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XCZU17EG-1FFVD1760I

Xilinx

XCZU17EG-1FFVD1760I by Xilinx

XCZU17EG-1FFVD1760I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has 1760 terminals in a GRID ARRAY package style. Ideal for industrial applications requiring high performance at supply voltages ranging from 0.825V to 0.876V.

Median Price

$7,828.980

Lifecycle Status

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4

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1k+

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Nova Conductors

Japan . 450 parts In-Stock

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Vyrian

USA . 5,162 parts In-Stock

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VNN

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Digiode

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Ampacity Inc.

Singapore . 1,523 parts In-Stock

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$4.000

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Semicontronic

India . 1,556 parts In-Stock

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$6.825

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$6.790

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AZTECH Wire

Italy . 636 parts In-Stock

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One Stop Electronics

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Corohmni

South Africa . 3,058 parts In-Stock

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Modulus Dynamics

Lithuania . 802 parts In-Stock

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MARBEL Systems

Belgium . 423 parts In-Stock

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$47.065

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$45.183

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Texas Native Microelectronics

USA . 50 parts In-Stock

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$54.098

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$51.934

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Kenton Components

USA . 300 parts In-Stock

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Aztec Data Supply Inc.

USA . 592 parts In-Stock

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Microchip USA

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Vigor

Singapore . 140 parts In-Stock

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Continental Prestige Electronics

USA . 2,474 parts In-Stock

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$7,672.400

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Argo Parts USA

USA . 69 parts In-Stock

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$7,828.980

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$7,750.690

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$7,672.400

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$7,594.111

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$7,594.111

Qasali Group International

UK . 3,427 parts In-Stock

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Corphita

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Supply Digital

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Overview

Unleash the power of cutting-edge technology with the XCZU17EG-1FFVD1760I by Xilinx. Known for their top-quality products, Xilinx delivers unmatched performance and reliability in the category of Other Function uPs,uCs & Peripheral ICs. This innovative microprocessor circuit boasts a wide range of applications and is designed to meet the highest standards of industrial-grade technology. Elevate your projects with the XCZU17EG-1FFVD1760I and experience the value and benefits it brings to your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection for the IC components, making this product a reliable choice for long-term usage.

Surface Mount: YES

The surface mount capability allows for easy installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 0.876 V

The high maximum supply voltage of 0.876 V ensures stable and efficient performance under various operating conditions.

Package Shape: RECTANGULAR

The rectangular package shape makes it convenient for placement and integration into different electronic systems and devices.

No. of Terminals: 1760

With a high number of terminals, this product offers extensive connectivity options for interfacing with other components and peripherals.

Package Style (Meter): GRID ARRAY

The grid array package style provides a compact and organized layout, optimizing space utilization on circuit boards and enhancing overall system efficiency.

Minimum Operating Temperature: -40 °C

The wide minimum operating temperature range of -40 °C ensures reliable operation in extreme environmental conditions, making this product suitable for a variety of applications.

Technology: CMOS

The CMOS technology offers low power consumption, high speed, and compatibility with a wide range of digital applications, making this product a cost-effective and efficient choice.

Nominal Supply Voltage: 0.85 V

The nominal supply voltage of 0.85 V provides stable and consistent power delivery for optimal performance of the IC components.

Moisture Sensitivity Level (MSL): 4

With a moisture sensitivity level of 4, this product is designed to withstand moderate exposure to moisture during storage and handling, ensuring long-term reliability.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU17EG-1FFVD1760I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B1760

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU17EG-1FFVD1760I Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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