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XCZU17EG-2FFVB1517I

Xilinx

XCZU17EG-2FFVB1517I by Xilinx

XCZU17EG-2FFVB1517I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has 1517 terminals in a GRID ARRAY package style. Ideal for industrial applications requiring high performance at supply voltages ranging from 0.825V to 0.876V.

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Vyrian

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Overview

Upgrade your electronic devices with the XCZU17EG-2FFVB1517I by Xilinx, a top-of-the-line microprocessor circuit that guarantees reliable performance and cutting-edge technology. Xilinx, a renowned manufacturer in the industry, delivers quality products that meet the highest standards. This versatile IC is ideal for a wide range of applications, offering unparalleled benefits and value to customers looking to enhance their equipment. Trust Xilinx to provide you with the best in technological advancements and innovative solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components due to its good insulating properties and durability, making the product robust and reliable.

Surface Mount: YES

Surface mount technology allows for smaller components, higher component density, and better electrical performance, making the product more compact and efficient.

Maximum Supply Voltage: 0.876 V

Having a maximum supply voltage within this range ensures safe operation and prevents damage to the product, providing reliability in various applications.

Package Shape: RECTANGULAR

The rectangular package shape makes it easier to handle and integrate into electronic systems, contributing to ease of use and installation.

No. of Terminals: 1517

Having a high number of terminals allows for more connectivity options and functionalities, making the product versatile and suitable for complex applications.

Package Style (Meter): GRID ARRAY

The grid array package style provides secure connections and efficient heat dissipation, ensuring the product's performance under various operating conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the energy efficiency and reliability of the product.

Moisture Sensitivity Level (MSL): 4

With a moisture sensitivity level of 4, the product can withstand exposure to moderate humidity levels without compromising its functionality, making it suitable for a wide range of environments.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU17EG-2FFVB1517I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B1517

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU17EG-2FFVB1517I Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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