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XCZU19EG-1FFVD1760E

Xilinx

XCZU19EG-1FFVD1760E by Xilinx

XCZU19EG-1FFVD1760E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 1760 terminals in a GRID ARRAY package style, suitable for applications requiring high performance at temperatures ranging from 0 to 100 °C.

Median Price

$7,042.610

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Mouser Electronics

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Digiode

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VNN

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Kenton Components

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Modulus Dynamics

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Corphita

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Overview

Experience unparalleled performance and reliability with the XCZU19EG-1FFVD1760E by Xilinx. As a leading manufacturer in the industry, Xilinx delivers cutting-edge technology for a wide range of applications. Whether you're looking to enhance your digital processing capabilities or streamline your system design, this versatile microprocessor circuit offers unmatched value and benefits. Trust Xilinx to provide the quality and innovation you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the internal components, ensuring durability and reliability.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly, saving time and cost in production.

Maximum Supply Voltage: 0.876 V

The high maximum supply voltage allows for flexibility in power input options, accommodating various application requirements.

Package Shape: RECTANGULAR

The rectangular shape makes it easier to integrate into existing systems and designs, optimizing space usage.

No. of Terminals: 1760

The high number of terminals enables versatile connectivity options and interfaces with other components.

Package Style (Meter): GRID ARRAY

The grid array package style offers increased density and functionality in a compact form factor.

Minimum Supply Voltage: 0.825 V

The low minimum supply voltage helps in reducing power consumption and improving efficiency.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature allows for reliable performance in a variety of environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures proper functionality even in cold environments.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

This terminal finish offers good conductivity and corrosion resistance, enhancing the product's longevity.

Terminal Position: BOTTOM

Bottom terminal position allows for easier PCB layout and soldering, improving assembly efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

Short peak reflow time reduces the risk of damage to sensitive components during manufacturing processes.

Peak Reflow Temperature °C: 245

High peak reflow temperature ensures proper soldering and connection reliability.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The inclusion of a microprocessor circuit enhances the product's processing capabilities and functionality.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: BALL

Ball terminal form provides a reliable connection and facilitates high-density packaging.

Nominal Supply Voltage: 0.85 V

The nominal supply voltage ensures stable and consistent power delivery to the device.

Moisture Sensitivity Level (MSL): 4

MSL 4 indicates that the product has moderate sensitivity to moisture, requiring standard handling procedures to prevent damage.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU19EG-1FFVD1760E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B1760

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU19EG-1FFVD1760E Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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