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XCZU4CG-L1FBVB900I

Xilinx

XCZU4CG-L1FBVB900I by Xilinx

XCZU4CG-L1FBVB900I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has 900 terminals in a GRID ARRAY package style. Ideal for industrial applications requiring high performance at supply voltages ranging from 0.698V to 0.742V.

Median Price

$1,925.130

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Nova Conductors

Japan . 10 parts In-Stock

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AZTECH Wire

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Texas Native Microelectronics

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Kenton Components

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Modulus Dynamics

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Overview

Unlock the power of cutting-edge technology with the XCZU4CG-L1FBVB900I by Xilinx. This innovative product represents the pinnacle of quality and reliability that Xilinx is known for, making it a top choice for a wide range of applications in the category of Other Function uPs,uCs & Peripheral ICs. With its advanced features and high performance, this product offers unparalleled value and benefits to customers, providing a competitive edge in today's fast-paced market. Experience the advantages of Xilinx technology with the XCZU4CG-L1FBVB900I and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is known for its durability and resistance to heat and chemical damage, making it ideal for electronic components that need to withstand harsh environments.

Surface Mount: YES

Surface mount technology allows for a more compact design and easier assembly process, making the product more efficient and cost-effective.

Maximum Supply Voltage: 0.742 V

This low maximum supply voltage ensures safe operation and helps reduce power consumption, making the product more energy-efficient.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into existing circuit designs and ensures compatibility with standard packaging solutions.

No. of Terminals: 900

Having a high number of terminals provides flexibility in connecting to other components and peripherals, making the product versatile and compatible with various systems.

Package Style (Meter): GRID ARRAY

The grid array package style offers better thermal performance and electrical characteristics, improving overall reliability and performance of the product.

Minimum Operating Temperature: -40 °C

With a wide operating temperature range, this product can function in extreme cold conditions, making it suitable for diverse applications and environments.

Terminal Finish: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

This terminal finish provides excellent conductivity and resistance to corrosion, ensuring reliable electrical connections and long-term performance.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature minimizes the risk of thermal damage to the product during assembly, improving its overall quality and longevity.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The inclusion of a microprocessor circuit enhances the product's processing capabilities and enables advanced functionality, making it suitable for complex applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to efficient operation and reliable performance of the product.

Nominal Supply Voltage: 0.72 V

The nominal supply voltage ensures stable and consistent power delivery, essential for the proper functioning of the product and preventing damage to sensitive components.

Moisture Sensitivity Level (MSL): 4

With a moisture sensitivity level of 4, this product can withstand moderate exposure to moisture during storage and handling, increasing its reliability and shelf-life.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU4CG-L1FBVB900I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

Additional Features:

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

JESD-30 Code:

R-PBGA-B900

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

900

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.742 V

Minimum Supply Voltage:

.698 V

Nominal Supply Voltage:

.72 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU4CG-L1FBVB900I Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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