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BALL Other Function uPs,uCs & Peripheral ICs 1,582

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Information Access Method Integrated Cache Interrupt Capability JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Minimum Time Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Ultraviolet Erasable Volatile Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
XCZU15EG-3FFVB1156E by Xilinx

XCZU15EG-3FFVB1156E

Xilinx

XCZU15EG-3FFVB1156E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 1156 terminals in a GRID ARRAY package style. Operating b/w 0 to 100 °C, it's ideal for applications requiring low power consumption and high performance.

R-PBGA-B1156

e1

4

1156

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.927 V

.873 V

.9 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU15EG-L1FFVB1156I by Xilinx

XCZU15EG-L1FFVB1156I

Xilinx

XCZU15EG-L1FFVB1156I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.698V to 0.742V. Ideal for industrial applications requiring high performance and reliability in a compact GRID ARRAY package.

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B1156

e1

4

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU15EG-L1FFVC900I by Xilinx

XCZU15EG-L1FFVC900I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: RECTANGULAR;

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B900

e1

4

900

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU15EG-L2FFVB1156E by Xilinx

XCZU15EG-L2FFVB1156E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B1156

e1

4

1156

110 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU17EG-1FFVB1517E by Xilinx

XCZU17EG-1FFVB1517E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1517

e1

4

1517

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU17EG-1FFVB1517I by Xilinx

XCZU17EG-1FFVB1517I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1517

e1

4

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU17EG-1FFVC1760E by Xilinx

XCZU17EG-1FFVC1760E

Xilinx

XCZU17EG-1FFVC1760E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.825-0.876 V. Suitable for applications requiring high-performance processing in compact form factors.

R-PBGA-B1760

e1

4

1760

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU17EG-1FFVC1760I by Xilinx

XCZU17EG-1FFVC1760I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1760

e1

4

1760

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU17EG-1FFVD1760E by Xilinx

XCZU17EG-1FFVD1760E

Xilinx

XCZU17EG-1FFVD1760E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 1760 terminals in a GRID ARRAY package style, operating b/w 0-100 °C. Suitable for Other Function uPs,uCs & Peripheral ICs applications.

R-PBGA-B1760

e1

4

1760

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU17EG-1FFVD1760I by Xilinx

XCZU17EG-1FFVD1760I

Xilinx

XCZU17EG-1FFVD1760I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has 1760 terminals in a GRID ARRAY package style. Ideal for industrial applications requiring high performance at supply voltages ranging from 0.825V to 0.876V.

R-PBGA-B1760

e1

4

1760

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU17EG-2FFVB1517I by Xilinx

XCZU17EG-2FFVB1517I

Xilinx

XCZU17EG-2FFVB1517I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has 1517 terminals in a GRID ARRAY package style. Ideal for industrial applications requiring high performance at supply voltages ranging from 0.825V to 0.876V.

R-PBGA-B1517

e1

4

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU17EG-2FFVC1760I by Xilinx

XCZU17EG-2FFVC1760I

Xilinx

The Xilinx XCZU17EG-2FFVC1760I is a CMOS microprocessor circuit with 1760 terminals in a grid array package. It operates b/w -40 to 100 °C and has a supply voltage range of 0.825V to 0.876V. Ideal for industrial applications requiring high-performance processing capabilities.

R-PBGA-B1760

e1

4

1760

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU17EG-2FFVD1760I by Xilinx

XCZU17EG-2FFVD1760I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1760

e1

4

1760

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU17EG-2FFVE1924I by Xilinx

XCZU17EG-2FFVE1924I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1924; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1924

e1

4

1924

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU17EG-3FFVB1517E by Xilinx

XCZU17EG-3FFVB1517E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1517

e1

4

1517

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.927 V

.873 V

.9 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU17EG-L1FFVB1517I by Xilinx

XCZU17EG-L1FFVB1517I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B1517

e1

4

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU17EG-L2FFVC1760E by Xilinx

XCZU17EG-L2FFVC1760E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: RECTANGULAR;

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B1760

e1

4

1760

110 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU19EG-1FFVB1517E by Xilinx

XCZU19EG-1FFVB1517E

Xilinx

XCZU19EG-1FFVB1517E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C and has a supply voltage range of 0.825-0.876 V. This GRID ARRAY package is ideal for applications requiring high-performance processing in compact form factors.

