Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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XC7Z035-3FFG676E
Xilinx
XC7Z035-3FFG676E by Xilinx is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-100 °C with supply voltage range of 0.95-1.05 V. With 676 terminals in a GRID ARRAY package, it's ideal for applications requiring high-performance computing in compact spaces.
S-PBGA-B676
27 mm
676
100 Cel
0 Cel
PLASTIC/EPOXY
BGA
BGA676,26X26,40
SQUARE
GRID ARRAY
3.24 mm
1.05 V
.95 V
1 V
YES
CMOS
BALL
1 mm
BOTTOM
SYSTEM ON CHIP
XC7Z035-3FFG900E
XC7Z035-3FFG900E by Xilinx is a 900-terminal programmable SoC with CMOS technology. Operating at 0-100°C, it has a supply voltage range of 0.95-1.05 V and terminal pitch of 1 mm. Ideal for applications requiring high-performance computing in compact spaces.
S-PBGA-B900
31 mm
900
BGA900,30X30,40
3.35 mm
PROGRAMMABLE SYSTEM ON CHIP
XC7Z035-L2FBG676I
The Xilinx XC7Z035-L2FBG676I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With 676 terminals in a grid array package style, it's ideal for applications requiring high-performance processing in compact spaces.
-40 Cel
2.54 mm
XC7Z035-L2FFG676I
SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Minimum Supply Voltage: .95 V;
XC7Z035-L2FFG900I
PROGRAMMABLE SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;
XC7Z045-L2FBG676I
SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Package Equivalence Code: BGA676,26X26,40;
XC7Z045-L2FFG676I
SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage: 1 V;
XC7Z045-L2FFG900I
SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; Length: 27 mm;
XC7Z100-L2FFG1156I
XC7Z100-L2FFG1156I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With 1156 terminals in a square grid array package, it's ideal for various applications requiring high-performance processing capabilities.
S-PBGA-B1156
35 mm
1156
BGA1156,34X34,40
3.1 mm
XC7Z100-L2FFG900I
XC7Z100-L2FFG900I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With 900 terminals in a grid array package, it's ideal for various applications requiring high-performance processing capabilities.
AM4376BZDNA100
Texas Instruments
AM4376BZDNA100 by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105°C, has 491 terminals in a GRID ARRAY package style, and supports a supply voltage range of 1.272V to 1.378V. Ideal for industrial applications requiring low profile and fine pitch components.
S-PBGA-B491
e1
17 mm
3
491
105 Cel
LFBGA
BGA491,25X25,25
GRID ARRAY, LOW PROFILE, FINE PITCH
260
1.3 mm
1.378 V
1.272 V
1.325 V
INDUSTRIAL
TIN SILVER COPPER
.65 mm
30
AM4376BZDN100
AM4376BZDN100 by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-90°C, has 491 terminals in a GRID ARRAY package style, and supports a supply voltage range of 1.272-1.378 V. Ideal for applications requiring low profile, fine pitch ICs in surface mount packages.
90 Cel
OTHER
AM4376BZDN80
AM4376BZDN80 by Texas Instruments is a System on Chip with 491 terminals in a low profile, fine pitch grid array package. It operates b/w 0-90°C, with supply voltage range of 1.21-1.326V. Ideal for applications requiring high performance and compact design.
1.326 V
1.21 V
1.26 V
AM4376BZDNA80
AM4376BZDNA80 by Texas Instruments is a System on Chip with CMOS technology. It operates b/w -40 to 105°C, has 491 terminals in a low profile grid array package. Ideal for industrial applications requiring high performance and reliability.
AM4376BZDND100
AM4376BZDND100 by Texas Instruments is a System on Chip with 491 terminals in a low profile, fine pitch grid array package. It operates b/w -40 to 90°C, with supply voltage ranging from 1.272V to 1.378V. Ideal for industrial applications requiring high performance and compact design.
AM4376BZDND30
The Texas Instruments AM4376BZDND30 is a System on Chip with 491 terminals in a low profile, fine pitch grid array package. It operates at -40 to 90°C, with supply voltage ranging from 0.912V to 1V. Ideal for industrial applications requiring CMOS technology and bottom terminal position.
