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MCIMX6QP7CVT8AA

NXP Semiconductors

MCIMX6QP7CVT8AA by NXP Semiconductors

MCIMX6QP7CVT8AA by NXP Semiconductors is a SoC with CMOS technology, featuring 624 terminals in a grid array package. It operates b/w -40 to 105 °C and has a supply voltage range of 1.275V to 1.5V. Ideal for industrial applications requiring high performance and reliability.

Median Price

$107.879

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 60 parts In-Stock

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$139.830

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$108.520

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$108.520

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Verical

USA . 60 parts In-Stock

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$107.879

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$107.879

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Rochester

USA . 20 parts In-Stock

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$91.750

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$82.090

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$77.260

20

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$91.750

$82.090

$77.260

Distributors (In-Stock)

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Digiode

USA . 2,830 parts In-Stock

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$80.702

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Vyrian

USA . 4,661 parts In-Stock

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Flip Electronics

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Anansix

USA . 1,672 parts In-Stock

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Chip Stock

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Nova Conductors

Japan . 87 parts In-Stock

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Infinite Electronics LLP

India . 29 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 283 parts In-Stock

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$14.401

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Corohmni

South Africa . 653 parts In-Stock

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$46.515

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Semicontronic

India . 40 parts In-Stock

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$72.210

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$70.405

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$70.044

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40

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Corphita

USA . 1,409 parts In-Stock

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$76.455

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Aztec Data Supply Inc.

USA . 1,859 parts In-Stock

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$82.280

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Ampacity Inc.

Singapore . 40 parts In-Stock

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$157.160

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Microchip USA

USA . 2,331 parts In-Stock

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$171.720

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iodParts Technologies Inc.

India . 8,016 parts In-Stock

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Continental Prestige Electronics

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Authorized Procurement Solutions

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Argo Parts USA

USA . 3,533 parts In-Stock

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UNI Independent Distributors

Spain . 2,711 parts In-Stock

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Lixinc

USA . 2,590 parts In-Stock

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Robosynatics

Brazil . 1,163 parts In-Stock

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Lucentia Tech

USA . 1,163 parts In-Stock

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$15.321

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$15.009

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$15.009

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Bastille Electronics

Australia . 800 parts In-Stock

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Perfect Parts

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Kepictronics

USA . 346 parts In-Stock

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Overview

Discover unparalleled performance and reliability with the MCIMX6QP7CVT8AA by NXP Semiconductors. As a leader in semiconductor technology, NXP delivers top-notch quality and innovation in the realm of function uPs, uCs & Peripheral ICs. This cutting-edge product offers a wide range of applications, providing value and versatility to customers looking for superior solutions. Trust NXP to deliver unmatched benefits and advantages that will take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the IC, making it suitable for a variety of environments.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and resources during production.

Maximum Supply Voltage: 1.5 V

Provides flexibility and compatibility with a wide range of power sources.

Package Shape: SQUARE

Optimal shape for efficient use of space on the PCB, allowing for more compact designs.

No. of Terminals: 624

High number of terminals allows for connectivity to multiple components and peripherals, expanding the functionality of the IC.

Minimum Operating Temperature: -40 °C

Wide operating temperature range ensures performance reliability in extreme environments.

Maximum Seated Height: 2.16 mm

Low profile design is ideal for applications with limited space constraints.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall performance.

Nominal Supply Voltage: 1.4 V

Optimal voltage for efficient operation and power usage.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX6QP7CVT8AA attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B624

JESD-609 Code:

e1

Length:

21 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

624

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA624,25X25,32

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.16 mm

Maximum Supply Voltage:

1.5 V

Minimum Supply Voltage:

1.275 V

Nominal Supply Voltage:

1.4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

21 mm

Peripheral IC Type:

SoC

Trade Compliance

MCIMX6QP7CVT8AA Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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