R-PBGA-B1517

e1

4

1517

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU19EG-1FFVB1517I by Xilinx

XCZU19EG-1FFVB1517I

Xilinx

XCZU19EG-1FFVB1517I by Xilinx is a CMOS microprocessor circuit with 1517 terminals. It operates in an industrial temperature range of -40 to 100 °C and has a max supply voltage of 0.876 V. This IC is commonly used in various applications requiring high-performance processing capabilities.

R-PBGA-B1517

e1

4

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU19EG-1FFVC1760E by Xilinx

XCZU19EG-1FFVC1760E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1760

e1

4

1760

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU19EG-1FFVC1760I by Xilinx

XCZU19EG-1FFVC1760I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1760

e1

4

1760

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU19EG-1FFVD1760E by Xilinx

XCZU19EG-1FFVD1760E

Xilinx

XCZU19EG-1FFVD1760E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 1760 terminals in a GRID ARRAY package style, suitable for applications requiring high performance at temperatures ranging from 0 to 100 °C.

R-PBGA-B1760

e1

4

1760

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU19EG-1FFVD1760I by Xilinx

XCZU19EG-1FFVD1760I

Xilinx

XCZU19EG-1FFVD1760I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 1760 terminals in a GRID ARRAY package style, suitable for industrial applications. Operating temperature ranges from -40 to 100 °C, with supply voltage b/w 0.825V to 0.876V.

R-PBGA-B1760

e1

4

1760

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU19EG-2FFVB1517I by Xilinx

XCZU19EG-2FFVB1517I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1517

e1

4

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU19EG-2FFVC1760I by Xilinx

XCZU19EG-2FFVC1760I

Xilinx

XCZU19EG-2FFVC1760I by Xilinx is a MICROPROCESSOR CIRCUIT with 1760 terminals in a GRID ARRAY package. It operates b/w -40 to 100 °C and has a supply voltage range of 0.825V to 0.876V. Ideal for industrial applications requiring high-performance CMOS technology.

R-PBGA-B1760

e1

4

1760

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU19EG-2FFVD1760I by Xilinx

XCZU19EG-2FFVD1760I

Xilinx

XCZU19EG-2FFVD1760I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has 1760 terminals in a GRID ARRAY package style. Suitable for industrial applications, it has a supply voltage range of 0.825V to 0.876V and can withstand peak reflow temperature of 245C for up to 30s.

R-PBGA-B1760

e1

4

1760

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU19EG-2FFVE1924I by Xilinx

XCZU19EG-2FFVE1924I

Xilinx

XCZU19EG-2FFVE1924I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance and reliability.

R-PBGA-B1924

e1

4

1924

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU19EG-3FFVB1517E by Xilinx

XCZU19EG-3FFVB1517E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1517

e1

4

1517

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.927 V

.873 V

.9 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU19EG-3FFVC1760E by Xilinx

XCZU19EG-3FFVC1760E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1760

e1

4

1760

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.927 V

.873 V

.9 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU19EG-3FFVD1760E by Xilinx

XCZU19EG-3FFVD1760E

Xilinx

XCZU19EG-3FFVD1760E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 1760 terminals in a GRID ARRAY package style, operating b/w 0-100 °C. Suitable for Other Function uPs,uCs & Peripheral ICs applications.