.912 V
AM4376BZDND80
AM4376BZDND80 by Texas Instruments is a System on Chip with 491 terminals in a low profile, fine pitch grid array package. It operates b/w -40 to 90°C and has a supply voltage range of 1.21V to 1.326V. Ideal for industrial applications requiring high performance and compact design.
AM4377BZDNA80
AM4377BZDNA80 by Texas Instruments is a System on Chip with CMOS technology. It operates b/w -40 to 105°C, has 491 terminals in a low profile grid array package. Ideal for industrial applications requiring a supply voltage range of 1.21-1.326V and peak reflow temperature of 260°C.
AM4377BZDND100
AM4377BZDND100 by Texas Instruments is a System on Chip with 491 terminals, operating at -40 to 90°C. It features a low profile grid array package style, 0.65mm terminal pitch, and 1.272-1.378V supply voltage range. Ideal for industrial applications requiring high-performance computing in compact spaces.
AM4377BZDND80
AM4377BZDND80 by Texas Instruments is a System on Chip with 491 terminals, operating at -40 to 90°C. It features a low profile grid array package style, 0.65mm terminal pitch, and 1.21-1.326V supply voltage range. Ideal for industrial applications requiring high-performance computing in compact spaces.
AM4378BZDN100
AM4378BZDN100 by Texas Instruments is a System on Chip with 491 terminals in a low profile, fine pitch grid array package. It operates b/w 0-90°C with supply voltage range of 1.272-1.378V, making it ideal for embedded applications requiring high performance and compact design.
AM4378BZDN80
AM4378BZDN80 by Texas Instruments is a CMOS system-on-chip with a max supply voltage of 1.326V and a min operating temperature of 0°C. It is used in applications requiring low-profile, fine-pitch grid array packages with 491 terminals.
AM4378BZDNA100
AM4378BZDNA100 by Texas Instruments is a System on Chip with 491 terminals, operating at -40 to 105°C. It features a low profile grid array package with 0.65mm terminal pitch. Ideal for industrial applications requiring CMOS technology and a supply voltage range of 1.272-1.378V.
AM4378BZDNA80
AM4378BZDNA80 by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C, with a supply voltage range of 1.21V to 1.326V. Ideal for applications requiring low profile and fine pitch package style in industrial settings.
AM4378BZDND100
AM4378BZDND100 by Texas Instruments is a System on Chip with 491 terminals, operating at -40 to 90°C. It features a low profile grid array package with 0.65mm terminal pitch. Ideal for industrial applications requiring CMOS technology and a supply voltage range of 1.272-1.378V.
AM4378BZDND80
AM4378BZDND80 by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 90 °C and has a supply voltage range of 1.21V to 1.326V. This IC, in GRID ARRAY package style, is ideal for industrial applications requiring low profile and fine pitch components.
AM4379BZDNA100
AM4379BZDNA100 by Texas Instruments is a System on Chip with 491 terminals, operating at -40 to 105°C. It features a low profile grid array package, 0.65mm terminal pitch, and 1.272-1.378V supply voltage range. Ideal for industrial applications requiring high-performance uPs/uCs & peripheral ICs in compact form factors.
AM4379BZDNA80
AM4379BZDNA80 by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C, with a supply voltage range of 1.21V to 1.326V. This low-profile, fine-pitch GRID ARRAY package is ideal for industrial applications requiring high performance in compact spaces.
66AK2L06XCMS2
The Texas Instruments 66AK2L06XCMS2 is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.1V. Ideal for applications requiring high performance in a compact GRID ARRAY package.
25 mm
4
FBGA
GRID ARRAY, FINE PITCH
245
3.55 mm
1.1 V
Tin/Silver/Copper (Sn/Ag/Cu)
.8 mm
MICROPROCESSOR CIRCUIT
66AK2L06XCMSA2
The Texas Instruments 66AK2L06XCMSA2 is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.95V to 1.1V. Ideal for industrial applications requiring high performance and reliability in a compact GRID ARRAY package.
66AK2L06XCMSA
The Texas Instruments 66AK2L06XCMSA is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.1V. This IC, in GRID ARRAY package style, is ideal for industrial applications requiring high performance and reliability.
