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AM4378BZDND80

Texas Instruments

AM4378BZDND80 by Texas Instruments

AM4378BZDND80 by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 90 °C and has a supply voltage range of 1.21V to 1.326V. This IC, in GRID ARRAY package style, is ideal for industrial applications requiring low profile and fine pitch components.

Median Price

$13.499

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,074 parts In-Stock

1+ parts

$13.499

100+ parts

$11.791

1k+ parts

$8.132

10k+ parts

-

4,074

$13.499

$11.791

$8.132

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 89 parts In-Stock

1+ parts

$12.510

100+ parts

-

1k+ parts

-

10k+ parts

-

89

$12.510

-

-

-

Digiode

USA . 343 parts In-Stock

1+ parts

$12.824

100+ parts

-

1k+ parts

-

10k+ parts

-

343

$12.824

-

-

-

VNN

France . 27,204 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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27,204

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-

-

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Vyrian

USA . 6,615 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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6,615

-

-

-

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TME

Poland . 360 parts In-Stock

1+ parts

-

100+ parts

$13.840

1k+ parts

-

10k+ parts

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360

-

$13.840

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 4,071 parts In-Stock

1+ parts

$11.470

100+ parts

-

1k+ parts

-

10k+ parts

-

4,071

$11.470

-

-

-

Corphita

USA . 1,010 parts In-Stock

1+ parts

$12.149

100+ parts

-

1k+ parts

-

10k+ parts

-

1,010

$12.149

-

-

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Bastille Electronics

Australia . 300 parts In-Stock

1+ parts

$12.510

100+ parts

$11.884

1k+ parts

-

10k+ parts

$11.134

300

$12.510

$11.884

-

$11.134

Parana Technologies

USA . 1,473 parts In-Stock

1+ parts

$16.758

100+ parts

-

1k+ parts

$17.011

10k+ parts

-

1,473

$16.758

-

$17.011

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ChromeModa Solutions

Germany . 2,496 parts In-Stock

1+ parts

$18.829

100+ parts

$15.440

1k+ parts

-

10k+ parts

-

2,496

$18.829

$15.440

-

-

IDEA Electronic Components Group

UK . 502 parts In-Stock

1+ parts

$18.829

100+ parts

$17.888

1k+ parts

$16.946

10k+ parts

-

502

$18.829

$17.888

$16.946

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AZTECH Wire

Italy . 731 parts In-Stock

1+ parts

$21.570

100+ parts

-

1k+ parts

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10k+ parts

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731

$21.570

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-

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Lixinc

USA . 8,742 parts In-Stock

1+ parts

-

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8,742

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-

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Futuretech Components

Singapore . 3,000 parts In-Stock

1+ parts

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100+ parts

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3,000

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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3,000

-

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DigiPath Technology Company

USA . 1,517 parts In-Stock

1+ parts

-

100+ parts

$16.976

1k+ parts

-

10k+ parts

-

1,517

-

$16.976

-

-

Overview

Elevate your electronic designs with the AM4378BZDND80 by Texas Instruments, a cutting-edge product in the category of Other Function uPs,uCs & Peripheral ICs. With Texas Instruments' renowned reputation for quality and innovation, this product offers unmatched reliability and performance. Ideal for a wide range of applications, this versatile chip provides exceptional value with its advanced technology, compact package design, and efficient operation. Experience the benefits of seamless integration and optimal functionality with the AM4378BZDND80 - the perfect solution for your electronic projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable electronic devices.

Surface Mount: YES

Surface mount technology allows for easy and compact integration of the product onto circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 1.326 V

The high maximum supply voltage allows for flexibility in power input options and compatibility with a wide range of electronic systems.

Package Shape: SQUARE

The square package shape facilitates uniform heat dissipation and easy orientation during installation, improving overall performance and reliability.

No. of Terminals: 491

The high number of terminals enables the product to connect to multiple external devices and peripherals, expanding its functionality and versatility.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style offers high density integration and improved signal integrity, essential for modern electronic designs.

Minimum Supply Voltage: 1.21 V

The low minimum supply voltage ensures efficient power consumption and prevents overloading of the electronic components, extending the product's lifespan.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature allows the product to function reliably in harsh environmental conditions without overheating or performance degradation.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature ensures the product can operate in extreme cold environments without risk of component failure or damage.

Terminal Finish: TIN SILVER COPPER

The combination of tin, silver, and copper terminal finish enhances conductivity, corrosion resistance, and solderability, ensuring stable and durable connections.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB layout and routing, enhancing the overall system design and aiding in efficient heat dissipation.

Maximum Seated Height: 1.3 mm

The low maximum seated height allows for compact and slim product designs, suitable for applications with space constraints or size limitations.

Width: 17 mm

The moderate width dimension provides a balance between compactness and ease of handling during installation or maintenance, optimizing user experience.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature ensures reliable soldering and prevents thermal damage to the product, guaranteeing long-term functionality.

Peak Reflow Temperature °C: 260

The high peak reflow temperature enables efficient soldering and robust mechanical connections, essential for ensuring product performance under varying operating conditions.

Length: 17 mm

The matching length dimension complements the square package shape, enabling consistent and uniform integration into electronic assemblies for optimal performance.

Temperature Grade: INDUSTRIAL

The industrial temperature grade certification ensures the product's reliability and performance in demanding industrial environments, meeting high standards for quality and durability.

Peripheral IC Type: SYSTEM ON CHIP

The system-on-chip peripheral IC type integrates multiple functions into a single chip, reducing component count, power consumption, and overall system complexity.

Technology: CMOS

The CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems, making the product energy-efficient and versatile.

Terminal Form: BALL

The ball terminal form simplifies the soldering process and enhances electrical connections, promoting reliable performance and reducing assembly time for the product.

Nominal Supply Voltage: 1.26 V

The precise nominal supply voltage ensures stable and consistent power delivery to the product, preventing voltage fluctuations and maintaining optimal performance.

Terminal Pitch: 0.65 mm

The fine terminal pitch facilitates high-density layout and compact design integration, enabling advanced circuitry and functionality in space-constrained applications.

Moisture Sensitivity Level (MSL): 3

The moderate moisture sensitivity level allows for safe handling and storage of the product, reducing the risk of moisture-related damage during manufacturing or transport.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AM4378BZDND80 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B491

JESD-609 Code:

e1

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

491

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA491,25X25,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.3 mm

Maximum Supply Voltage:

1.326 V

Minimum Supply Voltage:

1.21 V

Nominal Supply Voltage:

1.26 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

AM4378BZDND80 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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