R-PBGA-B1760

e1

4

1760

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.927 V

.873 V

.9 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU19EG-3FFVE1924E by Xilinx

XCZU19EG-3FFVE1924E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1924; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1924

e1

4

1924

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.927 V

.873 V

.9 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU19EG-L1FFVB1517I by Xilinx

XCZU19EG-L1FFVB1517I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B1517

e1

4

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU19EG-L1FFVC1760I by Xilinx

XCZU19EG-L1FFVC1760I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: RECTANGULAR;

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B1760

e1

4

1760

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU19EG-L2FFVB1517E by Xilinx

XCZU19EG-L2FFVB1517E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B1517

e1

4

1517

110 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU19EG-L2FFVC1760E by Xilinx

XCZU19EG-L2FFVC1760E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: RECTANGULAR;

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B1760

e1

4

1760

110 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU19EG-L2FFVD1760E by Xilinx

XCZU19EG-L2FFVD1760E

Xilinx

Xilinx XCZU19EG-L2FFVD1760E is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 1760 terminals in GRID ARRAY package style. Operating b/w 0-110 °C, it's ideal for high-performance computing applications.

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B1760

e1

4

1760

110 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU2CG-1SBVA484E by Xilinx

XCZU2CG-1SBVA484E

Xilinx

XCZU2CG-1SBVA484E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.825-0.876 V. Suitable for various applications requiring high-performance processing in a compact form factor.

R-PBGA-B484

e1

4

484

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU2CG-1SBVA484I by Xilinx

XCZU2CG-1SBVA484I

Xilinx

XCZU2CG-1SBVA484I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance uPs/uCs.

R-PBGA-B484

e1

4

484

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU2CG-1SFVA625E by Xilinx

XCZU2CG-1SFVA625E

Xilinx

XCZU2CG-1SFVA625E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.825-0.876 V. This GRID ARRAY package with 625 terminals is ideal for various applications requiring high-performance processing capabilities.

R-PBGA-B625

e1

4

625

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU2CG-1SFVA625I by Xilinx

XCZU2CG-1SFVA625I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 625; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B625

e1

4

625

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU2CG-1SFVC784E by Xilinx

XCZU2CG-1SFVC784E

Xilinx

XCZU2CG-1SFVC784E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100°C, with a supply voltage of 0.85V. With 784 terminals in a GRID ARRAY package, it's ideal for various applications requiring high-performance processing capabilities.

S-PBGA-B784

e1

4

784

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU2CG-1SFVC784I by Xilinx

XCZU2CG-1SFVC784I

Xilinx

XCZU2CG-1SFVC784I by Xilinx is a CMOS microprocessor circuit with 784 terminals in a square grid array package. Operating b/w -40 to 100 °C, it has a peak reflow temp of 250C. Ideal for industrial applications requiring low voltage supply and high processing power.

S-PBGA-B784

e1

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU2CG-2SBVA484I by Xilinx

XCZU2CG-2SBVA484I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B484

e1

4

484

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU2CG-2SFVA625I by Xilinx

XCZU2CG-2SFVA625I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 625; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B625

e1

4

625

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU2CG-2SFVC784I by Xilinx

XCZU2CG-2SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;

S-PBGA-B784

e1

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU2CG-L1SBVA484I by Xilinx

XCZU2CG-L1SBVA484I

Xilinx

XCZU2CG-L1SBVA484I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates in an INDUSTRIAL temperature range of -40 to 100 °C and has a supply voltage range of 0.698V to 0.742V. This GRID ARRAY package with 484 terminals is suitable for various applications requiring high-performance processing capabilities.

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B484

e1

4

484

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU2CG-L1SFVA625I by Xilinx

XCZU2CG-L1SFVA625I

Xilinx

XCZU2CG-L1SFVA625I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has 625 terminals in a GRID ARRAY package style. Suitable for industrial applications, it has a supply voltage range of 0.698V to 0.742V and can withstand peak reflow temperature of 250C.

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B625

e1

4

625

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU2CG-L1SFVC784I by Xilinx

XCZU2CG-L1SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;

IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)

S-PBGA-B784

e1

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

.72 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT