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XC7Z035-2FFG676E

Xilinx

XC7Z035-2FFG676E by Xilinx

XC7Z035-2FFG676E by Xilinx is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage ranging from 0.95V to 1.05V. With 676 terminals in a grid array package, it's ideal for various applications requiring high-performance computing in compact spaces.

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Vyrian

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AZTECH Wire

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MARBEL Systems

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One Stop Electronics

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Texas Native Microelectronics

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Semicontronic

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Kenton Components

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Modulus Dynamics

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Overview

Unlock limitless possibilities with the XC7Z035-2FFG676E by Xilinx. Boasting superior quality and cutting-edge technology, this versatile System on Chip is a game-changer in the realm of Other Function uPs,uCs & Peripheral ICs. From enhancing performance to enabling seamless connectivity, this product delivers unmatched value to customers across various industries. Trust Xilinx to revolutionize your applications with innovation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and reliability to the product.

Surface Mount: YES

Being surface mount compatible allows for easy and convenient installation on circuit boards.

Maximum Supply Voltage: 1.05 V

The high maximum supply voltage capability allows for versatile power options.

Package Shape: SQUARE

The square shape is space-efficient and fits well within compact electronic designs.

No. of Terminals: 676

With a high number of terminals, this product can handle a complex array of connections and functions.

Package Style (Meter): GRID ARRAY

The grid array style facilitates easy connection and assembly within a circuit system.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage allows for efficient power consumption and operation at lower power levels.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature ensures reliable performance even in demanding environments.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for operation in a wide range of temperature conditions.

Terminal Position: BOTTOM

The terminal position at the bottom facilitates easy and secure connections within a circuit layout.

Maximum Seated Height: 3.24 mm

The low maximum seated height enables a slim and compact overall product design.

Width: 27 mm

The moderate width provides a balance between space-saving design and component functionality.

Length: 27 mm

The square shape with a length of 27mm allows for symmetrical and uniform design integration.

Peripheral IC Type: SYSTEM ON CHIP

Being a system on chip type of peripheral IC offers integrated functionality and efficient performance.

Technology: CMOS

The CMOS technology enables low power consumption and high-speed performance for the product.

Terminal Form: BALL

The terminal form of ball provides secure connections and reliable electrical conductivity.

Nominal Supply Voltage: 1 V

The nominal supply voltage at 1V offers a stable and consistent power source for the product.

Terminal Pitch: 1 mm

The small terminal pitch of 1mm allows for high-density packaging and efficient use of space on a circuit board.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XC7Z035-2FFG676E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B676

Length:

27 mm

No. of Terminals:

676

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA676,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

3.24 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Trade Compliance

XC7Z035-2FFG676E Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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