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XCZU4CG-2FBVB900I

Xilinx

XCZU4CG-2FBVB900I by Xilinx

XCZU4CG-2FBVB900I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance and reliability.

Median Price

$2,080.920

Lifecycle Status

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1k+

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Nova Conductors

Japan . 150 parts In-Stock

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VNN

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Digiode

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AZTECH Wire

Italy . 346 parts In-Stock

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$7.176

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One Stop Electronics

USA . 136 parts In-Stock

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Corohmni

South Africa . 276 parts In-Stock

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Semicontronic

India . 1,316 parts In-Stock

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$19.000

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$18.525

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$18.430

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Ampacity Inc.

Singapore . 1,289 parts In-Stock

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MARBEL Systems

Belgium . 731 parts In-Stock

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Texas Native Microelectronics

USA . 58 parts In-Stock

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Kenton Components

USA . 16,755 parts In-Stock

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Qasali Group International

UK . 50 parts In-Stock

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Modulus Dynamics

Lithuania . 1,050 parts In-Stock

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Supply Digital

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Vigor

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A-Z Elektronik GmbH

Germany . 491 parts In-Stock

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Corphita

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Netroflash

USA . 50 parts In-Stock

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$1,976.874

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$1,935.256

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Overview

Unlock endless possibilities with the XCZU4CG-2FBVB900I by Xilinx. This innovative product from a trusted manufacturer offers top-quality other function uPs, uCs & peripheral ICs, perfect for a wide range of applications. With its advanced technology and industrial-grade construction, this microprocessor circuit is designed to exceed expectations. Experience seamless performance, reliability, and versatility like never before. Elevate your projects with the XCZU4CG-2FBVB900I and unleash its value and benefits today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material helps to keep the product lightweight while providing adequate protection to the internal components.

Surface Mount: YES

Allows for easy and efficient installation on PCBs, saving time and effort during assembly.

Maximum Supply Voltage: 0.876 V

Provides a safe operating range for the product, preventing damage from overvoltage.

Package Shape: RECTANGULAR

Enables efficient use of space on the PCB and makes it easy to integrate into different electronic devices.

No. of Terminals: 900

Offers a high level of connectivity options, allowing for versatile applications and functionalities.

Package Style (Meter): GRID ARRAY

Facilitates a secure and stable connection with the PCB, enhancing overall reliability.

Minimum Supply Voltage: 0.825 V

Provides a wide operating range, ensuring compatibility with various power sources.

Maximum Operating Temperature: 100 °C

Can withstand high temperatures, making it suitable for industrial environments where heat may be a concern.

Minimum Operating Temperature: -40 °C

Capable of operating in extremely cold conditions, offering reliability in diverse environmental settings.

Terminal Finish: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Ensures durable and reliable connections between the product and the PCB, reducing the risk of signal loss or damage.

Terminal Position: BOTTOM

Simplifies the installation process and provides a clean and organized appearance on the PCB.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures that the product can be safely and efficiently soldered onto the PCB during assembly.

Peak Reflow Temperature °C: 245

Withstands high temperatures during the soldering process, maintaining the product's integrity.

Temperature Grade: INDUSTRIAL

Designed to meet the requirements of industrial applications, ensuring reliability and durability in challenging conditions.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Offers advanced processing capabilities, making the product suitable for complex computing tasks.

Technology: CMOS

Utilizes CMOS technology, known for low power consumption and high noise immunity, enhancing overall performance.

Terminal Form: BALL

Provides a secure and reliable connection with the PCB, minimizing the risk of signal interruptions or failures.

Nominal Supply Voltage: 0.85 V

Operates at an optimal voltage level, ensuring efficient performance and longevity of the product.

Moisture Sensitivity Level (MSL): 4

Withstands moderate levels of moisture exposure, suitable for a wide range of operating environments.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU4CG-2FBVB900I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B900

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

900

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU4CG-2FBVB900I Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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