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XCZU17EG-L1FFVB1517I

Xilinx

XCZU17EG-L1FFVB1517I by Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

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Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU17EG-L1FFVB1517I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

Additional Features:

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

JESD-30 Code:

R-PBGA-B1517

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.742 V

Minimum Supply Voltage:

.698 V

Nominal Supply Voltage:

.72 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU17EG-L1FFVB1517I Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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