66AK2L06XCMS
The Texas Instruments 66AK2L06XCMS is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C and has a supply voltage range of 0.95-1.1 V. This IC, in GRID ARRAY package style, is ideal for applications requiring high processing power in compact designs.
DLPC3439ZEZ
DLPC3439ZEZ by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 201 terminals in a GRID ARRAY package style, suitable for applications requiring low power consumption and operating temperatures b/w -30 to 85 °C. The IC operates at supply voltages ranging from 1.045V to 1.155V, making it ideal for compact electronic devices.
S-PBGA-B201
13 mm
201
85 Cel
-30 Cel
VFBGA
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
1.155 V
1.045 V
DLPC410ZYR
DLPC410ZYR by Texas Instruments is a 676-terminal microprocessor circuit with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05V. Ideal for applications requiring high-performance processing in compact spaces.
NOT SPECIFIED
3 mm
DLPC910ZYR
DLPC910ZYR by Texas Instruments is a 676-terminal microprocessor circuit with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05V. Ideal for applications requiring I2C and USB bus compatibility in a compact 27x27mm grid array package.
I2C; USB
HBGA
GRID ARRAY, HEAT SINK/SLUG
DLPC3438CZEZ
DLPC3438CZEZ by Texas Instruments is a MICROPROCESSOR CIRCUIT with 201 terminals in a GRID ARRAY package. It operates b/w -30 to 85 °C, with supply voltage ranging from 1.045V to 1.155V. Ideal for applications requiring high performance and low power consumption.
DLPC3439CZEZ
DLPC3439CZEZ by Texas Instruments is a MICROPROCESSOR CIRCUIT with 201 terminals in a GRID ARRAY package. It operates b/w -30 to 85 °C with supply voltage range of 1.045V to 1.155V, making it ideal for applications requiring high performance and low power consumption.
CYTMA525-49FNI25ZZT
Cypress Semiconductor
CYTMA525-49FNI25ZZT by Cypress Semiconductor is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 1.71V to 5.5V, featuring a GRID ARRAY package style with 49 terminals for surface mount applications in various electronic devices.
IT ALSO OPERATES AT 2.65 TO 5.5V ANALOG SUPPLY
R-PBGA-B49
49
RECTANGULAR
5.5 V
1.71 V
MCIMX6G0DVM05AA
NXP Semiconductors
SYSTEM ON CHIP; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;
S-PBGA-B289
14 mm
289
95 Cel
BGA289,17X17,32
1.32 mm
1.3 V
1.15 V
COMMERCIAL
40
DRA746APGABCQ1
DRA746APGABCQ1 by Texas Instruments is an AEC-Q100 compliant microprocessor circuit with 760 terminals in a grid array package. It operates at a speed of 1500 rpm, suitable for automotive applications due to its CMOS technology and tin silver copper terminal finish. The device can withstand peak reflow temperatures up to 250°C for 30 seconds, making it ideal for automotive electronic systems.
X-PBGA-B760
760
UNSPECIFIED
250
AEC-Q100
1500 rpm
AUTOMOTIVE
MCIMX6DP4AVT8AA
SoC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;
S-PBGA-B624
21 mm
624
125 Cel
BGA624,25X25,32
2.16 mm
1.5 V
1.225 V
1.4 V
SoC
MCIMX6DP5EYM1AA
SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;
EACH GPIO MODULE SUPPORTS 32 BITS OF I/O.
-20 Cel
1.6 mm
1.35 V
MCIMX6DP6AVT8AA
MCIMX6DP7CVT8AA
SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;
1.275 V
MCIMX6QP5EYM1AA
MCIMX6QP5EYM1AA by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 624 terminals. It operates b/w -20°C to 105°C, with supply voltage ranging from 1.35V to 1.5V. Ideal for applications requiring high-performance computing in compact spaces.
MCIMX6QP7CVT8AA
MCIMX6QP7CVT8AA by NXP Semiconductors is a SoC with CMOS technology, featuring 624 terminals in a grid array package. It operates b/w -40 to 105 °C and has a supply voltage range of 1.275V to 1.5V. Ideal for industrial applications requiring high performance and reliability.
MCIMX6G1AVM05AA
SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;
MCIMX6G1AVM07AA
1.25 V
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