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XCZU19EG-1FFVB1517I

Xilinx

XCZU19EG-1FFVB1517I by Xilinx

XCZU19EG-1FFVB1517I by Xilinx is a CMOS microprocessor circuit with 1517 terminals. It operates in an industrial temperature range of -40 to 100 °C and has a max supply voltage of 0.876 V. This IC is commonly used in various applications requiring high-performance processing capabilities.

Median Price

$6,604.350

Lifecycle Status

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4

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1k+

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Nova Conductors

Japan . 550 parts In-Stock

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Vyrian

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Digiode

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Semicontronic

India . 320 parts In-Stock

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$1.000

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$0.975

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$0.970

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One Stop Electronics

USA . 1,237 parts In-Stock

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AZTECH Wire

Italy . 716 parts In-Stock

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Ampacity Inc.

Singapore . 185 parts In-Stock

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MARBEL Systems

Belgium . 36 parts In-Stock

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Texas Native Microelectronics

USA . 479 parts In-Stock

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$72.366

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Corohmni

South Africa . 527 parts In-Stock

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Kenton Components

USA . 69 parts In-Stock

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Modulus Dynamics

Lithuania . 1,277 parts In-Stock

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Vigor

Singapore . 375 parts In-Stock

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Argo Parts USA

USA . 5,159 parts In-Stock

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$6,472.263

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$6,406.220

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Continental Prestige Electronics

USA . 635 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

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$6,472.263

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QUARKTWIN TECHNOLOGY LTD

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Authorized Procurement Solutions

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Microchip USA

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Supply Digital

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Qasali Group International

UK . 362 parts In-Stock

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Corphita

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Overview

Experience a new level of performance with the XCZU19EG-1FFVB1517I by Xilinx. As a renowned manufacturer in the industry, Xilinx delivers exceptional quality and reliability. This powerful microprocessor circuit offers a wide range of applications and is designed to exceed your expectations. With its advanced technology and industrial-grade capabilities, it guarantees optimal performance even in challenging environments. Benefit from its high supply voltage, low operating temperature, and moisture sensitivity level, ensuring seamless operation and longevity. Discover the endless possibilities and unlock your potential with the XCZU19EG-1FFVB1517I.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and resistance to heat and moisture, making the product suitable for various operating conditions.

Surface Mount: YES

The surface mount feature allows for easy and secure installation, ensuring a reliable connection for the device.

Maximum Supply Voltage: 0.876 V

The high maximum supply voltage ensures stable and efficient operation, resulting in improved performance and reliability.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient use of space, making it ideal for applications with limited board size.

No. of Terminals: 1517

With a large number of terminals, this product offers extensive connectivity options, allowing for versatile integration into different systems.

Package Style (Meter): GRID ARRAY

The grid array package style offers excellent mechanical strength and electrical performance, ensuring enhanced durability and signal integrity.

Minimum Supply Voltage: 0.825 V

The low minimum supply voltage enables energy efficiency and reduces power consumption, making it an environmentally-friendly choice.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this product can withstand challenging environments and maintain reliable operation.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the product's suitability for use in extreme cold conditions.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The terminal finish provides excellent conductivity and corrosion resistance, enhancing the overall performance and lifespan of the product.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB design and assembly, optimizing space utilization and facilitating smoother manufacturing processes.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature ensures efficient soldering and prevents damage to the device during the manufacturing process.

Peak Reflow Temperature °C: 245

The high peak reflow temperature capability allows for reliable soldering and ensures stable connection even in demanding operating conditions.

Temperature Grade: INDUSTRIAL

The industrial temperature grade guarantees reliable performance across a wide temperature range, making it suitable for industrial applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

This product's microprocessor circuit type offers advanced processing capabilities, enabling complex tasks and high computational performance.

Technology: CMOS

The CMOS technology used in this product ensures low power consumption, high-speed operation, and compatibility with various digital systems.

Terminal Form: BALL

The ball terminal form provides secure connections and excellent electrical conductivity, ensuring reliable signal transmission and reducing signal loss.

Nominal Supply Voltage: 0.85 V

The nominal supply voltage ensures stable and consistent power delivery, resulting in reliable and efficient device operation.

Moisture Sensitivity Level (MSL): 4

With a moisture sensitivity level of 4, this product has enhanced protection against moisture, improving its durability and lifespan.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU19EG-1FFVB1517I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B1517

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU19EG-1FFVB1517I Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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