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ADSP-SC582BBCZ-4A

Analog Devices

ADSP-SC582BBCZ-4A by Analog Devices

ADSP-SC582BBCZ-4A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for industrial applications. It operates b/w -40 to 85 °C and has SPI and UART bus compatibility. This CMOS technology device comes in a low profile GRID ARRAY package with 349 terminals on a 19mm square body.

Median Price

$36.800

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 34 parts In-Stock

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$7.287

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34

$7.287

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Chip1Stop

Japan . 36 parts In-Stock

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$36.200

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$36.200

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Analog Devices Inc

USA . 1,077 parts In-Stock

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$37.400

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$31.610

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1,077

$37.400

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$31.610

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DigiKey

USA . 18 parts In-Stock

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$40.770

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$40.770

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Rochester

USA . 360 parts In-Stock

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$39.510

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$35.350

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$33.270

360

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$39.510

$35.350

$33.270

Verical

USA . 315 parts In-Stock

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$35.782

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$35.782

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Digiode

USA . 991 parts In-Stock

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$17.176

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$17.176

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Vyrian

USA . 4,933 parts In-Stock

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Native Components

USA . 215 parts In-Stock

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$0.251

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$0.241

215

$0.251

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$0.241

Northwest PG Solutions

USA . 874 parts In-Stock

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$0.276

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$0.244

874

$0.276

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$0.244

Ampacity Inc.

Singapore . 242 parts In-Stock

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$15.370

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$15.370

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Semicontronic

India . 210 parts In-Stock

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$15.370

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$14.986

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$14.909

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210

$15.370

$14.986

$14.909

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Corphita

USA . 97 parts In-Stock

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$16.272

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Vigor

Singapore . 5,064 parts In-Stock

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$29.190

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Parana Technologies

USA . 3,447 parts In-Stock

1+ parts

$38.733

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$36.021

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3,447

$38.733

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$36.021

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IDEA Electronic Components Group

UK . 536 parts In-Stock

1+ parts

$41.648

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$39.566

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536

$41.648

$39.566

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DigiPath Technology Company

USA . 3,447 parts In-Stock

1+ parts

$64.971

100+ parts

$62.372

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$62.372

3,447

$64.971

$62.372

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$62.372

Corohmni

South Africa . 239 parts In-Stock

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$81.735

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239

$81.735

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Overview

Upgrade your electronics with the ADSP-SC582BBCZ-4A by Analog Devices, a top-tier manufacturer known for quality and innovation. This cutting-edge microprocessor circuit offers unmatched performance and reliability, making it ideal for a wide range of applications. With a maximum clock frequency of 500 MHz and compatibility with SPI and UART buses, this IC provides seamless integration and enhanced functionality. Trust Analog Devices to deliver exceptional value and superior technology with the ADSP-SC582BBCZ-4A. Elevate your projects to new heights with this industrial-grade solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost.

Maximum Supply Voltage: 1.15 V

Higher supply voltage allows for increased performance and efficiency in operations.

Package Shape: SQUARE

Square packages are space-efficient and easy to handle, making them ideal for compact designs.

No. of Terminals: 349

Higher number of terminals provide more connectivity options and flexibility in circuit design.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array package style offers high density integration, low profile design saves space, and fine pitch allows for closer connections.

Minimum Supply Voltage: 1.05 V

Lower minimum supply voltage helps in conserving power and reducing heat dissipation.

Maximum Operating Temperature: 85 °C

High operating temperature range ensures reliable performance in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Wide range of operating temperatures makes the product suitable for both hot and cold climates.

Terminal Finish: TIN SILVER COPPER

This finish provides good conductivity, corrosion resistance, and solderability for long-term reliability.

Terminal Position: BOTTOM

Bottom terminal position allows for easy PCB layout and routing of traces.

Maximum Seated Height: 1.5 mm

Low seated height helps in compact designs and reduces overall system profile.

Width: 19 mm

Standard width allows for easy integration into existing systems and designs.

Maximum Clock Frequency: 500 MHz

High clock frequency enables fast data processing and execution of instructions.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time minimizes heat exposure and reduces the risk of component damage during assembly.

Peak Reflow Temperature °C: 260

High reflow temperature ensures proper soldering and reliable mechanical connections.

Length: 19 mm

Standard length makes the product compatible with industry-standard PCB sizes and layouts.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliable performance in demanding industrial environments.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Microprocessor circuit offers advanced processing capabilities and flexibility for various applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity for efficient operations.

Terminal Form: BALL

Ball terminal form allows for reliable and secure connections with the PCB.

Nominal Supply Voltage: 1.1 V

Stable nominal supply voltage ensures consistent performance and efficient power utilization.

Bus Compatibility: SPI; UART

Compatibility with SPI and UART buses allows for easy communication with other devices and peripherals.

Terminal Pitch: 0.8 mm

Fine terminal pitch enables high density integration and closer connections on the PCB.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the product can withstand moderate exposure to moisture during storage and handling.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs ADSP-SC582BBCZ-4A attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Analog Devices

Specs

Bus Compatibility:

SPI; UART

Maximum Clock Frequency:

500 MHz

JESD-30 Code:

S-PBGA-B349

JESD-609 Code:

e1

Length:

19 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

349

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA529,23X23,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.5 mm

Maximum Supply Voltage:

1.15 V

Minimum Supply Voltage:

1.05 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

19 mm

Peripheral IC Type:

Trade Compliance

ADSP-SC582BBCZ-4A Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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