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XCZU19EG-2FFVE1924I

Xilinx

XCZU19EG-2FFVE1924I by Xilinx

XCZU19EG-2FFVE1924I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance and reliability.

Median Price

$10,143.890

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 500 parts In-Stock

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$10,143.890

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Vyrian

USA . 3,280 parts In-Stock

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VNN

France . 627 parts In-Stock

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Digiode

USA . 474 parts In-Stock

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AZTECH Wire

Italy . 687 parts In-Stock

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$6.922

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One Stop Electronics

USA . 1,295 parts In-Stock

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$23.000

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Ampacity Inc.

Singapore . 242 parts In-Stock

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$23.000

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Semicontronic

India . 650 parts In-Stock

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$28.000

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$27.300

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$27.160

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$28.000

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MARBEL Systems

Belgium . 550 parts In-Stock

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$58.298

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$55.966

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Texas Native Microelectronics

USA . 487 parts In-Stock

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$67.009

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$64.329

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$62.318

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Corohmni

South Africa . 592 parts In-Stock

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$80.202

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Kenton Components

USA . 90 parts In-Stock

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$80.411

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$70.762

90

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Modulus Dynamics

Lithuania . 283 parts In-Stock

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$119.743

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$119.743

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$119.743

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Microchip USA

USA . 833 parts In-Stock

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$5,194.260

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Continental Prestige Electronics

USA . 3,748 parts In-Stock

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$9,941.012

3,748

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$9,941.012

Argo Parts USA

USA . 428 parts In-Stock

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$10,143.890

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$10,042.451

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$9,941.012

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$9,839.573

428

$10,143.890

$10,042.451

$9,941.012

$9,839.573

Netroflash

USA . 100 parts In-Stock

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$10,143.890

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Vigor

Singapore . 850 parts In-Stock

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Supply Digital

USA . 401 parts In-Stock

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Corphita

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Qasali Group International

UK . 82 parts In-Stock

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$173.687

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$159.213

82

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$173.687

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$159.213

Overview

Unlock the potential of your electronic projects with the XCZU19EG-2FFVE1924I by Xilinx. Known for their top-notch quality and reliability, Xilinx offers a wide range of applications in the category of Other Function uPs,uCs & Peripheral ICs. This cutting-edge product is designed to provide customers with unparalleled value, benefits, and advantages, making it the ideal choice for any project that requires superior performance and efficiency. Trust Xilinx to deliver excellence in every aspect of your electronics design.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the product, ensuring reliable performance in various environments.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product onto circuit boards, saving time and reducing manufacturing costs.

Maximum Supply Voltage: 0.876 V

The maximum supply voltage of 0.876V ensures safe operation and prevents damage to the product's components, enhancing lifespan and reliability.

Package Shape: RECTANGULAR

Rectangular package shape offers compatibility with standard board layouts and makes it easy to integrate the product into existing designs.

No. of Terminals: 1924

High number of terminals provide versatile connectivity options, allowing for complex system designs and functionalities.

Package Style (Meter): GRID ARRAY

Grid array package style offers efficient heat dissipation and mechanical stability, enabling optimal performance under demanding operating conditions.

Minimum Operating Temperature: -40 °C

Wide operating temperature range from -40°C ensures the product's functionality in extreme cold conditions, making it suitable for a variety of applications.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

Tin/Silver/Copper terminal finish provides reliable electrical conductivity and corrosion resistance, enhancing the product's overall performance and longevity.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Inclusion of a microprocessor circuit as a peripheral IC type enables advanced computing capabilities and versatile functions in the product, making it suitable for a wide range of applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, resulting in energy-efficient operation and improved signal integrity of the product.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU19EG-2FFVE1924I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B1924

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU19EG-2FFVE1924I Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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