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XCZU17EG-1FFVC1760E

Xilinx

XCZU17EG-1FFVC1760E by Xilinx

XCZU17EG-1FFVC1760E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.825-0.876 V. Suitable for applications requiring high-performance processing in compact form factors.

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Vyrian

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Semicontronic

India . 332 parts In-Stock

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AZTECH Wire

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Advanced Electronics

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Ampacity Inc.

Singapore . 1,136 parts In-Stock

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One Stop Electronics

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Corohmni

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MARBEL Systems

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Texas Native Microelectronics

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Kenton Components

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Modulus Dynamics

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Qasali Group International

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Overview

Unleash the power of innovation with the XCZU17EG-1FFVC1760E by Xilinx! As a leading manufacturer in the industry, Xilinx delivers top-quality products that redefine possibilities. This versatile microprocessor circuit is perfect for a wide range of applications, offering unparalleled value and performance. With its advanced technology and reliable design, the XCZU17EG-1FFVC1760E ensures optimal functionality and efficiency in every project. Elevate your creations with this cutting-edge solution and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide good thermal and electrical insulation, making the product durable and reliable.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and effort during production.

Maximum Supply Voltage: 0.876 V

The high maximum supply voltage ensures stable operation and performance of the product under various conditions.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy integration into electronic devices and efficient use of PCB space.

No. of Terminals: 1760

Large number of terminals provide flexibility in connection options and support complex circuit designs.

Package Style (Meter): GRID ARRAY

Grid array package style offers high density packaging, enabling compact design and efficient thermal management.

Minimum Supply Voltage: 0.825 V

Low minimum supply voltage allows for energy-efficient operation and extends battery life in portable devices.

Maximum Operating Temperature: 100 °C

High maximum operating temperature ensures reliable performance in demanding environments and industrial applications.

Minimum Operating Temperature: 0 °C

Wide temperature range support allows for operation in both extreme cold and hot conditions, increasing product versatility.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

Tin, silver, and copper terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term performance.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and mounting, making installation and maintenance easier for engineers.

Maximum Time At Peak Reflow Temperature (s): 30

Short maximum time at peak reflow temperature reduces the risk of component damage during soldering, ensuring high manufacturing yield.

Peak Reflow Temperature °C: 245

High peak reflow temperature capability allows for lead-free soldering processes, meeting industry standards and regulations.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Microprocessor circuit integration enhances the functionality and processing power of the product, enabling advanced applications and features.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noise-sensitive environments.

Terminal Form: BALL

Ball terminal form simplifies soldering and improves electrical contact, ensuring high-quality connections for optimal performance.

Nominal Supply Voltage: 0.85 V

Stable nominal supply voltage ensures consistent and reliable operation, meeting performance requirements and specifications.

Moisture Sensitivity Level (MSL): 4

MSL 4 rating indicates the product is suitable for reflow soldering processes and has moderate moisture sensitivity, ensuring proper handling and storage procedures.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU17EG-1FFVC1760E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B1760

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU17EG-1FFVC1760E Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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