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XCZU19EG-1FFVB1517E

Xilinx

XCZU19EG-1FFVB1517E by Xilinx

XCZU19EG-1FFVB1517E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C and has a supply voltage range of 0.825-0.876 V. This GRID ARRAY package is ideal for applications requiring high-performance processing in compact form factors.

Median Price

$5,283.480

Lifecycle Status

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Nova Conductors

Japan . 300 parts In-Stock

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Vyrian

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AZTECH Wire

Italy . 863 parts In-Stock

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$15.528

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Ampacity Inc.

Singapore . 589 parts In-Stock

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Corohmni

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MARBEL Systems

Belgium . 482 parts In-Stock

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Semicontronic

India . 675 parts In-Stock

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Texas Native Microelectronics

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One Stop Electronics

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Kenton Components

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Qasali Group International

UK . 1,348 parts In-Stock

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Modulus Dynamics

Lithuania . 778 parts In-Stock

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Microchip USA

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Continental Prestige Electronics

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Argo Parts USA

USA . 4,372 parts In-Stock

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$5,230.645

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Netroflash

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Authorized Procurement Solutions

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Perfect Parts

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Supply Digital

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Vigor

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Corphita

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Overview

Discover the power and innovation of the XCZU19EG-1FFVB1517E by Xilinx, a cutting-edge microprocessor circuit that promises top-tier performance and reliability. With Xilinx's reputation for excellence in the industry, this product offers unmatched quality and value to customers. Ideal for a wide range of applications, this grid array package is designed to meet your every need, whether you're a seasoned professional or a tech enthusiast. Don't settle for less when you can experience the best with Xilinx's XCZU19EG-1FFVB1517E.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable electronics.

Surface Mount: YES

Surface mount technology allows for efficient assembly and compact design, making it suitable for space-constrained applications.

Maximum Supply Voltage: 0.876 V

The high maximum supply voltage allows for flexibility in power supply options, accommodating a range of voltage inputs.

Package Shape: RECTANGULAR

The rectangular shape of the package simplifies PCB design and integration into existing systems.

No. of Terminals: 1517

The large number of terminals provides ample connectivity options for various peripherals and components, enhancing functionality.

Package Style (Meter): GRID ARRAY

The grid array package style offers secure connections and efficient heat dissipation, ensuring reliable performance under heavy loads.

Minimum Supply Voltage: 0.825 V

The low minimum supply voltage allows for energy-efficient operation, reducing power consumption and heat generation.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature ensures reliable performance in harsh environmental conditions, suitable for industrial applications.

Technology: CMOS

The CMOS technology used in the product offers low power consumption and fast processing speeds, making it ideal for energy-efficient devices.

Nominal Supply Voltage: 0.85 V

The nominal supply voltage provides a stable power source for consistent performance, enhancing reliability and longevity of the product.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU19EG-1FFVB1517E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B1517

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU19EG-1FFVB1517E Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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