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XCZU3CG-L2SFVA625E

Xilinx

XCZU3CG-L2SFVA625E by Xilinx

XCZU3CG-L2SFVA625E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-110 °C and has 625 terminals in a GRID ARRAY package style. Suitable for applications requiring high performance uPs/uCs & Peripheral ICs in various industries.

Median Price

$716.888

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 500 parts In-Stock

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$716.888

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Vyrian

USA . 4,167 parts In-Stock

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VNN

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Digiode

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One Stop Electronics

USA . 1,419 parts In-Stock

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$9.000

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Modulus Dynamics

Lithuania . 1,344 parts In-Stock

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$12.163

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AZTECH Wire

Italy . 797 parts In-Stock

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$15.361

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Ampacity Inc.

Singapore . 499 parts In-Stock

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$16.000

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Semicontronic

India . 1,474 parts In-Stock

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$25.000

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$24.375

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$24.250

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Aztec Data Supply Inc.

USA . 3,880 parts In-Stock

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$30.875

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MARBEL Systems

Belgium . 1,720 parts In-Stock

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$66.642

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$63.976

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Corohmni

South Africa . 50 parts In-Stock

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$71.392

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Texas Native Microelectronics

USA . 100 parts In-Stock

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$76.600

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$73.536

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$71.238

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Kenton Components

USA . 602 parts In-Stock

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$91.920

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$80.890

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Continental Prestige Electronics

USA . 5,142 parts In-Stock

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$702.550

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Argo Parts USA

USA . 4,003 parts In-Stock

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$716.888

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$709.719

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$702.550

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$695.381

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$709.719

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$695.381

Microchip USA

USA . 1,369 parts In-Stock

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$825.110

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Qasali Group International

UK . 3,685 parts In-Stock

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Supply Digital

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Netroflash

USA . 1,000 parts In-Stock

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$702.550

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$681.043

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$666.705

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Corphita

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Overview

Unlock a world of endless possibilities with the XCZU3CG-L2SFVA625E by Xilinx. This cutting-edge product offers unparalleled quality and reliability, thanks to its renowned manufacturer. Ideal for a wide range of applications in the Other Function uPs,uCs & Peripheral ICs category, this innovative technology provides customers with unmatched value, benefits, and advantages. Experience seamless performance and efficiency like never before with the XCZU3CG-L2SFVA625E.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers good protection for the internal components of the product, ensuring durability and reliability.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and improving overall product performance.

Maximum Supply Voltage: 0.742 V

High maximum supply voltage allows for flexibility in power requirements, making the product suitable for a variety of applications.

Package Shape: RECTANGULAR

Rectangular shape provides ease of integration into existing circuit designs, maximizing compatibility and space efficiency.

No. of Terminals: 625

Large number of terminals enable connectivity with multiple external components, expanding the product's functionality and versatility.

Package Style (Meter): GRID ARRAY

Grid array package style offers a compact and organized layout, facilitating easier PCB design and layout.

Minimum Operating Temperature: 0 °C

Wide operating temperature range ensures the product can perform reliably in various environments, increasing its overall usability.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Inclusion of a microprocessor circuit enhances the product's processing capabilities, enabling complex functions and tasks to be handled efficiently.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, contributing to the product's energy efficiency and reliability.

Nominal Supply Voltage: 0.72 V

Stable nominal supply voltage ensures consistent and reliable operation of the product, reducing the risk of malfunctions or errors.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU3CG-L2SFVA625E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

Additional Features:

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

JESD-30 Code:

R-PBGA-B625

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

625

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

250

Maximum Supply Voltage:

.742 V

Minimum Supply Voltage:

.698 V

Nominal Supply Voltage:

.72 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU3CG-L2SFVA625E Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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