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XC7Z035-2FBG676E

Xilinx

XC7Z035-2FBG676E by Xilinx

The Xilinx XC7Z035-2FBG676E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. With 676 terminals in a square grid array package, it's ideal for various applications requiring high-performance microprocessing capabilities.

Median Price

$1,913.690

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Mouser Electronics

USA . 3 parts In-Stock

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$1,913.690

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Digiode

USA . 426 parts In-Stock

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$1,558.000

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VNN

France . 375 parts In-Stock

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$1,640.000

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$1,640.000

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Nova Conductors

Japan . 10 parts In-Stock

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$1,705.450

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Vyrian

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Chip Stock

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AZTECH Wire

Italy . 276 parts In-Stock

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$7.507

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Corohmni

South Africa . 20 parts In-Stock

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$54.173

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Modulus Dynamics

Lithuania . 1,367 parts In-Stock

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$57.488

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Texas Native Microelectronics

USA . 120 parts In-Stock

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$116.966

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$112.287

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$108.778

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$102.930

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$102.930

Microchip USA

USA . 1,491 parts In-Stock

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$1,291.008

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One Stop Electronics

USA . 3 parts In-Stock

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Ampacity Inc.

Singapore . 3 parts In-Stock

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Semicontronic

India . 3 parts In-Stock

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$1,359.150

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$1,352.180

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Corphita

USA . 51 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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$1,671.341

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$1,604.487

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Qasali Group International

UK . 900 parts In-Stock

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$277.911

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Vigor

Singapore . 748 parts In-Stock

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Kenton Components

USA . 650 parts In-Stock

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Supply Digital

USA . 513 parts In-Stock

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MARBEL Systems

Belgium . 58 parts In-Stock

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Overview

Unleash the power of innovation with the XC7Z035-2FBG676E by Xilinx. This cutting-edge system on chip offers unparalleled quality and reliability, backed by the trusted name of Xilinx. Perfect for a wide range of applications in the Other Function uPs,uCs & Peripheral ICs category, this product delivers unmatched performance and efficiency. Experience seamless integration, enhanced functionality, and exceptional value with the XC7Z035-2FBG676E. Elevate your projects to new heights with this game-changing technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for the product, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 1.05 V

Higher maximum supply voltage tolerance allows for flexibility in power supply options and stability in operation.

Package Shape: SQUARE

Square package shape can facilitate compact and efficient PCB layout design, maximizing space efficiency in electronic devices.

No. of Terminals: 676

Large number of terminals allow for versatile connectivity options, enabling the product to interface with multiple components and peripherals.

Package Style (Meter): GRID ARRAY

Grid array package style offers reliable connections and efficient signal routing, enhancing overall performance of the product.

Minimum Supply Voltage: 0.95 V

Low minimum supply voltage requirement enables energy-efficient operation and extends battery life in portable devices.

Maximum Operating Temperature: 100 °C

High maximum operating temperature tolerance ensures reliability in harsh environments and enhances overall durability of the product.

Minimum Operating Temperature: 0 °C

Wide operating temperature range allows for consistent performance across varying temperature conditions, increasing the product's versatility.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout design and enhances thermal management, improving overall reliability of the product.

Maximum Seated Height: 2.54 mm

Low maximum seated height profile enables slim and compact device designs, enhancing aesthetics and portability.

Width: 27 mm

Moderate width dimension offers a balance between space efficiency and ease of handling during assembly and integration.

Length: 27 mm

Square package shape with equal length and width dimensions simplifies PCB layout design and offers symmetrical aesthetics in electronic devices.

Peripheral IC Type: SYSTEM ON CHIP

System-on-chip integration consolidates multiple functions into a single IC, reducing component count and board space requirements, enhancing overall system efficiency.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, contributing to energy-efficient and reliable operation of the product.

Terminal Form: BALL

Ball terminal form provides reliable connections and simplifies rework or reflow processes during PCB assembly, ensuring ease of maintenance and repair.

Nominal Supply Voltage: 1 V

Stable nominal supply voltage specification ensures consistent performance and reliable operation of the product, facilitating seamless integration into various electronic systems.

Terminal Pitch: 1 mm

Compact terminal pitch allows for high-density PCB layout designs, optimizing space usage and enabling efficient signal routing for enhanced overall system performance.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XC7Z035-2FBG676E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B676

Length:

27 mm

No. of Terminals:

676

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA676,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

2.54 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Trade Compliance

XC7Z035-2FBG676E Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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