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XCZU15EG-3FFVB1156E

Xilinx

XCZU15EG-3FFVB1156E by Xilinx

XCZU15EG-3FFVB1156E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 1156 terminals in a GRID ARRAY package style. Operating b/w 0 to 100 °C, it's ideal for applications requiring low power consumption and high performance.

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Vyrian

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Ampacity Inc.

Singapore . 472 parts In-Stock

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One Stop Electronics

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AZTECH Wire

Italy . 877 parts In-Stock

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Semicontronic

India . 1,357 parts In-Stock

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Modulus Dynamics

Lithuania . 635 parts In-Stock

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MARBEL Systems

Belgium . 4,376 parts In-Stock

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Corohmni

South Africa . 577 parts In-Stock

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Texas Native Microelectronics

USA . 504 parts In-Stock

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Kenton Components

USA . 90 parts In-Stock

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Microchip USA

USA . 915 parts In-Stock

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Argo Parts USA

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Qasali Group International

UK . 2,827 parts In-Stock

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Supply Digital

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Continental Prestige Electronics

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Aranea Global

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Overview

Discover the cutting-edge XCZU15EG-3FFVB1156E by Xilinx, a top-tier manufacturer known for delivering high-quality products. This versatile microprocessor circuit offers unparalleled performance in various applications, making it a must-have for tech enthusiasts and professionals alike. With its advanced technology and reliable design, this product ensures optimal functionality and efficiency. Experience the benefits of superior processing power, seamless integration, and exceptional value with the XCZU15EG-3FFVB1156E – unleash the full potential of your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration into electronic circuits.

Maximum Supply Voltage: 0.927 V

The high maximum supply voltage ensures stable and consistent performance.

Package Shape: RECTANGULAR

The rectangular shape allows for compact and space-efficient design.

No. of Terminals: 1156

High number of terminals provide flexibility in connectivity and functionality.

Package Style (Meter): GRID ARRAY

The grid array package style offers easy layout and assembly.

Minimum Supply Voltage: 0.873 V

The low minimum supply voltage ensures energy efficiency and reduces power consumption.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, the product can withstand rigorous conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable performance even in cooler environments.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The use of high-quality terminal finish ensures strong connections and prevents corrosion.

Terminal Position: BOTTOM

Bottom terminal position allows for easy mounting and soldering during assembly.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature indicates quick and efficient soldering process.

Peak Reflow Temperature °C: 245

High peak reflow temperature ensures reliable soldering bonds for secure connections.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The inclusion of a microprocessor circuit enhances the product's processing capabilities and functionality.

Technology: CMOS

CMOS technology ensures low power consumption and high-speed operation.

Terminal Form: BALL

The ball terminal form allows for efficient soldering and reliable connections.

Nominal Supply Voltage: 0.9 V

The nominal supply voltage provides a standard reference for optimal performance.

Moisture Sensitivity Level (MSL): 4

MSL 4 indicates that the product can withstand moderate levels of moisture exposure without damage.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU15EG-3FFVB1156E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B1156

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.927 V

Minimum Supply Voltage:

.873 V

Nominal Supply Voltage:

.9 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU15EG-3FFVB1156E Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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