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XCZU17EG-1FFVD1760E

Xilinx

XCZU17EG-1FFVD1760E by Xilinx

XCZU17EG-1FFVD1760E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 1760 terminals in a GRID ARRAY package style, operating b/w 0-100 °C. Suitable for Other Function uPs,uCs & Peripheral ICs applications.

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Vyrian

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AZTECH Wire

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Semicontronic

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One Stop Electronics

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Modulus Dynamics

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Overview

Discover the power and innovation of the XCZU17EG-1FFVD1760E by Xilinx. With a reputation for quality and reliability, Xilinx delivers cutting-edge solutions in the category of Other Function uPs, uCs & Peripheral ICs. This product offers unmatched value with its advanced technology, versatile applications, and top-notch performance. Whether you're looking to enhance your microprocessor circuits or push the boundaries of your projects, the XCZU17EG-1FFVD1760E is the perfect choice for customers seeking premium features and benefits. Elevate your designs with Xilinx today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and reliability to the product, making it suitable for various environments and applications.

Surface Mount: YES

Being surface mountable allows for easy installation and integration of the product onto circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 0.876 V

The high maximum supply voltage capability of 0.876 V ensures stable and efficient performance of the product, even under varying voltage conditions.

Package Shape: RECTANGULAR

The rectangular package shape offers a compact and space-saving design, ideal for applications where size constraints are a concern.

No. of Terminals: 1760

With a large number of terminals, the product allows for versatile connectivity options, enabling connectivity to various other components and systems.

Package Style (Meter): GRID ARRAY

The grid array package style provides efficient heat dissipation and electrical performance, contributing to the overall reliability and longevity of the product.

Minimum Supply Voltage: 0.825 V

The low minimum supply voltage requirement of 0.825 V allows for energy-efficient operation of the product, reducing power consumption and costs.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature tolerance of 100°C ensures reliable performance even in harsh or demanding operating conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C allows the product to function effectively in various temperature environments, from extreme cold to moderate heat.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The terminal finish of tin/silver/copper provides excellent conductivity and corrosion resistance, ensuring long-term reliability and signal integrity.

Terminal Position: BOTTOM

The bottom terminal position offers easy access and soldering during installation, contributing to the overall ease of use and assembly of the product.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, the product enables quick and efficient reflow soldering, speeding up the manufacturing process.

Peak Reflow Temperature °C: 245

The high peak reflow temperature tolerance of 245°C ensures proper soldering and bonding of the components, resulting in reliable connections and performance.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Featuring a microprocessor circuit as a peripheral IC type allows the product to perform complex calculations and operations, making it suitable for advanced applications and tasks.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high speed operation, contributing to energy efficiency and overall performance of the product.

Terminal Form: BALL

The ball terminal form provides a reliable and secure connection, enhancing the overall connectivity and durability of the product.

Nominal Supply Voltage: 0.85 V

The nominal supply voltage of 0.85 V ensures stable and efficient power supply to the product, maintaining consistent performance and functionality.

Moisture Sensitivity Level (MSL): 4

With a moisture sensitivity level of 4, the product is less susceptible to moisture damage, making it suitable for use in humid or damp environments.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU17EG-1FFVD1760E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B1760

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU17EG-1FFVD1760E Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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