes.

Minimum Operating Temperature: -40 °C

The wide minimum operating temperature range allows the product to function reliably in extreme cold environments, making it suitable for industrial applications exposed to harsh conditions.

Maximum Clock Frequency: 500 MHz

The high maximum clock frequency enables fast data processing and execution speeds, making it suitable for demanding computational tasks and real-time applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Featuring a microprocessor circuit as a peripheral IC type, the product offers advanced processing capabilities and task management functions, enhancing overall system performance and efficiency.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption, high-speed operation, and reliable performance, making the product energy-efficient and suitable for battery-powered devices.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs ADSP-SC584BBCZ-3A attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Analog Devices

Specs

Bus Compatibility:

SPI; UART

Maximum Clock Frequency:

500 MHz

JESD-30 Code:

S-PBGA-B349

Length:

19 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

349

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA529,23X23,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.5 mm

Maximum Supply Voltage:

1.15 V

Minimum Supply Voltage:

1.05 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

19 mm

Peripheral IC Type:

Trade Compliance

ADSP-SC584BBCZ-3A Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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