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XCZU19EG-L2FFVD1760E

Xilinx

XCZU19EG-L2FFVD1760E by Xilinx

Xilinx XCZU19EG-L2FFVD1760E is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 1760 terminals in GRID ARRAY package style. Operating b/w 0-110 °C, it's ideal for high-performance computing applications.

Median Price

$10,877.790

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Avnet

USA . 80 parts In-Stock

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Nova Conductors

Japan . 84 parts In-Stock

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Vyrian

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Semicontronic

India . 922 parts In-Stock

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$14.000

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$13.650

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One Stop Electronics

USA . 452 parts In-Stock

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AZTECH Wire

Italy . 773 parts In-Stock

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Ampacity Inc.

Singapore . 716 parts In-Stock

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Corohmni

South Africa . 1,041 parts In-Stock

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Aztec Data Supply Inc.

USA . 4,465 parts In-Stock

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MARBEL Systems

Belgium . 3,245 parts In-Stock

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Texas Native Microelectronics

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Modulus Dynamics

Lithuania . 1,281 parts In-Stock

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Kenton Components

USA . 1,058 parts In-Stock

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Microchip USA

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Aranea Global

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Continental Prestige Electronics

USA . 3,356 parts In-Stock

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Argo Parts USA

USA . 1,269 parts In-Stock

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$11,129.739

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$10,904.895

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QUARKTWIN TECHNOLOGY LTD

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Supply Digital

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Vigor

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Qasali Group International

UK . 500 parts In-Stock

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Corphita

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Overview

Unlock the next level of innovation with the XCZU19EG-L2FFVD1760E by Xilinx. Known for its top-notch quality and reliability, Xilinx leads the industry in providing cutting-edge solutions for a wide range of applications. From microprocessor circuits to peripheral ICs, this product offers unmatched value and performance that will take your projects to new heights. Experience the benefits of advanced technology and seamless integration with the XCZU19EG-L2FFVD1760E, the ultimate choice for customers seeking excellence in their designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, offering good protection for the integrated circuits inside.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into electronic systems.

Maximum Supply Voltage: 0.742 V

This low maximum supply voltage can help prevent damage to the device and increase its reliability.

Package Shape: RECTANGULAR

Rectangular shape is space-efficient and fits well in modern circuit board layouts.

No. of Terminals: 1760

Having a large number of terminals allows for versatile connectivity options and integration with various systems.

Package Style (Meter): GRID ARRAY

Grid array package style offers good thermal and electrical performance, making it suitable for high-performance applications.

Minimum Supply Voltage: 0.698 V

Having a low minimum supply voltage ensures the device can operate efficiently even in low power situations.

Maximum Operating Temperature: 110 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and demanding applications.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

This terminal finish provides good conductivity and corrosion resistance, ensuring reliable performance over time.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit, this product offers advanced processing capabilities suitable for a wide range of applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy efficient and reliable.

Nominal Supply Voltage: 0.72 V

Having a stable nominal supply voltage ensures consistent performance under normal operating conditions.

Moisture Sensitivity Level (MSL): 4

With a moisture sensitivity level of 4, this product can withstand moderate exposure to moisture during handling and storage.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU19EG-L2FFVD1760E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

Additional Features:

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

JESD-30 Code:

R-PBGA-B1760

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.742 V

Minimum Supply Voltage:

.698 V

Nominal Supply Voltage:

.72 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU19EG-L2FFVD1760E Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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