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XCZU17EG-2FFVD1760E

Xilinx

XCZU17EG-2FFVD1760E by Xilinx

XCZU17EG-2FFVD1760E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It features 1760 terminals in a GRID ARRAY package style, operating b/w 0-100 °C. Ideal for applications requiring high processing power and advanced functionalities in compact designs.

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Vyrian

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Ampacity Inc.

Singapore . 634 parts In-Stock

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Semicontronic

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AZTECH Wire

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One Stop Electronics

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Modulus Dynamics

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Aztec Data Supply Inc.

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Texas Native Microelectronics

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Corohmni

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Kenton Components

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Advanced Electronics

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Overview

Unlock the potential of your projects with the XCZU17EG-2FFVD1760E by Xilinx, a top-tier manufacturer known for cutting-edge technology and innovation. This versatile microprocessor circuit offers endless possibilities in a wide range of applications. With a focus on quality and reliability, Xilinx delivers a product that exceeds expectations. Experience seamless integration, high performance, and exceptional value with the XCZU17EG-2FFVD1760E. Elevate your designs and stay ahead of the competition with this game-changing solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the integrated circuits inside, ensuring reliability and durability.

Surface Mount: YES

Allows for easy and efficient integration onto PCBs, saving space and simplifying assembly processes.

Maximum Supply Voltage: 0.876 V

Low maximum supply voltage helps in reducing power consumption and heat generation, making the product energy-efficient.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on PCBs and makes it easy to arrange multiple components.

No. of Terminals: 1760

High number of terminals allows for versatile connectivity options and the integration of numerous functions.

Package Style (Meter): GRID ARRAY

Grid array package style offers high terminal density and improved signal transmission, enhancing performance.

Minimum Supply Voltage: 0.825 V

Low minimum supply voltage ensures stable operation in various power conditions and extends battery life.

Maximum Operating Temperature: 100 °C

Wide operating temperature range enables the product to perform reliably in various environments and conditions.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

Provides good conductivity and corrosion resistance for reliable electrical connections.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and improves thermal management for better performance.

Maximum Seated Height: 3.71 mm

Low seated height allows for compact design and efficient use of vertical space in electronic assemblies.

Width: 42.5 mm

Moderate width dimensions make the product compatible with standard PCB sizes and facilitate integration into various systems.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time minimizes thermal stress on components during soldering, ensuring reliability and longevity.

Peak Reflow Temperature °C: 245

High peak reflow temperature enables secure solder joints and prevents solder defects, ensuring robust connections.

Length: 42.5 mm

Moderate length dimensions provide compatibility with standard PCB sizes and allow for easy integration into electronic devices.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Microprocessor circuit functionality allows for advanced processing capabilities and versatile applications in various electronic devices.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and noise immunity, contributing to efficient performance and reliability.

Terminal Form: BALL

Ball terminal form facilitates secure and reliable connections with PCB pads, ensuring good electrical contact and signal integrity.

Nominal Supply Voltage: 0.85 V

Stable nominal supply voltage ensures consistent performance and efficient power consumption, enhancing overall reliability.

Terminal Pitch: 1 mm

Compact terminal pitch allows for high terminal density and efficient use of PCB space, making the product suitable for dense electronic assemblies.

Moisture Sensitivity Level (MSL): 4

MSL 4 indicates that the product has a low sensitivity to moisture, ensuring reliability during storage and assembly processes.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU17EG-2FFVD1760E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B1760

JESD-609 Code:

e1

Length:

42.5 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Seated Height:

3.71 mm

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

42.5 mm

Peripheral IC Type:

Trade Compliance

XCZU17EG-2FFVD1760E Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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