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AM4379BZDNA80

Texas Instruments

AM4379BZDNA80 by Texas Instruments

AM4379BZDNA80 by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C, with a supply voltage range of 1.21V to 1.326V. This low-profile, fine-pitch GRID ARRAY package is ideal for industrial applications requiring high performance in compact spaces.

Median Price

$19.570

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 64 parts In-Stock

1+ parts

$15.670

100+ parts

$15.360

1k+ parts

$15.040

10k+ parts

-

64

$15.670

$15.360

$15.040

-

Texas Instruments

USA . 435 parts In-Stock

1+ parts

$19.570

100+ parts

$17.396

1k+ parts

$12.791

10k+ parts

-

435

$19.570

$17.396

$12.791

-

Mouser Electronics

USA . 7 parts In-Stock

1+ parts

$35.050

100+ parts

$24.520

1k+ parts

-

10k+ parts

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7

$35.050

$24.520

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 924 parts In-Stock

1+ parts

$18.592

100+ parts

-

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-

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924

$18.592

-

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Vyrian

USA . 5,764 parts In-Stock

1+ parts

-

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5,764

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,009 parts In-Stock

1+ parts

$17.613

100+ parts

-

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-

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3,009

$17.613

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-

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Corohmni

South Africa . 226 parts In-Stock

1+ parts

$23.320

100+ parts

-

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-

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226

$23.320

-

-

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Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$53.767

100+ parts

$48.928

1k+ parts

$44.089

10k+ parts

-

100

$53.767

$48.928

$44.089

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Microchip USA

USA . 2,946 parts In-Stock

1+ parts

$54.980

100+ parts

$54.200

1k+ parts

$53.800

10k+ parts

$53.410

2,946

$54.980

$54.200

$53.800

$53.410

Parana Technologies

USA . 1,996 parts In-Stock

1+ parts

$57.541

100+ parts

-

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1,996

$57.541

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DigiPath Technology Company

USA . 340 parts In-Stock

1+ parts

$63.360

100+ parts

-

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340

$63.360

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IDEA Electronic Components Group

UK . 786 parts In-Stock

1+ parts

$64.653

100+ parts

$61.420

1k+ parts

$58.188

10k+ parts

-

786

$64.653

$61.420

$58.188

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ChromeModa Solutions

Germany . 529 parts In-Stock

1+ parts

$64.653

100+ parts

$53.015

1k+ parts

-

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529

$64.653

$53.015

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QUARKTWIN TECHNOLOGY LTD

USA . 7,869 parts In-Stock

1+ parts

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7,869

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Kepictronics

USA . 2,000 parts In-Stock

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2,000

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Northwest PG Solutions

USA . 1,364 parts In-Stock

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1,364

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

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1,000

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Native Components

USA . 569 parts In-Stock

1+ parts

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569

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Metaverse IC Inc.

Canada . 211 parts In-Stock

1+ parts

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100+ parts

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211

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Overview

Looking for top-quality, reliable system on chip solutions? Look no further than the AM4379BZDNA80 by Texas Instruments. With a wide range of applications in other function microprocessors and peripheral ICs, this product offers unmatched performance and value to customers. Texas Instruments, known for their cutting-edge technology and innovative designs, has crafted a product that exceeds expectations. Say goodbye to technical headaches and hello to seamless operation with the AM4379BZDNA80. Trust Texas Instruments for all your system on chip needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are known for their durability and resistance to various environmental factors, making this product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 1.326 V

This high maximum supply voltage allows for flexibility in power input options, making the product suitable for a variety of applications.

Package Shape: SQUARE

The square package shape is compact and symmetrical, making it easy to integrate into circuits and ensuring a neat and organized layout.

No. of Terminals: 491

The large number of terminals provides ample connectivity options, allowing for versatile configurations and compatibility with various devices.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This packaging style offers efficient signal transmission with a low profile and fine pitch, enabling high-performance operation in a compact form factor.

Minimum Supply Voltage: 1.21 V

The low minimum supply voltage ensures efficient power consumption and minimizes heat generation, contributing to energy efficiency.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature allows the product to withstand challenging environmental conditions and maintain stable performance in various settings.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable functionality even in cold environments, expanding the product's usability range.

Terminal Finish: TIN SILVER COPPER

The combination of tin, silver, and copper terminal finish provides excellent conductivity, corrosion resistance, and solderability, ensuring long-lasting connectivity.

Terminal Position: BOTTOM

Bottom terminal position simplifies installation and maintenance processes, allowing for convenient access and efficient board layout.

Maximum Seated Height: 1.3 mm

The low maximum seated height minimizes the overall height of the product, enabling compact device designs and space-saving integration.

Width: 17 mm

The moderate width dimension offers a balanced size that is easy to handle during installation and compatible with standard circuit board layouts.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature reduces the risk of thermal damage to the product and ensures safe and reliable soldering processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability allows for efficient solder reflow processes, ensuring strong and durable connections for the product.

Length: 17 mm

The matching length dimension with the width provides a square form factor, promoting symmetry and uniformity in circuit board layouts.

Temperature Grade: INDUSTRIAL

The industrial temperature grade certification guarantees reliable performance in harsh industrial environments, making the product suitable for rugged applications.

Peripheral IC Type: SYSTEM ON CHIP

The system-on-chip design integrates multiple functionalities in a single chip, offering streamlined performance, reduced power consumption, and enhanced efficiency.

Technology: CMOS

Complementary metal-oxide-semiconductor technology ensures low power consumption, high speed, and reliable operation, making the product energy-efficient and dependable.

Terminal Form: BALL

The ball terminal form provides secure connections, high conductivity, and ease of soldering, enhancing the product's reliability and electrical performance.

Nominal Supply Voltage: 1.26 V

The nominal supply voltage specification ensures stable and consistent performance under standard operating conditions, enhancing the product's reliability.

Terminal Pitch: 0.65 mm

The fine terminal pitch allows for high-density packaging and precise signal routing, optimizing circuit board space utilization and enhancing overall functionality.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates a moderate level of sensitivity to moisture exposure, requiring standard handling procedures to maintain product quality.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AM4379BZDNA80 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B491

JESD-609 Code:

e1

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

491

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA491,25X25,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.3 mm

Maximum Supply Voltage:

1.326 V

Minimum Supply Voltage:

1.21 V

Nominal Supply Voltage:

1.26 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

AM4379BZDNA80 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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