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XCZU17EG-2FFVC1760I

Xilinx

XCZU17EG-2FFVC1760I by Xilinx

The Xilinx XCZU17EG-2FFVC1760I is a CMOS microprocessor circuit with 1760 terminals in a grid array package. It operates b/w -40 to 100 °C and has a supply voltage range of 0.825V to 0.876V. Ideal for industrial applications requiring high-performance processing capabilities.

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Vyrian

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Semicontronic

India . 346 parts In-Stock

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AZTECH Wire

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One Stop Electronics

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MARBEL Systems

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Texas Native Microelectronics

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Kenton Components

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Modulus Dynamics

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Microchip USA

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Overview

Unlock the power of cutting-edge technology with the XCZU17EG-2FFVC1760I by Xilinx. As a trusted leader in the industry, Xilinx delivers top-quality products that exceed expectations. This versatile microprocessor circuit is perfect for a wide range of applications, providing seamless performance and reliability. With its advanced features and industrial-grade design, this product offers unparalleled value and benefits to customers seeking top-notch functionality. Elevate your projects to new heights with the XCZU17EG-2FFVC1760I and experience innovation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protects the internal components of the product, making it suitable for various environments.

Surface Mount: YES

Being surface mount compatible makes this product easier to integrate onto circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 0.876 V

The high maximum supply voltage allows for flexibility in power options and ensures reliable performance under varying voltage conditions.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient utilization of board space and easy placement during assembly.

No. of Terminals: 1760

With a large number of terminals, this product offers extensive connectivity options and versatility for various applications.

Package Style (Meter): GRID ARRAY

The grid array package style provides a higher terminal count in a compact form factor, enabling more functionality in a limited space.

Minimum Supply Voltage: 0.825 V

The low minimum supply voltage ensures efficient power consumption and operation even at lower voltage levels.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this product can withstand elevated temperatures in industrial environments without compromising performance.

Minimum Operating Temperature: -40 °C

The wide temperature range allows for reliable operation even in cold temperatures, making this product suitable for a variety of climates.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The terminal finish of tin, silver, and copper offers excellent conductivity and corrosion resistance for long-lasting and reliable connections.

Terminal Position: BOTTOM

Having terminals positioned at the bottom facilitates a secure and stable connection when mounted on a PCB, ensuring proper functionality.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature minimizes the risk of thermal damage during the soldering process, enhancing the product's reliability.

Peak Reflow Temperature °C: 245

The high peak reflow temperature allows for proper soldering and rework processes, ensuring a strong and durable connection on the PCB.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures reliable performance in harsh industrial environments, making this product suitable for rugged applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Featuring a microprocessor circuit as a peripheral IC type offers advanced processing capabilities, making this product ideal for computing-intensive tasks.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing the efficiency and reliability of the product.

Terminal Form: BALL

The ball terminal form ensures a reliable connection and simplifies the mounting process on the PCB, making installation easier and more secure.

Nominal Supply Voltage: 0.85 V

The nominal supply voltage provides a stable operating voltage for consistent and reliable performance in various applications.

Moisture Sensitivity Level (MSL): 4

With a moisture sensitivity level of 4, this product can withstand moderate exposure to moisture during handling and assembly processes.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU17EG-2FFVC1760I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B1760

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU17EG-2FFVC1760I Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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