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XCZU19EG-3FFVD1760E

Xilinx

XCZU19EG-3FFVD1760E by Xilinx

XCZU19EG-3FFVD1760E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 1760 terminals in a GRID ARRAY package style, operating b/w 0-100 °C. Suitable for Other Function uPs,uCs & Peripheral ICs applications.

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Vyrian

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Ampacity Inc.

Singapore . 788 parts In-Stock

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$3.000

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AZTECH Wire

Italy . 345 parts In-Stock

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Semicontronic

India . 1,184 parts In-Stock

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Corohmni

South Africa . 580 parts In-Stock

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One Stop Electronics

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MARBEL Systems

Belgium . 426 parts In-Stock

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Texas Native Microelectronics

USA . 200 parts In-Stock

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Modulus Dynamics

Lithuania . 570 parts In-Stock

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Kenton Components

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QUARKTWIN TECHNOLOGY LTD

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Argo Parts USA

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Supply Digital

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Qasali Group International

UK . 755 parts In-Stock

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Microchip USA

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Continental Prestige Electronics

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Overview

Unleash the power of innovation with the XCZU19EG-3FFVD1760E by Xilinx. As a leader in the industry, Xilinx delivers exceptional quality and performance in their products. This versatile microprocessor circuit is perfect for a wide range of applications, offering customers unparalleled value and benefits. Experience seamless integration, superior functionality, and reliable operation with the XCZU19EG-3FFVD1760E. Elevate your projects to new heights with this cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for a wide range of applications.

Surface Mount: YES

Being surface mount compatible allows for easy and convenient integration into circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 0.927 V

The high maximum supply voltage ensures reliable performance and flexibility in various voltage environments.

Package Shape: RECTANGULAR

The rectangular package shape offers versatility in placement and can be easily accommodated in different designs.

No. of Terminals: 1760

The numerous terminals provide ample connectivity options, enabling complex circuit configurations and functionality.

Package Style (Meter): GRID ARRAY

The grid array package style offers efficient signal routing and thermal performance, enhancing overall system reliability.

Minimum Supply Voltage: 0.873 V

The low minimum supply voltage ensures compatibility with a variety of power sources and enhances energy efficiency.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature allows for reliable operation in harsh environments or extended usage scenarios.

Technology: CMOS

The CMOS technology used in the product delivers low power consumption, high noise immunity, and fast switching speeds for efficient performance.

Terminal Form: BALL

The ball terminal form facilitates easy soldering and reliable electrical connections, contributing to overall product longevity and performance.

Moisture Sensitivity Level (MSL): 4

The MSL 4 rating indicates that the product can withstand moderate exposure to moisture during storage and assembly processes, ensuring long-term reliability.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU19EG-3FFVD1760E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B1760

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.927 V

Minimum Supply Voltage:

.873 V

Nominal Supply Voltage:

.9 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU19EG-3FFVD1760E Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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