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XCZU19EG-2FFVC1760I

Xilinx

XCZU19EG-2FFVC1760I by Xilinx

XCZU19EG-2FFVC1760I by Xilinx is a MICROPROCESSOR CIRCUIT with 1760 terminals in a GRID ARRAY package. It operates b/w -40 to 100 °C and has a supply voltage range of 0.825V to 0.876V. Ideal for industrial applications requiring high-performance CMOS technology.

Median Price

$10,143.890

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Nova Conductors

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AZTECH Wire

Italy . 551 parts In-Stock

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Ampacity Inc.

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One Stop Electronics

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MARBEL Systems

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Texas Native Microelectronics

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Semicontronic

India . 945 parts In-Stock

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Kenton Components

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Corohmni

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Qasali Group International

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Modulus Dynamics

Lithuania . 1,244 parts In-Stock

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Microchip USA

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Netroflash

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Overview

Unleash the power of innovation with the XCZU19EG-2FFVC1760I by Xilinx. As a leading manufacturer in the industry, Xilinx delivers top-notch quality and reliability in every product. This versatile microprocessor circuit is perfect for a wide range of applications, offering unparalleled performance and efficiency. Experience seamless integration and exceptional value with the XCZU19EG-2FFVC1760I, designed to meet the demands of today's technology-driven world. Elevate your projects with this cutting-edge solution and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good protection and insulation for the components inside, increasing the overall durability of the product.

Surface Mount: YES

Being surface mountable allows for easier and more efficient assembly processes, saving time and cost.

Maximum Supply Voltage: 0.876 V

This voltage level allows for efficient performance while ensuring the safety of the product and connected devices.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to fit and mount in various electronic devices, providing versatility in application.

No. of Terminals: 1760

Having a high number of terminals allows for more connections and functionalities, making the product suitable for complex applications.

Package Style (Meter): GRID ARRAY

The grid array package style provides a compact design while maintaining a high terminal count, optimizing space usage in electronic systems.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this product can perform reliably in various environmental conditions, ensuring consistent functionality.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in data processing.

Nominal Supply Voltage: 0.85 V

The nominal supply voltage ensures stable and efficient operation of the product, contributing to overall performance and reliability.

Moisture Sensitivity Level (MSL): 4

With MSL level 4, the product has moderate sensitivity to moisture, making it suitable for a variety of environments and storage conditions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU19EG-2FFVC1760I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B1760

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU19EG-2FFVC1760I Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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