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AM4377BZDND80

Texas Instruments

AM4377BZDND80 by Texas Instruments

AM4377BZDND80 by Texas Instruments is a System on Chip with 491 terminals, operating at -40 to 90°C. It features a low profile grid array package style, 0.65mm terminal pitch, and 1.21-1.326V supply voltage range. Ideal for industrial applications requiring high-performance computing in compact spaces.

Median Price

$18.464

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 108 parts In-Stock

1+ parts

$18.464

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$16.128

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$11.123

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108

$18.464

$16.128

$11.123

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,023 parts In-Stock

1+ parts

$17.541

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2,023

$17.541

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Vyrian

USA . 5,861 parts In-Stock

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5,861

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Distributors (Availability)

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Native Components

USA . 892 parts In-Stock

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$1.677

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892

$1.677

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Northwest PG Solutions

USA . 2,239 parts In-Stock

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$1.845

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AZTECH Wire

Italy . 616 parts In-Stock

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$8.780

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Corphita

USA . 1,862 parts In-Stock

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$16.618

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Parana Technologies

USA . 34 parts In-Stock

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$40.554

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34

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ChromeModa Solutions

Germany . 4,120 parts In-Stock

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$45.566

100+ parts

$37.364

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4,120

$45.566

$37.364

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IDEA Electronic Components Group

UK . 841 parts In-Stock

1+ parts

$45.566

100+ parts

$43.288

1k+ parts

$41.009

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841

$45.566

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Lixinc

USA . 19,728 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 7,565 parts In-Stock

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Authorized Procurement Solutions

USA . 7,500 parts In-Stock

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7,500

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DigiPath Technology Company

USA . 1,607 parts In-Stock

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$41.082

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1,607

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$41.082

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Component Stockers USA

USA . 45 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the AM4377BZDND80 by Texas Instruments. As a leading manufacturer in the industry, this versatile system-on-chip offers unparalleled quality and reliability for a wide range of applications. From smart home devices to industrial automation, this innovative product delivers exceptional performance and efficiency. Experience seamless integration and superior functionality with the AM4377BZDND80, providing you with the value and benefits you need to stay ahead in today's fast-paced world.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a strong and durable housing for the product, ensuring its longevity and reliability.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of electronic components, making this product easier to integrate into various systems.

Maximum Supply Voltage: 1.326 V

The high maximum supply voltage allows for a wide range of operating conditions and flexibility in power supply options.

Package Shape: SQUARE

The square shape of the package makes it easy to mount and secure within a system, saving space and ensuring a compact design.

No. of Terminals: 491

The high number of terminals allows for a greater amount of connectivity and functions to be integrated into the product, making it versatile and suitable for various applications.

Minimum Supply Voltage: 1.21 V

The low minimum supply voltage ensures that the product can operate efficiently even in low power conditions, making it energy-efficient.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature allows the product to withstand harsh environmental conditions and operate reliably in high-temperature settings.

Terminal Finish: TIN SILVER COPPER

This finish provides excellent conductivity and corrosion resistance, ensuring a stable connection and long-term performance of the product.

Terminal Position: BOTTOM

The bottom terminal position makes it easier to solder and connect the product to other components, simplifying the assembly process.

Maximum Seated Height: 1.3 mm

The low maximum seated height allows for a slim and compact design of the product, making it suitable for applications where space is limited.

Width: 17 mm

The compact width of the product allows for easy installation and integration into different systems and applications.

Peak Reflow Temperature: 260 °C

The high peak reflow temperature ensures that the product can withstand the soldering process without damage, guaranteeing a reliable and stable connection.

Temperature Grade: INDUSTRIAL

The industrial temperature grade rating indicates that the product is designed to operate reliably in harsh industrial environments, making it suitable for a wide range of applications.

Peripheral IC Type: SYSTEM ON CHIP

The system-on-chip design integrates multiple functions into a single IC, reducing the need for external components and simplifying the overall system design.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates that the product is moderately sensitive to moisture, which is important for ensuring the reliability and performance of the product in humid conditions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AM4377BZDND80 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B491

JESD-609 Code:

e1

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

491

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA491,25X25,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.3 mm

Maximum Supply Voltage:

1.326 V

Minimum Supply Voltage:

1.21 V

Nominal Supply Voltage:

1.26 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

AM4377BZDND80 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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