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XCZU2CG-L1SFVA625I

Xilinx

XCZU2CG-L1SFVA625I by Xilinx

XCZU2CG-L1SFVA625I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has 625 terminals in a GRID ARRAY package style. Suitable for industrial applications, it has a supply voltage range of 0.698V to 0.742V and can withstand peak reflow temperature of 250C.

Median Price

$384.836

Lifecycle Status

Suppliers In-Stock

4

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1k+

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VNN

France . 280 parts In-Stock

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$377.063

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Nova Conductors

Japan . 50 parts In-Stock

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$392.610

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Vyrian

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Digiode

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Ampacity Inc.

Singapore . 401 parts In-Stock

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$14.000

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AZTECH Wire

Italy . 531 parts In-Stock

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Semicontronic

India . 941 parts In-Stock

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$25.350

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$25.220

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MARBEL Systems

Belgium . 4,373 parts In-Stock

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One Stop Electronics

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Texas Native Microelectronics

USA . 30 parts In-Stock

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$37.407

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$32.918

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Kenton Components

USA . 100 parts In-Stock

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$44.888

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Corohmni

South Africa . 1,079 parts In-Stock

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Modulus Dynamics

Lithuania . 1,069 parts In-Stock

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Qasali Group International

UK . 186 parts In-Stock

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Vigor

Singapore . 279 parts In-Stock

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Argo Parts USA

USA . 4,414 parts In-Stock

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$388.684

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$384.758

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$380.832

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Continental Prestige Electronics

USA . 4,147 parts In-Stock

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Microchip USA

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Supply Digital

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Netroflash

USA . 500 parts In-Stock

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Corphita

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Overview

Unleash the power of cutting-edge technology with the XCZU2CG-L1SFVA625I by Xilinx. As a leading manufacturer in the industry, Xilinx delivers top-of-the-line quality and reliability in their products. This versatile microprocessor circuit is designed for a wide range of applications, offering unmatched performance and efficiency. From industrial automation to consumer electronics, this product provides exceptional value, benefits, and advantages to customers seeking innovative solutions. Upgrade your projects with the XCZU2CG-L1SFVA625I and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, cost-effective, and offers good protection to the components inside, making the product durable and long-lasting.

Surface Mount: YES

Surface mount technology allows for efficient and compact assembly of the product, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 0.742 V

Having a maximum supply voltage of 0.742V ensures compatibility with a wide range of power sources, making the product versatile.

Package Shape: RECTANGULAR

The rectangular shape of the package makes it easy to design and integrate into various electronic devices.

No. of Terminals: 625

A higher number of terminals allow for more connections and functionalities, increasing the product's capabilities.

Package Style (Meter): GRID ARRAY

Grid array package style provides high density and reliability, making it suitable for complex integrated circuits.

Minimum Supply Voltage: 0.698 V

The low minimum supply voltage ensures efficient power consumption and operation of the product.

Maximum Operating Temperature: 100 °C

With a maximum operating temperature of 100°C, the product can withstand high heat environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The product can operate at temperatures as low as -40°C, making it suitable for use in various climates and environments.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

This terminal finish provides good conductivity, corrosion resistance, and solderability, ensuring reliable connections.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy PCB layout and assembly, enhancing the product's usability and efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time minimizes thermal stress on the components during manufacturing, ensuring product reliability.

Peak Reflow Temperature °C: 250

With a peak reflow temperature of 250°C, the product can withstand high-temperature soldering processes without damage.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures the product's reliability and performance in harsh operating conditions.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Incorporating a microprocessor circuit allows for complex computations and control functions, making the product versatile and adaptable.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the product's efficiency and reliability.

Terminal Form: BALL

Ball terminal form enables easy and reliable connections during assembly, ensuring long-term performance of the product.

Nominal Supply Voltage: 0.72 V

The nominal supply voltage of 0.72V optimizes power efficiency and performance of the product.

Moisture Sensitivity Level (MSL): 4

An MSL of 4 indicates that the product can withstand moderate exposure to moisture during handling and manufacturing processes.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU2CG-L1SFVA625I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

Additional Features:

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

JESD-30 Code:

R-PBGA-B625

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

625

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

250

Maximum Supply Voltage:

.742 V

Minimum Supply Voltage:

.698 V

Nominal Supply Voltage:

.72 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU2CG-L1SFVA625I Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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